NEW DATABASE - 350 MILLION DATASHEETS FROM 8500 MANUFACTURERS
NEW DATABASE - 350 MILLION DATASHEETS FROM 8500 MANUFACTURERS
| Catalog Datasheet Results | Type | Document Tags |
| Abstract: Solderability: J-STD-002 · Vibration: JESD22-B103 JESD22-B103 · Solvent Resistance: JESD22-B107 JESD22-B107 · Resistance to Soldering , ) · Solderability: J-STD-002( RoHS package ) · Terminal Strength: MIL-STD-883 MIL-STD-883 Method 2004 · ... | Original |
3 pages, |
smd transistor LY J-STD-002 test A crystal smd jstd 002 resistance to soldering heat J-STD-020C saronix 33.0000 SARONIX RoHS SMD CRYSTAL Ceramic smd diode ED JESD22-A113 JESD22B103 JESD22-A109 20MHz Crystal SMD datasheet abstract |
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| Abstract: 175-103LAE-301 175-103LAE-301 Discrete Thermistors (Home : Products) 175 Series, surface mounted device 1206, 10,000 Ohm resistance, ±3.0% tolerance, 25/85 BETA = 3750 Actual product appearance may vary. Description 173 Series and 175 Series Thermistors are designed to be mounted using robotics onto rigid or flexible PC boards. They are particularly suited for PC boards with a high density of discrete components. The solder-plated, nickel barrier terminations are easily soldered and meet ANSI/J-STD-002 Method B. ... | Original |
1 pages, |
J-STD-002* Method B 175-103LAE-301 J-STD-002 175-103LAE-301 abstract |
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| Abstract: 173-103LAD-301 173-103LAD-301 Discrete Thermistors (Home : Products) 173 Series, surface mounted device 0805, 10,000 Ohm resistance, ±2.0% tolerance, 25/85 BETA = 3750 Actual product appearance may vary. Description 173 Series and 175 Series Thermistors are designed to be mounted using robotics onto rigid or flexible PC boards. They are particularly suited for PC boards with a high density of discrete components. The solder-plated, nickel barrier terminations are easily soldered and meet ANSI/J-STD-002 Method B. ... | Original |
1 pages, |
173-103LAD-301 173-103LAD-301 abstract |
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| Abstract: (Test LTWI-1119 LTWI-1119 & ANSI/JSTD-002) < 0.10 mm Solderability (Test MIL-STD-202 MIL-STD-202 Method 208) >99 % ... | Original |
2 pages, |
MIL-STD-202 METHOD 208 ltwi-1119 LTIES-125 EMI gaskets jstd 002 J-STD-002 LTES461 BMIS-202 ASTM B571 EIA 481 BMIS-202 abstract |
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| Abstract: Packaging EIA-481 EIA-481 Co-planarity (Test LTWI-1119 LTWI-1119 & ANSI/JSTD-002) < 0.10 mm Solderability (Test ... | Original |
2 pages, |
NEC IEI-620 LTWI-1119 EMI gaskets LTES461 BMIS-201 BMIS-201 abstract |
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| Abstract: Tin Packaging EIA-481 EIA-481 Co-planarity (Test LTWI-1119 LTWI-1119 & ANSI/JSTD-002) < 0.10 mm ... | Original |
2 pages, |
LTWI-1119 EMI gaskets LTES461 BMIS-203 ASTM B571 BMIS-203 abstract |
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| Abstract: 173-502GAF-301 173-502GAF-301 Discrete Thermistors (Home : Products) 173 Series, surface mounted device 0805, 5,000 Ohm resistance, ±5.0% tolerance, 25/85 BETA = 3550 Actual product appearance may vary. Description 173 Series and 175 Series Thermistors are designed to be mounted using robotics onto rigid or flexible PC boards. They are particularly suited for PC boards with a high density of discrete components. The solder-plated, nickel barrier terminations are easily soldered and meet ANSI/J-STD-002 Method B. ... | Original |
1 pages, |
173-502GAF-301 173-502GAF-301 abstract |
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| Abstract: 175-503LAG-301 175-503LAG-301 Discrete Thermistors (Home : Products) 175 Series, surface mounted device 1206, 50,000 Ohm resistance, ±10.0% tolerance, 25/85 BETA = 4000 Actual product appearance may vary. Description 173 Series and 175 Series Thermistors are designed to be mounted using robotics onto rigid or flexible PC boards. They are particularly suited for PC boards with a high density of discrete components. The solder-plated, nickel barrier terminations are easily soldered and meet ANSI/J-STD-002 Method B. ... | Original |
1 pages, |
175-503LAG-301 175-503LAG-301 abstract |
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| Abstract: 175-502GAF-301 175-502GAF-301 Discrete Thermistors (Home : Products) 175 Series, surface mounted device 1206, 5,000 Ohm resistance, ±5.0% tolerance, 25/85 BETA = 3550 Actual product appearance may vary. Description 173 Series and 175 Series Thermistors are designed to be mounted using robotics onto rigid or flexible PC boards. They are particularly suited for PC boards with a high density of discrete components. The solder-plated, nickel barrier terminations are easily soldered and meet ANSI/J-STD-002 Method B. ... | Original |
1 pages, |
175-502GAF-301 175-502GAF-301 abstract |
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| Abstract: 173-473LAF-301 173-473LAF-301 Discrete Thermistors (Home : Products) 173 Series, surface mounted device 0805, 47,000 Ohm resistance, ±5.0% tolerance, 25/85 BETA = 4150 Actual product appearance may vary. Description 173 Series and 175 Series Thermistors are designed to be mounted using robotics onto rigid or flexible PC boards. They are particularly suited for PC boards with a high density of discrete components. The solder-plated, nickel barrier terminations are easily soldered and meet ANSI/J-STD-002 Method B. ... | Original |
1 pages, |
173-473LAF-301 173-473LAF-301 abstract |
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| Abstract: Tin Packaging EIA-481 EIA-481 Co-planarity (Test LTWI-1119 LTWI-1119 & ANSI/JSTD-002) < 0.10 mm ... | Original |
2 pages, |
LTES461 EMI gaskets ASTM B571 BMIS-205 BMIS-205 abstract |
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| International Rectifier - General Product Information - Automotive Solutions International Rectifier, Auto, Automotive Solutions, Power Semiconductor International Rectifier - General Product Information - Automotive Solutions Quality Systems Q101 - Procedure For Qualification Testing Document Q101 defines the minimum st www.datasheetarchive.com/files/international-rectifier/docs/wcd00001/wcd001f8.htm |
International Rectifier | 06/10/1998 | 9.49 Kb | HTM | wcd001f8.htm |