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Part Manufacturer Description Datasheet BUY
HM1-65642B/883 Intersil Corporation 8KX8 STANDARD SRAM, 150ns, CDIP28 visit Intersil
24502BVA Intersil Corporation 1KX4 STANDARD SRAM, 120ns, CDIP18 visit Intersil
HM1-65642/883 Intersil Corporation 8KX8 STANDARD SRAM, 150ns, CDIP28, CERAMIC, DIP-28 visit Intersil
ISL6843IU-T Intersil Corporation Improved Industry-Standard Single-Ended PWM Controller; DFN8, MSOP8, SOIC8; Temp Range: See Datasheet visit Intersil Buy
8403606JA Intersil Corporation 2KX8 STANDARD SRAM, 70ns, CDIP24, CERAMIC, DIP-24 visit Intersil
HM1-6551/883 Intersil Corporation 256X4 STANDARD SRAM, 300ns, CDIP22, CERAMIC, DIP-22 visit Intersil

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Part : J-STD-020C Supplier : ELM Electronics Manufacturer : Chip One Exchange Stock : 8,584 Best Price : - Price Each : -
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J-STD-002B

Catalog Datasheet MFG & Type PDF Document Tags
Abstract: Process Systems, Inc. wetting beam balance in accordance with the method described in the IPC/JEDEC J-STD-002B4 , shown in Table 1. A key exception in this testing to IPC/JEDEC J-STD-002B was the solder pot , Conference, IEEE, pp 6-9. 4 IPC/JEDEC J-STD-002B specification â'" 4.3.1 Test E Wetting Balance Test , immersion speed: 25.4 mm/s immersion depth: 3 mm flux approved for J-STD-002B: Kester 182 (slightly , IPC/JEDEC J-STD-002B specification section 4.3.1 Wetting Balance Test) are: T0 - time to zero LSI Computer Systems
Original
10NOV04

SOLDERABILITY TEST

Abstract: /JEDEC J-STD-002B, Test Method A. The following two groups of DIP switches were used for the testing , Number Fail IPC/EIA/JEDEC J-STD-002B 20 20 0 IPC/EIA/JEDEC J-STD-002B 20 20 0 IPC/EIA/JEDEC J-STD-002B 20 20 0 IPC/EIA/JEDEC J-STD-002B 20 20 0 3. Process
Grayhill
Original
SOLDERABILITY TEST J-STD-020B MIL-STD-202 90HBW07P

J-STD-002B

Abstract: 32VAC -STD-202, Method 201A MIL -STD-202, Method 204D, Condition D IPC/EIC/JEDEC J-STD-002B, Condition D IEC , Resistance to Solder Heat IPC/EIC/JEDEC J-STD-002B, Condition B MIL-STD-202, Method 103B, Conditions D
Littelfuse
Original
32VAC E10480 R29862 EIA-481

marking CODE 001

Abstract: fuse 8A ± 0.200 [0.039 ± 0.008 1.63 + 0.1/-0.2 [0.064 + 0.004/-0.008] IPC/EIC/JEDEC J-STD-002B , IPC/EIC/JEDEC J-STD-002B, Condition B MIL -STD-202, Method 107G, Condition B Mechanical Shock
Littelfuse
Original
LR29862 marking CODE 001 fuse 8A 106G 204D 213B

Part marking

Abstract: , Condition D IPC/EIC/JEDEC J-STD-002B, Condition D Materials Moisture IPC/JEDEC J-STD-020C, Level 1 Sensitivity Level Solderability Humidity Resistance to Solder Heat IPC/EIC/JEDEC J-STD-002B, Condition B
Littelfuse
Original
Part marking
Abstract: -020C, Level 1 Sensitivity Level Mechanical Shock Vibration IPC/EIC/JEDEC J-STD-002B, Condition B , , Condition A Thermal Shock IEC 60127-4 IPC/EIC/JEDEC J-STD-002B, Condition D Part Marking System Littelfuse
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1206 footprint IPC

Abstract: 1206 footprint dimension Solderability - Wetting IPC/JEDEC J-STD-002B test B MIL-STD-202 Method 106G - Leaching IPC/JEDEC J-STD-002B test D - Resistance to Soldering Heat IEC 60068-2-58 PROCEDURE 1,000 hours at
Yageo
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PF1206 PF1206FRF7W0R01L 1206 footprint IPC 1206 footprint dimension RESISTOR footprint dimension RESISTOR FOOTPRINT 1206 Resistor dimensions 1206 to mm 0R005/ 0R01/ 0R015/ 0R02/ 0R025/

RESISTOR footprint dimension

Abstract: YAGEO CHIP RESISTORS MARKING 2 mm bending time: 60±5 seconds ±(1%+0.05) Solderability - Wetting IPC/JEDEC J-STD-002B , Well tinned (>95% covered) No visible damage -Leaching IPC/JEDEC J-STD-002B test D Solder
Yageo
Original
YAGEO CHIP RESISTORS MARKING RC yageo Yageo 01005 RC0100JR-0710RL Yageo part marking footprint dimension of resistors RC01005

smd jsp

Abstract: SN100C balance test method per J-STD-002B (Test Method F) with solder bath temperature of 263°C and a 2 , average wetting force of .20 mN/mm. · Metallization dissolution resistance ­ Per J-STD-002B (Test
RF Monolithics
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IPC-9701 SN100C IPC-A-610C smd jsp HASL 1250C

2010 SMD SURFACE RESISTANCE

Abstract: surface mount diode w1 / Bending IEC 60068-2-21 Solderability - Wetting IPC/JEDEC J-STD-002B test B -55/+125 °C Note , % + 0.0005) Well tinned (>95% covered) No visible damage - Leaching IPC/JEDEC J-STD-002B
Yageo
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2010 SMD SURFACE RESISTANCE surface mount diode w1 Yageo resistor 2010 APT2010 910M smd PT2010 PT2010FR-7W0R22L

1206 footprint IPC

Abstract: Wetting IPC/JEDEC J-STD-002B test B Electrical Test not required Magnification 50X SMD conditions , damage - Leaching IPC/JEDEC J-STD-002B test D Leadfree solder, 260 ° 30 seconds C, immersion
Yageo
Original
PE1206- PE1206 0R003

J-STD-002B

Abstract: Resistor-1w / Bending IEC 60068-2-21 Solderability - Wetting IPC/JEDEC J-STD-002B test B - Leaching IPC/JEDEC J-STD-002B test D - Resistance to Soldering Heat IEC 60068-2-58 MIL-STD-202 Method
Yageo
Original
TC100 PR2512FKF070R005L Resistor-1w smd code marking resistor smd marking 2D Reel Taping Specification JEDEC smd code marking 2D SMD resistors codes PR2512
Abstract: Moisture IPC/JEDEC J-STD-020C, Level 1 Sensitivity Level Solderability IPC/EIC/JEDEC J-STD-002B , , Condition D Dissolution of Metallization IPC/EIC/JEDEC J-STD-002B, Condition D Terminal Strength Littelfuse
Original
Abstract: , Condition D IPC/EIC/JEDEC J-STD-002B, Condition D IEC 60127-4 Materials Moisture IPC/JEDEC J-STD-020C, Level 1 Sensitivity Level Solderability Humidity Test Resistance to Solder Heat IPC/EIC/JEDEC J-STD-002B Littelfuse
Original

J-STD-002B

Abstract: Yageo 0805 resistor / Bending IEC 60068-2-21 Solderability - Wetting IPC/JEDEC J-STD-002B test B MIL-STD-202 Method 106G - Leaching IPC/JEDEC J-STD-002B test D - Resistance to Soldering Heat IEC
Yageo
Original
PT0805FR-7W0R22L Yageo 0805 resistor yageo smd 0805 thick film resistor PT0805FR J-STD002B 0.25w resistor 1/4 led(0805)r PT0805
Abstract: IPC/JEDEC J-STD-020C, Level 1 Sensitivity Level Solderability IPC/EIC/JEDEC J-STD-002B, Condition , , Condition D Dissolution of Metallization IPC/EIC/JEDEC J-STD-002B, Condition D Terminal Strength Littelfuse
Original

iec 60286

Abstract: , Method 204D, Condition D IPC/EIC/JEDEC J-STD-002B, Condition D IEC 60127-4 Moisture IPC/JEDEC J-STD , /EIC/JEDEC J-STD-002B, Condition B MIL-STD-202, Method 103B, Conditions D MIL-STD-202, Method 210F
Littelfuse
Original
iec 60286
Abstract: J-STD-002B, Condition B Humidity MIL-STD-202, Method 103B, Conditions D Resistance to Solder , J-STD-002B, Condition D Terminal Strength IEC 60127-4 Part Marking System Amp Code 1.54 Â Littelfuse
Original
Abstract: -020C, Level 1 Sensitivity Level Mechanical Shock Vibration IPC/EIC/JEDEC J-STD-002B, Condition B , , Condition A Thermal Shock IEC 60127-4 IPC/EIC/JEDEC J-STD-002B, Condition D Part Marking System Littelfuse
Original

thermal fuse Littelfuse

Abstract: ampere displays Humidity Test Resistance to Solder Heat Dimensions IPC/EIC/JEDEC J-STD-002B, Condition D , Vibration, High Frequency IPC/EIC/JEDEC J-STD-002B, Condition B MIL -STD-202, Method 213B
Littelfuse
Original
thermal fuse Littelfuse ampere displays
Abstract: /JEDEC J-STD-002B test B - Leaching IPC/JEDEC J-STD-002B test D - Resistance to Soldering Yageo
Original
PF0603- PF0603 1/10W

xmxx

Abstract: YAGEO DATE CODE /JEDEC J-STD-002B test B PROCEDURE Electrical Test not required Magnification 50X SMD conditions: 1st , J-STD-002B test D Leadfree solder, 260 °C, 30 seconds immersion time No visible damage -
Yageo
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xmxx YAGEO DATE CODE jedec 0402 EIA-96 YAGEO smd resistor 2010 footprint dimension 1K20 RE0402 RE1206 RE0603 RE0805

pf2512 YAGEO

Abstract: PF2512 / Bending IEC 60068-2-21 Solderability - Wetting IPC/JEDEC J-STD-002B test B -Leaching , : 3±0.5 seconds Well tinned (>95% covered) No visible damage IPC/JEDEC J-STD-002B test D
Yageo
Original
PF2512 pf2512 YAGEO YAGEO PF2512 2w SMD CODE MARKING pf2512fkf7w0r smd transistor 2d PF2512FKF7W0R01L
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