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JB/T6844-93

Catalog Datasheet MFG & Type PDF Document Tags

magnetic flow meter

Abstract: rotameter medicinechemistry petroleumlight and textile industries. Standards for this product are JB/T6844-93 and Q/YXBM , Allocation of piping flanges complies with JB/T81-94 (PN1.6, PN2.5)or JB/T82.294 (PN4.0, PN6.3) Power , accordance with standards JB/T81-94 and JB/T82.2-94. ·Work sheet for Model LZ Rotameter with metallic tube
Shanghai Automation Instrumentation
Original
magnetic flow meter rotameter flange DN65 PN16 Flange DIN PN25 LB830S Flow meter JB/T6844-93 JB/T81-94 JB/T82

27 21 121 8002

Abstract: har-link -APR-95 Dat. SC JB JB JB JB Noms Detail. 03-FEB-93 Insp. Stand. Dat. Name JB All Dim. in mn Or
-
OCR Scan
F-95972 27 21 121 8002 har-link 27 21 121 8000 EC01 27 21 121 8010 21115-JAN-10 21-JUN-01 D9-SEP-97 04-APR-95 03-FEB-93

3S110

Abstract: 12 x 12 fbga thermal resistance resistance), JC (junction-to-case thermal resistance), and JB (junction-to-board thermal resistance) values , Pin Count Package JA (° C/W) JA (° C/W) JA (° C/W) JA (° C/W) JB (° C/W) Still Air 100 ft , 4.4 1.67 3S260 1,152 Flip Chip FBGA 9.3 7.2 5.8 4.7 1.56 3S260 1,517 , provides JA (junction-to-ambient thermal resistance), JC (junction-to-case thermal resistance), and JB , ) JA (° C/W) JA (° C/W) JA (° C/W) JB (° C/W) Still Air 100 ft./min. 200 ft./min. 400 ft./min
Altera
Original
3S110 12 x 12 fbga thermal resistance BGA 64 PACKAGE thermal resistance 3S150 CHIP RESISTANCE TABLE FBGA 152

BS1580

Abstract: RH13 2 3 4 2009/07 2008/07 1426/99 1368/99 1111/93 876/89 AMENDMENTS 5 11.06.07 08.06.07 19.11.99 26.03.99 28.05.93 B.B. B.B. JB JB JB JB DATE NAME CLEAN MATERIAL
WEALD Electronics
Original
BS1580 RH13 RN003 21656 weald

LFXP2-8E

Abstract: LFXP2-40E 29 12 4x4mm 24 42 32 16 (Theta JB) 2 5x5mm 32 40 30 15 (Theta JB) 2 7x7mm 48 39 29 15 (Theta JB) 2 9x9mm PQFP/MQFP JC °C/W ­ SSOP JA (200lfm , .300 wide Package 64 38 27 14 (Theta JB) 2 ­ 28 105 80 25 14x20 mm , specific thermal value supercedes the generic package thermal data contained in this Table. 2. JB (JB = Junction-to-Board Thermal Resistance). JB value shown is only applicable when the package thermal pad is soldered
Lattice Semiconductor
Original
LFXP2-40E LFXP2-8E LFXP2-5E LFXP20C theta jc FCBGA Theta JB LFXP2-30E

DFJI

Abstract: 9?3-'@(004? 4VVS=>Aa # : A 0 :< 7LHZ[XLY V *EL;H I < ? =JG ;E< C ;G ? I 0 IHiKY , (> , = Y! , = Y! ,$ . JB H ;: : G 7? D9 JG G ;DI DHS[L +0 +* /+ .-0 *(00 0(0 CUPZ , =; 9?3-'@(004? ! ,B4 8 ?8 < ,> 4 9 2= 7I , \ Y! JDB ;H H EI >;G L? H ;H F;9 ? < ? ;: ?HXHTLZLX !EDI , * ,(/ ' ' ' ' -(/ + w; P ' ' ' +* ' *(+2 ' +* *(+33 `; " ' *(.3 ' " 9?3 , ( 1 2" 7D: ( # 1 " . JB H ; L? :I >1 b B ? C ? I ;: 8N , \&_Si 0 ;F;I ? I ? K ; 7K 7B 7D9 >; 9 7JH
Infineon Technologies
Original
DFJI
Abstract: 9?3-'@*/,4? 4VVS=>AB= # : A 0 :< 7LHZ[XLY V *EL;H I < ? =JG ;E< C ;G ? I 0 IH M , : G 7? D9 JG G ;DI A_TIVS 4VUKPZPVUY (> , = Y! , = Y! ,$ . JB H ;: : G 7? D9 JG G ;DI DHS[L 3 , u= 0 ;K F7=; 9?3-'@*/,4? ! ,B4 8 ?8 < ,> 4 9 2= 7I , \ Y! JDB ;H H , *(3. ' " 0 ;K F7=; 9?3-'@*/,4? ?HXHTLZLX A_TIVS 4VUKPZPVUY TPU% C9 ,8 , . JB H ; L? :I >1 b B ? C ? I ;: 8N , \&_Si 0 ;F;I ? I ? K ; 7K 7B 7D9 >; 9 7JH ;H 7: : ? I ? ED7B Infineon Technologies
Original
Abstract: REVISIONS ER KH 33827 04/23/92 N J 4 ^ O J , A M JB 11/21/91 11/22/91 DATE 11/22/91 W in c h e ste r Ele ctro n ic s 6 2 B a r n e s Indu , CN 33984 A MJB 0 6 / 11/92 CN KH 35273 A 01/06/93 CN 39816 C PMC 0 2 / 28/07 REVISED PER DMF304 , M JB " TE " " te te 11/21/91 11/22/91 11/22/91 S KINGS' tiV 'WINCHESTER VLS W in c -
OCR Scan
ER36216 D1710

63a52

Abstract: 654429D !)29L#24;2 3#16;F90#28;3 3#16;F93 3#16;,13 932A2$%K32 34D349AB2CD3#25;#24;#31;3F8#18;#19;7853 31#26; 31#26; 9#25;3#18;#22;)#22;3333333333 , F7#19;#18;#30;73478158#22;#25;#24;#30;73 3B2#22;#23;5+33 2D7.#26;3#21;5#24;#31;#18;#26;#18;5#24;3 9#18;#24;#18;#22;)#22;3 D2-#18;#30;#25;+3 9#25;3#18;#22;)#22;333333333 , #31; 2"6>29#23;#20;#21;#23;95E#25;9#23;2 72A2&>%2 7#24; ?&
IXYS
Original
63a52 654429D E82D 63A27 123456789ABC 1234567839AB2CD3E3F1 39AB2CD3 539AB2CD33 6845E 6E95E

GV285

Abstract: WB2F [daadl^c\ WZ[dgZ jh^c\1 MP5 GV9U?Ennpmv3 93;XE1 GV9U27S?Ennpmv3 :3:XE1 GV;U2M?Ennpmv3 938XE1 GV , `w rfc amslrcp _lb rfc pmr_pw clambcp UY6 93 Sjc_qc _qqck`jc mnnmqgrc u_w md rfc a_qc , ,AdjciZg2Q^bZgqLeZgVi^dc ^c Q^bZg qLeZgVi^dc ^c AdjciZg TWQ kmbc-Vgkcp. JB Ncw 8 JB Ncw 8 JB Ncw 8 , Mlnsr kmbc- . Vgkc p_lec JB JB icw1 TIUIV glnsr LRQ4 VS LRQ5 AKQ QJO R\Q , nmglr qfmsjb `c qcr rfc dgpqr bcagk_j nj_ac gl dslargml qcrrgle kmbc3 Rsrnsr kmbc- . . JB
-
Original
GV285 WB2F ZX 27s kd-153 RWV73 GCYK 839Y1 39XE1 GV9U27S1 IS2I2562589E

gore gsc

Abstract: ASTM-A-581 REVISIONS GSD I- .276 D. MAX (7.0 mm MAX.) ER 35201 VLS 12/03/93 I CN 36717 B ME 12/11/95 cn cn CD 1.89 REF, (48 mm) DET1491 NOTES: 1. FOR USE WITH 3.8 mm MAX. CABLE. 2. FOR CABLING INSTRUCTIOS SEE 3-584. 3. MATERIALS: INSULATORS: TEFLON, ASTM-D-4894 CENTER CONTACTS: BER. COP , ) APPROX SURFACE AREA Rtf: GORE GSC -12-2543-02 REV A SPLICE DRAWN DESIGN M JB owe 12/09/83 11/30/93 12/10/93 v ls VLS °*TE GSD ELECTRONICS CO . INC. TUCKAHOE. NEW YORK 10707
-
OCR Scan
ASTM-A-581 S30300 gore gsc GORE ASTM-A581 ASTM-B-196 MIL-G-45204 QQ-P-35

J1039

Abstract: . 16 9.2 Pmod Connector JB , . There are two 12-pin Pmod connectors on the UDB, labeled JA and JB. Each Pmod connector provides eight I , RD4/PMPWR RB14/PMPA1 GND VCC3V3 Pmod Connector JB Pmod Pin JB-1 JB-2 JB-3 JB-4 JB-5 JB-6 JB-7 JB-8 JB-9 JB-10 JB-11 JB-12 10 PIM Bus Pin J9-21, RG9 J9-27, RG8 J9-23, RG7 J9
Digilent
Original
J1039 J11-4 J11-3 CLK32K
Abstract: REVISIONS GSD O-J CO o ER 34920 MJB 09/07/93 CN 34969 E MJB 09/23/93 cn o NJ I CN 35194 A MJB 12/01/93 CN 35196 C MJB 12/02/93 ho o T _L DET1096 sca le 4:1 APPROX SURFACE AREA 755-86-5 ref: RAYTHEON 427466-1 REV. F PL, TPGP, BNC draw n MJB M JB dat e 09/24/92 09/24/93 DESK* APPR. o«e DATE GSD ELECTRONICS CO. INC. TUCKAHOE. NEW -
OCR Scan
M39012/16-0220 M17/113-RG316 MIL-STD-348 ASTM-D-1457 ZZ-R-765

INVERTER 50 kW

Abstract: ff200r33kf2c proIGBT/perIGBT Thermalresistance,casetoheatsink Paste=1W/(m·K)/grease=1W/(m·K) preparedby:JB , 255 93,0 max. 3,50 3,50 V V A A µC µC mJ mJ V A A kA²s kW µs PRQM ton min , ,casetoheatsink Paste=1W/(m·K)/grease=1W/(m·K) preparedby:JB approvedby:CL dateofpublication:2013-03-01 , kV V mm mm preparedby:JB approvedby:CL dateofpublication:2013-03-01 revision:2.0 3 , 0 50 100 150 200 IC [A] 250 300 350 400 preparedby:JB approvedby:CL
Infineon Technologies
Original
INVERTER 50 kW ff200r33kf2c FF200R33KF2C

ASTM-A-581

Abstract: gore gsc REVISIONS GSD I- .276 D. MAX (7.0 mm MAX.) PN I ER 35199 VLS 12/03/93 CN 36717 B ME 12/11/95 CD cn OJ 1.89 REF, (48 mm) DET1489 NOTES: 1. FOR USE WITH 3.0 mm MAX. CABLE. 2. FOR CABLING INSTRUCTIONS SEE 3-584. 3. MATERIALS: INSULATORS: TEFLON, ASTM-D-4894 CENTER CONTACTS: BER , (PLOT 4:1) APPROX SURFACE AREA REF: GORE GSC -12-2543-00 REV A SPLICE DRAWN M JB OW E 12/09/83 11/30/93 12/10/93 DESIGN v ls VLS »pps GSD ELECTRONICS CO . INC. TUCKAHOE
-
OCR Scan
me 4953
Abstract: 100/125A Plug IP67 16/20A and 30/32A A Cat. No. B inches mm inches mm 73 81 88 93 93 101 6.20 6.47 7.02 7.37 7.37 8.15 157 164 178 187 187 207 A B inches mm , 3.48 3.66 3.66 3.96 B 73 81 88 93 93 101 7.67 7.67 7.67 9.83 9.83 mm , 2.87 3.17 3.48 3.66 3.66 3.96 73 81 88 93 93 101 1.96 1.96 1.96 2.32 2.32 2.32 , 3.66 3.66 3.96 73 81 88 93 93 101 B inches mm 2.32 2.34 2.37 2.79 2.79 2.81 59 Thomas & Betts
Original
60/63A AA10L 20/30A JB3-B75 JB3-B100 JB6-B125

BT 1610

Abstract: 672-FBGA provides JA (junction-to-ambient thermal resistance), JC (junction-to-case thermal resistance), and JB , (° C/W) Pin JC (° C/W) Package JA Count Still Air 100 ft./min. 200 ft./min. 400 ft./min. JB , Air 100 ft./min. 200 ft./min. 400 ft./min. JB (° C/W) 484 FBGA 12.3 10.3 8.8 , 6.8 5.7 0.10 2.41 1,508 FBGA 9.3 7.4 6.1 5.0 0.10 2.24 780 FBGA , resistance), and JB (junction-to-board thermal resistance) values for Stratix II devices on a board with the
Altera
Original
EP2S15 EP2S30 EP2S60 EP2S90 EP2S180 BT 1610 672-FBGA FBGA 12x12 heat sink FBGA-484 datasheet JEDEC FBGA SII52010-4 EP2S130
Abstract: . Thermal resistance [5] R J-B 8.8 ºC /W Thermal resistance R J-C 7.2 ºC /W , of ï'±0.06V on forward voltage measurements [5], [6] R J-B is measured with a SSC metal core pcb.(25 , 3000 - K CRI Ra - 93 - - Forward Voltage [4] VF 3.0 3.25 4 V View Angle 2 1/2 124 deg. Thermal resistance [5] R J-B 8.8 ºC /W Thermal , [5], [6] R J-B is measured with a SSC metal core pcb.(25 ºC ï'£TJ ï'£ 110 ºC) R J-C is measured Seoul Semiconductor
Original
X10490 X42180-06 SSC-QP-7-07-24 X13X14

78 ball fbga thermal resistance

Abstract: FBGA1020 provides JA (junction-to-ambient thermal resistance), JC (junction-to-case thermal resistance), and JB , (° C/W) Pin JC (° C/W) Package JA Count Still Air 100 ft./min. 200 ft./min. 400 ft./min. JB , ./min. 200 ft./min. 400 ft./min. JB (° C/W) 484 FBGA 12.3 10.3 8.8 7.5 0.13 , 0.10 2.41 1,508 FBGA 9.3 7.4 6.1 5.0 0.10 2.24 780 FBGA 10.1 8.7 , provides JA (junction-to-ambient thermal resistance), JC (junction-to-case thermal resistance), and JB
Altera
Original
78 ball fbga thermal resistance FBGA1020 68 ball fbga thermal resistance FBGA PACKAGE thermal resistance FBGA-484 EP2SGX30 EP2SGX60 EP2SGX90 EP2SGX130 508-P

BT 1610

Abstract: FBGA 152 (junction-to-ambient thermal resistance), JC (junction-to-case thermal resistance), and JB (junction-to-board thermal , ) Package JA Count Still Air 100 ft./min. 200 ft./min. 400 ft./min. JB (° C/W) FBGA 13.1 , ./min. 400 ft./min. JB (° C/W) 484 FBGA 12.3 10.3 8.8 7.5 0.13 3.38 672 , 1,508 FBGA 9.3 7.4 6.1 5.0 0.10 2.24 780 FBGA 10.1 8.7 7.2 , (junction-to-ambient thermal resistance), JC (junction-to-case thermal resistance), and JB (junction-to-board thermal
Altera
Original
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