NEW DATABASE - 350 MILLION DATASHEETS FROM 8500 MANUFACTURERS
NEW DATABASE - 350 MILLION DATASHEETS FROM 8500 MANUFACTURERS
| Catalog Datasheet Results | Type | Document Tags |
| Abstract: qualification ROL0 according to ANSI/J-STD-004. 2. Solder paste with fine particles: powder particle size ... | Original |
11 pages, |
smd transistor marking 1B smd marking 2045 024 marking bidirectional diode st smd diode marking code ESDALC6V1-1BU2 ST0201 J-STD-004 datasheet abstract |
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| Abstract: SN63WRMAP3 WRMAP3, per QQ-S-571F/J-STD-004, Solder diameter .062 flux-rosin mildly activated Iron size: 175 watt ... | Original |
1 pages, |
J-STD004 780F solder sn63 j-std-004 QQ-S-571F SN63 QQ-S-571 J-STD-004 QQ-S-571F/J-STD-004 QQ-S-571F/J-STD-004 abstract |
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| Abstract: Halide-free flux qualification ROL0 according to ANSI/J-STD-004. Solder paste with fine particles: powder ... | Original |
10 pages, |
J-STD-004 EMIF08-LCD04M16 EMIF08-LCD04M16 abstract |
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| Abstract: : TYPE ROM1 per ANSI / J-STD-004. THERMAL INDICATOR: Fusible ring. 3. MELTABLE RINGS: Environment ... | Original |
1 pages, |
S200-3-W2-GA-CL RCPS-100-71 J-STD-004 SAE-AS22759 AS22759 J-STD-006 datasheet abstract |
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| Abstract: Technical Data Sheet C400TM C400TM October-2009 PRODUCT DESCRIPTION C400TM C400TM provides the following product characteristics: Technology Product Benefits IPC/J-STD-004 Classification Application Surface Finishes Cored solder wire · Halide free · No clean · Clear residue · Good wetting · Fast soldering · Heat stable · Mild odor · Pb-free and SnPb alloys available ROL0 Soldering - Cored wire , using SC-01TM SC-01TM cleaner. TDS C400TM C400TM, October-2009 RELIABILITY PROPERTIES J-STD-004 Solder spread ... | Original |
2 pages, |
SN63 SAC-387 C400 SAC387 solder SN60 SN62 C400TM EN29454-1 SAC305 SAC387 IPC-SF-818 C400TM abstract |
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| Abstract: speed 4. 4.3 Halide-free flux qualification ROL0 according to ANSI/J-STD-004. 2. Solder ... | Original |
9 pages, |
JESD97 J-STD-004 EMIF06-1502M12 EMIF06-1502M12 abstract |
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| Abstract: 4.2.5 ANSI/J-STD-005 ANSI/J-STD-005: Requirements for Soldering Pastes 4.2.6 ANSI/J-STD-004: Requirements for ... | Original |
12 pages, |
EL-97-12-057 B194 B122 J-STD-004 EIA-638 74219 BUS-03-601 ANSI-J-STD-002 J-STD-005 GES-12-100 GES-12-100 abstract |
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| Abstract: PREFORM WITH FLUX: SOLDER: TYPE Cd18 per ANSI J-STD-006 J-STD-006. FLUX: TYPE ROL1 per ANSI J-STD-004. 3. ... | Original |
1 pages, |
CD18 RT-1404 rcps-100-70 raychem solder sleeve D14-252 heat shrinkable sleeve J-STD-004 D1425 NAS-1745 raychem heat shrinkable sleeve thermofit D-142-51 J-STD-006 NAS 1745 D-142-50 D-142-51 D-142-50 abstract |
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| Abstract: J-STD-006 J-STD-006. FLUX: TYPE ROM1 per ANSI J-STD-004. 3. MELTABLE RINGS: Thermally stabilized thermoplastic. 4. ... | Original |
1 pages, |
MIL-W-81044/12 cables MIL-W-81044 J-STD-004 44A0111 raychem MIL-W-81044/12 J-STD-006 B-008-51 B-008-52 B-008-53 B-008-51 abstract |
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| Abstract: for B-008-11Qty. 1). SOLDER: TYPE Cd18 per ANSI J-STD-006 J-STD-006. FLUX: TYPE ROL1 per ANSI J-STD-004. 3. ... | Original |
1 pages, |
ansi-j-std-006 a solder wire B-008-13 D-5023 J-STD-004 B-008-11 thermofit RPIP-850-00 d 5023 J-STD-006 D5023 raychem RPIP-850-00 B-008-14 B-008-15 B-008-11 abstract |
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