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Part : J-STD-020C Supplier : ELM Electronics Manufacturer : Chip One Exchange Stock : 8,584 Best Price : - Price Each : -
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J-STD-020B

Catalog Datasheet MFG & Type PDF Document Tags

SnPb36Ag2

Abstract: J-STD-020B components shipment in volume in 2003 Standardisation IPC/JEDEC J-STD-020B · In July 2002, IPC/JEDEC approved a new procedure for high temperature Pb-free soldering, known as J-STD-020B standard · J-STD-020B takes two families of packages into account: "small" packages, having a body volume < 350 , profiles are specified by J-STD-020B: a profile with peak at 250°C for "small" packages and a profile with , Standardisation IPC/JEDEC J-STD-020B · E3 procedures are conform with the J-STD-020B · Existing results
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SnPb36Ag2 Lead Free reflow soldering profile BGA lead-free solder joint reliability thermal cycle Infineon diffusion solder FeNi42-leadframe reflow temperature bga 2002/95/EC 3Q-4Q03 4Q03-2Q04 3Q03-4Q04 1Q03-1Q04 2Q03-2Q04

SOLDERABILITY TEST

Abstract: tested per IPC/JEDEC J-STD-020B â'Moisture/Reflow Sensitivity Classification for Nonhermetic Solid , , three cycles, five minutes between cycles, at 245° C per table 5.2 of J-STD-020B, using the lead-free , passed testing per IPC/JEDEC J-STD-020B, Level 1. The results are summarized in the table below , Number of Samples Number Pass Number Fail IPC/JEDEC J-STD-020B, Level 1 20 20 0 IPC/JEDEC J-STD-020B, Level 1 20 20 0 Contact resistance remained within specification
Grayhill
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SOLDERABILITY TEST MIL-STD-202 90HBW07P

JEDEC J-STD-020

Abstract: STMICROELECTRONICS MSL (IPC/JEDEC J-STD-020-B) that took into account the higher temperatures required for Lead-free board , . STMicroelectronics Surface Mount Lead-free Devices were qualified using the conditions defined in IPC/ JEDEC J-STD-020-B , processes and are all compliant with IPC/JEDEC J-STD-020-B . Compliance to newly released IPC/JEDEC J-STD
STMicroelectronics
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AN2033 JEDEC J-STD-020 STMICROELECTRONICS MSL an2033 st STMICROELECTRONICS MSL PACKAGES J-STD-020-A J-020B J-STD-020-C

JEDEC Code e3

Abstract: IEC-60068-2 remain MSL Level 1 (JEDEC J-STD-020B) · Easy to order by adding `-E3' to standard parts numbers , classification in accordance with JEDEC standard J-STD-020B. Qualification results will be available upon , profiles specified in J-STD-020B when released. In addition, all products will continue to meet the
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SC-75A SC-89 SSOT-23 QFN-16 JEDEC Code e3 IEC-60068-2 TO92S package E3 SOT MILITARY QUALIFIED DIP SWITCHES SC-70 TSOT-23

431ai

Abstract: J-STD-020B 311005J JSTD-020B JSTD-020B 2/27/2004 2/27/2004 3/26/2004 3/26/2004 25 22 Marking
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431AI-2-27-2004-93 MP180 S6431 431ai 84-1 LMI 3LD-SOT-89 84-1LMI bd6431 431AI BD6431/NX-PK 2004-RM-42

JEDEC J-STD-020B

Abstract: JEDEC MO-153 Pb-Free package per JEDEC J-STD-020B. Note 1: Surface mount packages are also available on Tape and Reel , (per JEDEC J-STD-020B). Device is available in Tape and Reel only. Note 3: "_NL" indicates Pb-Free product (per JEDEC J-STD-020B). © 2005 Fairchild Semiconductor Corporation DS011617
Fairchild Semiconductor
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74VHC14 VHC14 VHC04 74HC14 74VHC14M 74VHC14MX JEDEC J-STD-020B JEDEC MO-153 SCHMITT INVERTER MS-012

JEDEC J-STD-033A

Abstract: AMD Package moisture classify the moisture sensitivity of its products, AMD has adopted the IPC/JEDEC joint standard J-STD-020B , sensitivity of IC components. IPC/JEDEC Standard J-STD-020B. This test standard defines six different , steps. The only difference between each J-STD-020B flow is the parameters of the moisture soak step , /JEDEC J-STD-020B. DRY PACKING PROCESS AND MATERIALS The first step in the dry pack process is to
Advanced Micro Devices
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JEDEC J-STD-033A AMD Package moisture LBA399 F-1249 J-STD-033A MIL-I-18835

ESD test plan

Abstract: J-STD-020B Condition Start End S/S 2006-RM-33 2006-RM-32 545005AJ E545004AJ JSTD-020B JSTD-020B
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NT600H-10000 ESD test plan nt600 100C JESD78 S1972A BD1972A BI1972 SGQ1343 LX1972-2-24-2004-85Q

IMB03C

Abstract: IMB06CGR IEC 60058-2-58 and Signal Relays IPC/JEDEC J-STD-020B Recommended Soldering Conditions Packing , IM IEC and (Continued) - 60058-2-58 A/B Relay typical Full line: 20-40sec IPC/JEDEC J-STD-020B , forced cooling Soldering130°C conditions according IEC 60058-2-58 and IPC/JEDEC J-STD-020B 100°C 180°C 240°C 130°C 100°C Temperature °C 180°C 130°C 100°C Time (s) Time (s) 20-40sec IPC/JEDEC J-STD-020B
Tyco Electronics
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IMB03CGR IMB04CGR IMB06CGR IMB06CTS IMB03C IMB02C IMB Electronics 1462041-1 220VDC/250VAC 220VDC 125VDC 250VAC 125VAC 30VDC

7Z86

Abstract: 7z86 8 JEDEC J-STD-020B. Note 1: "_NL" indicates lead-free product (per JEDEC J-STD-020B). Note 2: "_NL" indicates lead-free product (per JEDEC J-STD-020B). Device is available in Tape and Reel only. TinyLogic
Fairchild Semiconductor
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NC7SZ86 NC7SZ86M5X MA05B NC7SZ86P5X 7Z86 7z86 8 NC7SZ86L6X MO-178 MAA05A

7Z00

Abstract: MO-178 JEDEC J-STD-020B. Note 1: "_NL" indicates lead-free product (per JEDEC J-STD-020B). Note 2: "_NL" indicates lead-free product (per JEDEC J-STD-020B). Device is available in Tape and Reel only. TinyLogic
Fairchild Semiconductor
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NC7SZ00 NC7SZ00M5X NC7SZ00M5 7Z00 NC7SZ00M5X-NL MO178 jedec MO-178 AB NC7SZ00L6X SC-88 MAC06A

7Z04

Abstract: SOT70 -Lead MicroPak, 1.0mm Wide 5k Units on Tape and Reel Pb-Free package per JEDEC J-STD-020B. Note 1: "_NL" indicates Pb-Free product (per JEDEC J-STD-020B). Device is available in Tape and Reel only. Note 2: "_NL" indicates Pb-Free product (per JEDEC J-STD-020B). TinyLogic£ is a registered trademark of Fairchild
Fairchild Semiconductor
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NC7SZ04 NC7SZ04M5X NC7SZ04P5X NC7SZ04P5 7Z04 SOT70 SOT70 Package dimensions SOT70 Package NC7SZ04L6X

J-STD-020B

Abstract: VSMF4720 0.5, tp = 100 µs tp = 100 µs Acc. figure 8, J-STD-020B J-STD-051, soldered on PCB SYMBOL VR , 2a, acc. to J-STD-020B. 200 max. 30 s 150 max. 100 s max. 120 s 100 max. ramp up 3 °C/s , Time (s) Fig. 8 - Lead (Pb)-free Reflow Solder Profile acc. J-STD-020B for Preconditioning acc. to
Vishay Semiconductors
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VSMF4720 VSMF4720-GS08 VSMF4720-GS18 J-STD-020 AEC-Q101 2002/96/EC

diode Sr 26

Abstract: UNIT V mA mA A mW °C °C °C °C K/W tp/T = 0.5, tp = 100 µs tp = 100 µs Acc. figure 8, J-STD-020B , , acc. to J-STD-020B. Temperature (°C) 200 max. 30 s 150 max. 120 s 100 50 0 0 50 100 150 200 250 , (Pb)-free Reflow Solder Profile acc. J-STD-020B for Preconditioning acc. to JEDEC, Level 2a TAPE
Vishay Semiconductors
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diode Sr 26 VSMG2720 VSMG2720-GS08 VSMG2720-GS18

7Z08

Abstract: SOT23 JEDEC package per JEDEC J-STD-020B. Note 1: "_NL" indicates lead-free product (per JEDEC J-STD-020B). Note 2: "_NL" indicates lead-free product (per JEDEC J-STD-020B). Device is available in Tape and Reel only
Fairchild Semiconductor
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NC7SZ08 NC7SZ08M5X NC7SZ08M5 7Z08 SOT23 JEDEC NC7SZ08P5X_NL SOT23-5 MARK R50 NC7SZ08P5X-NL

J-STD-020B

Abstract: VSMF4720 tp/T = 0.5, tp = 100 µs tp = 100 µs Acc. figure 8, J-STD-020B J-STD-051, soldered on PCB , < 30 °C, RH < 60 % Moisture sensitivity level 2a, acc. to J-STD-020B. 200 max. 30 s 150 max. 100 , acc. J-STD-020B for Preconditioning acc. to JEDEC, Level 2a DRYING In case of moisture absorption
Vishay Semiconductors
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74AC20

Abstract: 74AC20MTC . Specify by appending suffix letter "X" to the ordering code. Pb-Free package per JEDEC J-STD-020B. Note 1: "_NL" indicates Pb-Free package (per JEDEC J-STD-020B). Logic Symbol Connection Diagram
Fairchild Semiconductor
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74AC20 74AC20SC 74AC20SJ 74AC20MTC MTC14 74AC20PC AC20 MO-153

J-STD-020B

Abstract: VSMG2720 -May-09 TEST CONDITION tp/T = 0.5, tp = 100 µs tp = 100 µs Acc. figure 8, J-STD-020B J-STD , sensitivity level 2a, acc. to J-STD-020B. max. 30 s max. 120 s Devices are packed in moisture barrier , . J-STD-020B for Preconditioning acc. to JEDEC, Level 2a DRYING In case of moisture absorption
Vishay Semiconductors
Original

74LVX00

Abstract: 74LVX00M "X" to the ordering code. Pb-Free package per JEDEC J-STD-020B. Note 1: "_NL" indicates Pb-Free package (per JEDEC J-STD-020B). Device available in Tape and Reel only. Logic Symbol Connection
Fairchild Semiconductor
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74LVX00 LVX00 74LVX00M 74LVX00MX 74LVX00SJ 74LVX00MTC 74LVX00MTCX

7361

Abstract: JESD97 terminations. MSL PCT, LSR, MCT and TB series moisture sensitivity level per IPC/Jedec J-STD-020B is level 1. CGT series moisture sensitivity level per IPC/Jedec J-STD-020B is level 3. Visual standard Lead-free
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7361 JESD97

V23026C1057B201 2-1393774-7

Abstract: V23026-B1101-B201 J-STD-020B P1 V23026 Relay Recommended Soldering Conditions AXICOM P1 V23026 Relay P1 V23026 Relay , IPC/JEDEC J-STD-020B Full line: typical Dotted line: process limits Recommended Soldering Conditions , Soldering conditions according Recommended soldering conditions IEC 180 240°C °C IPC/JEDEC J-STD-020B 180 , conditions according IEC 60058-2-58 and 130 °C IPC/JEDEC J-STD-020B 130 °C 240 °C 100 °C 180 °C 130 °C 100
Tyco Electronics
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V23026A1002B201 V23026D1021B201 V23026F1051B201 V23026C1057B201 2-1393774-7 V23026-B1101-B201 V23026A1002B201 1393774-8 latching relays pcb set coil reset coil V23026A1001B201 1393774-1 V23026-D1025-B20 GR-1089 150VAC V23026A1006B201 V23026A1001B201 V23026A1005B201

J-STD-020B

Abstract: temperature range Soldering temperature Thermal resistance junction / ambient Acc. figure 8, J-STD-020B tp/T = , Figure 8. Lead (Pb)-free Reflow Solder Profile acc. J-STD-020B for Preconditioning acc. to JEDEC, Level , Sensitivity Level 2a, acc. to J-STD-020B. Figure 11. Tape Dimensions in mm for PLCC-2 Drying In case of
Vishay Semiconductors
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VSMG2700 VSMG2700-GS08 VSMG2700-GS18 D-74025

IMC06CGR

Abstract: IMC03 AXICOMÊSignalÊRelays Soldering conditions according IEC 60058-2-58 and Signal Relays IPC/JEDEC J-STD-020B Recommended , 20-40sec IPC/JEDEC J-STD-020B Dottedline: processlimits 240°C Recommended Soldering Conditions , J-STD-020B 100°C 180°C 240°C 130°C 100°C Temperature °C 180°C 130°C 100°C Time (s) Time (s) 20-40sec IPC/JEDEC J-STD-020B 240°C Packing Packing Tube for THT version 50 relays per tube 1,000 relays
Tyco Electronics
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IMC02TS IMC06CGR IMC03 IMC06C 14620428 IMC07 IMC01GR IMC01TS IMC02GR IMC03GR IMC03TS

AXICOM Relay v23026

Abstract: AXICOM V23026 12v reset coil. or reset c as set as Packing Recommended Soldering Conditions IPC/JEDEC J-STD-020B AXICOM P1 V23026 Relay Soldering conditions according IEC 60058-2-58 and IPC/JEDEC J-STD-020B , : Packing Packing Packing 130 °C Soldering conditions according IEC 60058-2-58 and IPC/JEDEC J-STD-020B , IPC/JEDEC J-STD-020B Resistance to soldering heat - Reflow profile Tape and 480 rela 2`400 pe
Tyco Electronics
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AXICOM Relay v23026 AXICOM V23026 12v AXICOM V23026 AXICOM Relay JEDEC SMT reflow profile axicom 12v relay V23026A1004B201 V23026B1106B201 V23026B1101B201 V23026B1105B201 V23026B1102B201 V23026C1056B201

V23026-C1051-B201

Abstract: V23026-A1001-B201 reset coil. or reset c as set as Packing Recommended Soldering Conditions IPC/JEDEC J-STD-020B AXICOM P1 V23026 Relay Soldering conditions according IEC 60058-2-58 and IPC/JEDEC J-STD-020B , : Packing Packing Packing 130 °C Soldering conditions according IEC 60058-2-58 and IPC/JEDEC J-STD-020B , /JEDEC J-STD-020B Resistance to soldering heat - Reflow profile Tape and 480 rela 2`400 pe
Tyco Electronics
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V23026-C1051-B201 V23026-A1001-B201 G0008 V23026-A1002-B201 1393776-3 1393776 V23026C1051B201 V23026C1057B201 V23026C1052B201 V23026C1054B201 V23026D1026B201 V23026D1025B201

IME06

Abstract: IME06GR and Signal Relays IPC/JEDEC J-STD-020B Recommended Soldering Conditions Packing Dimensions in , (Continued) - 60058-2-58 D/E Relay typical Full line: 20-40sec IPC/JEDEC J-STD-020B Dottedline: processlimits , Soldering130°C conditions according IEC 60058-2-58 and IPC/JEDEC J-STD-020B 100°C 180°C 240°C 130°C 100°C Temperature °C 180°C 130°C 100°C Time (s) Time (s) 20-40sec IPC/JEDEC J-STD-020B 240°C Packing Packing
Tyco Electronics
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IME03GR IME03TS IME06GR IME06 IME03 60w 250 IMD01GR IMD01TS IMD02GR IMD02TS IMD03GR IMD03TS
Abstract: Package (PDIP), JEDEC MS-001, 0.300" Wide Pb-Free package per JEDEC J-STD-020B. Note 1: Surface mount , code. Note 2: Â"_NLÂ" indicates Pb-Free product (per JEDEC J-STD-020B). Device is available in Tape and Reel only. Note 3: Â"_NLÂ" indicates Pb-Free product (per JEDEC J-STD-020B). #21; © 2010 Fairchild Semiconductor
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110-14M

13001 H

Abstract: 5VDC Telecom relay Soldering Conditions IPC/JEDEC J-STD-020B AXICOM Soldering conditions according IEC 60058-2-58 and IPC/JEDEC J-STD-020B Full line: typical P1 V23026 Relay Dotted line: process limits Recommended Soldering , J-STD-020B 130 °C Soldering conditions according IEC 60058-2-58 and IPC/JEDEC J-STD-020B 180 °C 100 °C
Tyco Electronics
Original
13001 H 5VDC Telecom relay V23026-C1052 AXICOM V23026-D1021-B201 V23026D1022B201 V23026D1024B201 V23026E1106B201 V23026E1101B201 V23026E1105B201 V23026E1102B201
Abstract: Soldering temperature Thermal resistance junction/ambient acc. figure 10, J-STD-020B tp/T 0.1, tp 10 µs , . J-STD-020B for Preconditioning acc. to JEDEC, Level 2a Component Cavity 94 8670 TTW Soldering 300 , : Floor life: 4 weeks Conditions: Tamb < 30 °C, RH < 60 % Moisture sensitivity level 2a, acc. to J-STD-020B Vishay Semiconductors
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VEMT4700 VSML3710 VEMT4700-GS08 VEMT4700-GS18
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