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Part : J-STD-020C Supplier : ELM Electronics Manufacturer : Chip One Exchange Stock : 8,584 Best Price : - Price Each : -
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J-STD-020C

Catalog Datasheet MFG & Type PDF Document Tags

J-STD-020C

Abstract: ipc 620 IPC/JEDEC J-STD-020C Table of Contents page Tested Flowchart 1 Tested Data before , after Reflow solder Process at maximum Temperature Profile as per IPC/JEDEC J-STD-020C Standard NO , Temperature Profile as per IPC/JEDEC J-STD-020C Standard NO 31 After 3th Reflow Process Visual Inspection after Reflow solder Process at maximum Temperature Profile as per IPC/JEDEC J-STD-020C Standard , Temperature Profile as per IPC/JEDEC J-STD-020C Standard NO 31 After 3th Reflow Process Visual
Tyco Electronics
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ipc 620 ipc 610 JSTD020C JORDAN 2N2411 ipc 502 2N-2411

2N2423

Abstract: 15029 IPC/JEDEC J-STD-020C Table of Contents Page Tested Flowchart 1 Tested Data before , Visual Inspection after Reflow solder Process at maximum Temperature Profile as per IPC/JEDEC J-STD-020C , maximum Temperature Profile as per IPC/JEDEC J-STD-020C Standard NO 31 After 3th Reflow Process , J-STD-020C Standard NO 31 After 3th Reflow Process 14 Visual Inspection after Reflow solder Process at maximum Temperature Profile as per IPC/JEDEC J-STD-020C Standard NO 31 After
Traco Electronic
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2N2423 15029 81121 81413 TES-2N 2N-2423

0853.12

Abstract: J-STD-020-C 40sec acc. to IPC/ JEDEC J-STD-020C < 5m at 20 mV > 3kV between L-N (50Hz; 1 min) > 4kV between L-N , Alloy Gold-Plated Copper Alloy Gold-Plated Copper Alloy Reflow Condition acc. to JEDEC J-STD-020C, Tp=240 +0/-5 °C, tp = 20-40 s acc. to JEDEC J-STD-020C, Tp=240 +0/-5 °C, tp = 20-40 s acc. to JEDEC J-STD-020C, Tp=240 +0/-5 °C, tp = 20-40 s acc. to JEDEC J-STD-020C, Tp=260 +0/-5 °C, tp = 20-40 s acc. to JEDEC J-STD-020C, Tp=260 +0/-5 °C, tp = 20-40 s acc. to JEDEC J-STD-020C, Tp=260 +0/-5 °C, tp = 20-40 s acc
SCHURTER
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0853.12 J-STD-020-C JEDEC J-STD-020c TRAY JEDEC j-std-033c 500VAC/DC E39328 250VAC
Abstract: . to IPC/ JEDEC J-STD-020C < 5 m at 20 mV > 3 kV (50 Hz; 1 min) > 4 kV between L-N > 10 M between , Thermoplastic Tin-Plated Copper Alloy acc. to JEDEC J-STD-020C, Tp=240 +0/-5 °C, tp = 20-40 s Bulk 128 , JEDEC J-STD-020C, Tp=240 +0/-5 °C, tp = 20-40 s Blister Tape 38 cm Reel (400 pcs.) 0031.8225 l Thermoplastic Tin-Plated Copper Alloy acc. to JEDEC J-STD-020C, Tp=240 +0/-5 °C, tp = 20-40 s Blister , . to JEDEC J-STD-020C, Tp=260 +0/-5 °C, tp = 20-40 s Bulk 128 x 91 x 60 mm (100 pcs.) 0031.8263 SCHURTER
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Abstract: '‰sec acc. to IPC/ JEDEC J-STD-020C < 5â'‰mΩ at 20 mV > 3â'‰kV (50â'‰Hz; 1 min) > 4â'‰kV between L-N , Thermoplastic Tin-Plated Copper Alloy acc. to JEDEC J-STD-020C, Tp=240 +0/-5 °C, tp = 20-40 s Bulk 128 , JEDEC J-STD-020C, Tp=240 +0/-5 °C, tp = 20-40 s Blister Tape 38 cm Reel (400 pcs.) 0031.8225 l Thermoplastic Tin-Plated Copper Alloy acc. to JEDEC J-STD-020C, Tp=240 +0/-5 °C, tp = 20-40 s Blister , . to JEDEC J-STD-020C, Tp=260 +0/-5 °C, tp = 20-40 s Bulk 128 x 91 x 60 mm (100 pcs.) 0031.8263 SCHURTER
Original
Abstract: '‰sec acc. to IPC/ JEDEC J-STD-020C < 5â'‰mΩ at 20 mV > 3â'‰kV (50â'‰Hz; 1 min) > 4â'‰kV between L-N , Thermoplastic Tin-Plated Copper Alloy acc. to JEDEC J-STD-020C, Tp=240 +0/-5 °C, tp = 20-40 s Bulk 128 , . to JEDEC J-STD-020C, Tp=240 +0/-5 °C, tp = 20-40 s Blister Tape 38 cm Reel (400 pcs.) 0031.8225 â l Thermoplastic Tin-Plated Copper Alloy acc. to JEDEC J-STD-020C, Tp=240 +0/-5 , Tin-Plated Copper Alloy acc. to JEDEC J-STD-020C, Tp=260 +0/-5 °C, tp = 20-40 s Bulk 128 x 91 x 60 mm SCHURTER
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smd fuse marking

Abstract: smd fuse marking 20 (acc. to JEDEC J-STD-020C), Tp=240 +0/-5 °C, tp = 20-40 s Bulk 128 x 91 x 60 mm(100 pcs.) 0031.8221 l Thermoplastic Tin-Plated Copper Alloy (acc. to JEDEC J-STD-020C), Tp=240 +0/-5 °C , Copper Alloy (acc. to JEDEC J-STD-020C), Tp=240 +0/-5 °C, tp = 20-40 s Blister Tray 266 x 173 mm(500 pcs.) 0031.8222 l Spec. Thermoplastic 2 Tin-Plated Copper Alloy acc. to JEDEC J-STD-020C , . Thermoplastic 2 Tin-Plated Copper Alloy acc. to JEDEC J-STD-020C, Tp=260 +0/-5 °C, tp = 20-40 s Blister
SCHURTER
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smd fuse marking smd fuse marking 20 fuse holder 5x20 fuse smd marking blue J-STD-020D JEDEC tray standard 13

smd fuse marking

Abstract: JEDEC J-STD-020c variants) 245°C / 3sec acc. to IEC 60068-2-58, Test Td 240 - 260°C / 20 - 40sec acc. to JEDEC J-STD-020C , Tin-Plated Copper Alloy (acc. to JEDEC J-STD-020C), Tp=240 +0/-5 °C, tp = 20-40 s Bulk 128 x 91 x 60 mm(100 pcs.) 0031.8221 l Thermoplastic Tin-Plated Copper Alloy (acc. to JEDEC J-STD-020C , Tin-Plated Copper Alloy (acc. to JEDEC J-STD-020C), Tp=240 +0/-5 °C, tp = 20-40 s Blister Tray 266 x , JEDEC J-STD-020C, Tp=260 +0/-5 °C, tp = 20-40 s Bulk 128 x 91 x 60 mm(100 pcs.) 0031.8263 l
SCHURTER
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8309 0031.8221 8326
Abstract: J-STD-020C, Tp=245 +0/-5 °C, tp = max. 30 s Bulk 128 x 91 x 60 mm (100 pcs.) 0031.8221 â l Thermoplastic Tin-Plated Copper Alloy acc. to JEDEC J-STD-020C, Tp=245 +0/-5 °C, tp = , Tin-Plated Copper Alloy acc. to JEDEC J-STD-020C, Tp=245 +0/-5 °C, tp = max. 30 s Blister Tray 266 x , J-STD-020C, Tp=260 +0/-5 °C, tp = max. 30 s Bulk 128 x 91 x 60 mm (100 pcs.) 0031.8263 l Spec. Thermoplastic Tin-Plated Copper Alloy acc. to JEDEC J-STD-020C, Tp=260 +0/-5 °C, tp = max SCHURTER
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J-STD-020C

Abstract: J-STD-020-C " Power Chokes Meets J-STD-020C The maximum soldering temperature for the models listed below has been revised to +250 °C, in accordance with J-STD-020C, Table 4-2, for components with a height greater than , design improvement allows an increase of the maximum soldering temperature to meet the JEDEC J-STD-020C , +250 °C maximum per J-STD-020C. · SDR1005, SDR1806, and SDR2207 (non-shielded) · SRR0804, SRR0805
Bourns
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SRR1003 SRR1005 SRR1806 SRR6603 J-STD020C JSTD-020C

J-STD-020-C

Abstract: J-STD-020C Temperature of "Oval Shaped" Power Chokes Meets J-STD-020C The maximum soldering temperature for the models listed below has been revised to +250 °C, in accordance with J-STD-020C, Table 4-2, for components with , meet the JEDEC J-STD-020C standard. All of the models listed that shipped after February 1, 2006 may be soldered at a temperature of +250 °C maximum per J-STD-020C. · SDR1005, SDR1806, and SDR2207
Bourns
Original
STD-020C

G029

Abstract: JESD22a121 rating per IPC/JEDEC JSTD-020C Table 5-2 and Figure 5 (See Appendix 3). Surface Mount Device (SMD) peak , /JEDEC J-STD-020C Table 4-1 and 4-2 (See Appendix 4). Pulse offers Sn100 or Sn alloy coatings on the , mount components, Pulse uses the peak solder temperature rating per J-STD-020C Table 5-2 and Figure 5 , to recertify that Pulse products meet the levels defined in the IPC/JEDEC J-STD-020C standard , : JEDEC J-STD-020C Table 5-2 "Classification Reflow Profiles" SN-Pb Eutectic Assembly Pb-Free
-
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G029 JESD22a121 J-STD-002B

JEDEC J-STD-020C

Abstract: JESD47 IPC/JEDEC J-STD-020C July 2004 Supersedes IPC/JEDEC J-STD-020B July 2002 JOINT INDUSTRY , . IPC/JEDEC J-STD-020C ASSOCIATION CONNECTING ELECTRONICS INDUSTRIES ® Moisture/Reflow Sensitivity , J-STD-020C Acknowledgment Members of the IPC Association Connecting Electronics Industries® IPC , , Plexus Corp. iii IPC/JEDEC J-STD-020C July 2004 This Page Intentionally Left Blank iv July 2004 IPC/JEDEC J-STD-020C Table of Contents 1 1.1 1.2 2 PURPOSE
-
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JESD47 Reliability Test Methods for Packaged Devices Infineon moisture sensitive package JESD-47 J-STD-035 JESD22-A120 IPC-J-STD-020 1-580987-46-X

J-STD-020C

Abstract: )Preheat RT (1)Ramp up t1 t2 Time Form-1Reference JEDEC J-STD-020C Table 5-2 IR reflow , -2 (Reference JEDEC J-STD-020C Table 4-1) 350mm3 350mm3 240 +0/-5ºC 225 +0/-5ºC , -3 (Referencre JEDEC J-STD-020C Table 4-2) 350mm 3 350mm3-2000mm3 2000mm3 260 +0/-5ºC 260 +0/-5ºC 260
Allied Components International
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AT06C10I IEEE802 100KH 2000V 06C10I

J-STD-020C

Abstract: JSTD020C Soldering Zone TL (2)Preheat RT (1)Ramp up t1 t2 Time Form-1Reference JEDEC J-STD-020C , Temperature" Form-2 (Reference JEDEC J-STD-020C Table 4-1) 350mm3 350mm3 240 +0 , Temperature" Form-3 (Referencre JEDEC J-STD-020C Table 4-2) 350mm 3 350mm3-2000mm3 2000mm3 260 +0
Allied Components International
Original

AT06C10I

Abstract: )Preheat (1)Ramp up t1 t2 Time IR reflow profile Form-1ï¼Reference JEDEC J-STD-020C Table , ' Form-2 (Reference JEDEC J-STD-020C Table 4-1) ≥ 350mm3 ï¼ 350mm3 240 +0/-5ºC 225 +0/-5ºC ï , -3 (Referencre JEDEC J-STD-020C Table 4-2) ï¼ 350mm 3 350mm3-2000mm3 > 2000mm3 260 +0/-5ºC 260 +0/-5ºC
Allied Components International
Original

12CrNi177

Abstract: Zestron Elektrische Kennwerte JEDEC J-STD-020C IP 67 [N] 1,8 ± 0,4 1,8 ± 0,4 Mechanische Mechanische Kennwerte , Lebensdauer (bei Nennschaltleistung) >100 10 >150 10 >150 10 >< 10 JEDEC J-STD-020C 245/5 Als Durchsteckund , ] Durchgangswiderstand, nach Lebensdauer [m ] max. , Ni -3 +2 um um Ni Au +2 um Au Au IP 40 JEDEC J-STD-020C 245/5 [W] 0,12 0,12 0,48 2,40
SCHURTER
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12CrNi177 Zestron

MSL Rating

Abstract: J-STD-020C Moisture Sensitivity Note Moisture/Reflow Sensitivity Classification(MSL),as defined in IPC/JEDEC Standard J-STD-020C, is not offered as part ofBournsresistive component standardproduct or packaging. J-STD-020C applies tononhermetic solid state surface mount devices and does not include passive resistive components. However, as a courtesy to frequent customer requests, Bourns resistive passive componentsmay be considered tobe compliant with an MSL = 1 rating. Bourns recommendsa maximum floor life of 4
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MSL Rating passive

IND1005-U

Abstract: dcmr J-STD-020C Optimized for all major transceiver ICs Industry standard footprint RoHS-compatible , MSL stands for Moisture Sensitivity Level and is specified in JEDEC J-STD-020C as well as the solder , toroid, case and potting (UL 94 V-0) Compliant with IPC/JEDEC J-STD-020C Compliant with IEEE 802.3 MSL , J-STD-020C Compliant with IEEE 802.3 MSL level 2 Auto MDIX capable RoHS-compatible Marking , -0) Compliant with IPC/JEDEC J-STD-020C Compliant with IEEE 802.3 MSL level 2 RoHS-compatible Marking
EPCOS
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IND1005-U dcmr B78476A8065A003 B78476 EPCOS 350 07 IND1005

JW Miller

Abstract: J-STD-020C Moisture Sensitivity Note Moisture/Reflow Sensitivity Classification (MSL), as defined in IPC/JEDEC Standard J-STD-020C, applies to non-hermetic, solid state, surface-mount devices and does not include inductive components. J-STD-020C imposes dry packaging for solid state components with an MSL greater than "1." Bourns®/JW Miller's chip inductors and power inductors may be considered to be compliant with an MSL = 2a rating, specifying a floor life of four (4) weeks under the conditions: 30 °C
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JW Miller JEDEC 2a Solid State Devices

lph 36

Abstract: Elektrische Kennwerte JEDEC J-STD-020C IP 67 [N] 1,8 ± 0,4 1,8 ± 0,4 Mechanische Mechanische Kennwerte , Lebensdauer (bei Nennschaltleistung) >100 10 >150 10 >150 10 >< 10 JEDEC J-STD-020C 245/5 Als Durchsteckund , ] Durchgangswiderstand, nach Lebensdauer [m ] max. , Ni -3 +2 um um Ni Au +2 um Au Au IP 40 JEDEC J-STD-020C 245/5 [W] 0,12 0,12 0,48 2,40
SCHURTER
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lph 36

TS-2165-01

Abstract: 25X0 Environmental Temperature Range: -40 °C . +105 °C Processing Temperature: max. 260 °C (Profile per J-STD-020C , Environmental Temperature Range: -40 °C . +105 °C Processing Temperature: max. 260 °C (Profile per J-STD-020C , Environmental Temperature Range: -40 °C . +105 °C Processing Temperature: max. 260 °C (Profile per J-STD-020C , Temperature Range: -40 °C . +105 °C Processing Temperature: max. 260 °C (Profile per J-STD-020C) Note , Environmental Temperature Range: -40 °C . +105 °C Processing Temperature: max. 260 °C (Profile per J-STD-020C
3M Interconnect Solutions
Original
TS-2165-01 25X0 40118 TS-2166-01 TS-2156-01 TS-2161-01

zestron

Abstract: 12CrNi177 Elektrische Kennwerte JEDEC J-STD-020C IP 67 [N] 1,8 ± 0,4 1,8 ± 0,4 Mechanische Mechanische Kennwerte , Lebensdauer (bei Nennschaltleistung) >100 10 >150 10 >150 10 >< 10 JEDEC J-STD-020C 245/5 Als Durchsteckund , ] Durchgangswiderstand, nach Lebensdauer [m ] max. , Ni -3 +2 um um Ni Au +2 um Au Au IP 40 JEDEC J-STD-020C 245/5 [W] 0,12 0,12 0,48 2,40
SCHURTER
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12CrNi177

Abstract: zestron JEDEC J-STD-020C 1,8 ± 0,4 1,8 ± 0,4 1,8 ± 0, 0,35 ± 0, > 10 > 10 IP 40 / IP 6 IR-Reflow , 67 (LPV/LPS/LPH) [°C/s] 260/3 JEDEC J-STD-020C 245/5 Kontaktmaterial Gold Lötwärmebeständigkeit , Kontaktmaterial Silber JEDEC JEDEC J-STD-020C JEDEC J-STD-020C 245/5 245/5 245/5 JEDEC J-STD-020C 245/5 JEDEC J-STD-020C J-STD-020C 245/5 Anschlüsse Umgebungstemperatur Lagertemperatur Umgebungstemperatur
SCHURTER
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X12CrNi X12CrNi177

UV-130A

Abstract: Talema free reflow level J-STD-020C Electrical Specifications @ 25°C Turns Ratio: Bold = IC Side Windings , : -40° to +85°C · fully RoHS compliant and meets lead free reflow level J-STD-020C Electrical , operating temperature -40° to +85°C · fully RoHS compliant and meets lead free reflow level J-STD-020C , level J-STD-020C Electrical Specifications @ 25°C Turns Ratio: Bold = IC Side Windings Surface , J-STD-020C Electrical Specifications @ 25°C Turns Ratio: Bold = IC Side Windings Surface Mount
Talema Nuvotem
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UF-130A UV-130A UMJ-192S UHF-230B PEB2095 AM2095 Talema PSB2196 ISO STANDARDS 1660 UMV-130B-172 PEB20590VIP/PEB20591VIP-8 TP3406
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