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Part Manufacturer Description Datasheet BUY
TPS62134DRGTR Texas Instruments 17-V Input, Step-down Converter with Low Power Mode Input for Intel SkyLake Platform 16-VQFN -40 to 85 visit Texas Instruments Buy
TPS51624RSMR Texas Instruments 4.5V to 28V, 1/2-Phase Step-Down Driverless Controller for Intel VR12.6 CPUs 32-VQFN -40 to 105 visit Texas Instruments
TPS51624RSMT Texas Instruments 4.5V to 28V, 1/2-Phase Step-Down Driverless Controller for Intel VR12.6 CPUs 32-VQFN -40 to 105 visit Texas Instruments Buy
TPS62134BRGTT Texas Instruments 17-V Input, Step-down Converter with Low Power Mode Input for Intel SkyLake Platform 16-VQFN -40 to 85 visit Texas Instruments
TPS62134ARGTR Texas Instruments 17-V Input, Step-down Converter With Low Power Mode Input for Intel SkyLake Platform 16-VQFN -40 to 85 visit Texas Instruments Buy
TPS62134ARGTT Texas Instruments 17-V Input, Step-down Converter With Low Power Mode Input for Intel SkyLake Platform 16-VQFN -40 to 85 visit Texas Instruments

Intel SO Package

Catalog Datasheet MFG & Type PDF Document Tags

ixp425

Abstract: IXP42X support package, but is NOT a configurable option, so modifications are required in non-Coyote gateway , Reference Board." } package CYGPKG_DEVS_ETH_ARM_NEW425_I82559 { alias { "NEW425 / Intel 82559 ethernet , NEW425_i82559_eth_driver.cdl description "Ethernet driver for NEW425 with Intel 82559 PCI NIC." } package , Intel®IXP42X Product Line of Network Processors and IXC1100 Control Plane Processor: Customizing , IS PROVIDED IN CONNECTION WITH INTEL® PRODUCTS. NO LICENSE, EXPRESS OR IMPLIED, BY ESTOPPEL OR
Intel
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ixp425 IXDP425 IXP400 i8255 IXCDP1100 intel DOC

PCM45F

Abstract: ECC-00177-01-GP Dimensions (3D View) Dual-Core Intel® Xeon® processor LV and ULV Thermal Design Guide 9 Package , Package Dual-Core Intel® Xeon® processor LV and ULV Thermal Design Guide 13 Package Information , capacity without a thermal solution is also limited, so Intel recommends the use of a heatsink for all , may be available in the Dual-Core Intel® Xeon® processor LV and ULV Datasheet. 4.2 Package , thickness of the TIM between the heatsink and device package. Dual-Core Intel® Xeon® processor LV and
Intel
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PCM45F ECC-00177-01-GP EEP-N41CS-I1-GP cpu socket mPGA479m heatsink thermal test vehicle -intel

Intel Express 550T Routing Switch

Abstract: ES550T management package (bundled 256K buffer. For general network free with every Intel switch). traffic, this , . monitoring, and so on), but use to add a Stack Interface modThe Intel Express also the switch's Layer 3 , dropped packets. Intel is working on this problem, so look for an upgrade soon. In fact, the ES550T/F , WHAT TO BUY, HOW TO BUY IT .Intel Express 550T Routing Switch C O M P A N Y .Intel Corp. Hillsboro, OR; 800-538-3373, 503-264-7354
Computer Shopper
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NP1505 Intel Express 550T Routing Switch ES550T 8930

intel edison

Abstract: Intel® Edison Board Support Package Release Notes September 2014 Revision ww37 Document , information. INFORMATION IN THIS DOCUMENT IS PROVIDED IN CONNECTION WITH INTEL PRODUCTS. NO LICENSE, EXPRESS , DOCUMENT. EXCEPT AS PROVIDED IN INTELâ'™S TERMS AND CONDITIONS OF SALE FOR SUCH PRODUCTS, INTEL ASSUMES NO LIABILITY WHATSOEVER AND INTEL DISCLAIMS ANY EXPRESS OR IMPLIED WARRANTY, RELATING TO SALE AND/OR USE OF INTEL PRODUCTS INCLUDING LIABILITY OR WARRANTIES RELATING TO FITNESS FOR A PARTICULAR PURPOSE
Intel
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intel edison EDISON-1497 EDISON-1487 EDISON-1134 GPIO131 GPIO130 EDISON-1482

Intel 1702 eprom

Abstract: 1702 eprom so named because the intel channel is comprised of negatively charged carriers. CMOS or , evolutionary so that development time of new processes and products can be reduced without compromising Intel , in tei Intel Memory Technologies Aprii 1994 Order Number: 296102-003 Intel Memory , .2-13 2 I 2-7 INTEL MEMORY TECHNOLOGIES Most of this handbook is devoted to techniques and , majority of memory devices manufactured at Intel. There are three major MOS technology families- PMOS
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OCR Scan
Intel 1702 eprom 1702 eprom intel 1103 ram intel 1702 chemical reactor 1702 INTEL

honeywell pcm45

Abstract: mpga479 Applications 9 Intel® CoreTM Duo processor-Package Information 2 Package Information The Intel , . Intel® CoreTM Duo processor on 65 nm process for Embedded Applications 10 TDG Package Information-Intel® CoreTM Duo processor Figure 2. Micro-FCPGA Package (Sheet 1 of 2) TDG Intel® CoreTM , Information Figure 3. Micro-FCPGA Package (Sheet 2 of 2) Intel® CoreTM Duo processor on 65 nm process , . Micro-FCBGA Package (Sheet 1 of 2) TDG Intel® CoreTM Duo processor on 65 nm process for Embedded
Intel
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honeywell pcm45 mpga479 INTEL embedded processors Core 2 duo pcm45 intel core 2 duo L2400

APD -25dbm 10ghz

Abstract: APD 10ghz Intel® LXT16785 version is assembled in a 132 ball BGA plastic package with signal pins compatible to , product brief ® Intel LXT16784/LXT16785/LXT16795 MUX/DeMUX Chipset Product Description Intel Internet Exchange Architecture ® The Intel® LXT16784, LXT16785, and the LXT16795 form a , test equipment. The Intel® LXT16784/85/95 chipset is manufactured using a well-proven silicon bipolar , Dissipation: 1.4W s High integration s 132 PBGA Package s Small physical form factor (13
Intel
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STM-64 APD -25dbm 10ghz APD 10ghz GD16585 g.709 ONTO DEMUX GD16589 OC-192 LXT16785/95 USA/0401/5K/ASI/DC

GMA3150

Abstract: bios chip AMI Pineview Boards [ X7SPE -H ] Key Features Links & Resources 1. Intel® AtomTM D510 (Pineview-D) (DMI) 2. Intel® ICH9R Chipset 3. Up to 4GB single channel unbuffered, non-ECC DDR2 667MHz SO - DIMM 4. 2x Intel , Platform 8. Integrated Intel GMA3150 Video Tested Memory List Motherboard Manual Update Your BIOS Download , sockets Supports up to 4 GB of unbuffered, non-ECC DDR2 667MHz SO - DIMM (Single Channel) DDR2 667MHz unbuffered, non -ECC SO-DIMM 256 MB, 512 MB, 1 GB, 2GB 1.8V only Intel ® AtomTM D510 processor DMI FlexATX
Super Micro Computer
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bios chip AMI intel 82574l AMI eeprom bios ICH9R ddr2 ram voltage chart AMI 8mb flash 667MH 82574L CBL-0044L

GD16585

Abstract: GD16589 available: s The Intel® LXT16749 version is assembled in a 132 ball BGA plastic package with signal , product brief ® Intel LXT16748/LXT16749/LXT16759 MUX/DeMUX Chipset Product Description Intel Internet Exchange Architecture The Intel® LXT16748, LXT16749, and LXT16759 form a , fiber-optic test equipment. The Intel® LXT16748/49 chipset is manufactured using well-proven silicon bipolar , 12.5Gbit/s chipset can be used with the Intel® IXF30007 (EFEC) to provide 9dB system sensitivity
Intel
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INTEL CLOCK AND DATA RECOVERY serial parallel transport stream LXT16749/59

0x199

Abstract: On Deadlock Problem of On-Chip Buses Supporting Out-of-Order Transactions Intel® Xeon® Processor 7500 Series Datasheet, Volume 2 March 2010 Order Number: 323341-001 INFORMATION IN THIS DOCUMENT IS PROVIDED IN CONNECTION WITH INTEL® PRODUCTS. NO LICENSE, EXPRESS OR IMPLIED , PROVIDED IN INTEL'S TERMS AND CONDITIONS OF SALE FOR SUCH PRODUCTS, INTEL ASSUMES NO LIABILITY WHATSOEVER, AND INTEL DISCLAIMS ANY EXPRESS OR IMPLIED WARRANTY, RELATING TO SALE AND/OR USE OF INTEL PRODUCTS , INFRINGEMENT OF ANY PATENT, COPYRIGHT OR OTHER INTELLECTUAL PROPERTY RIGHT. Intel products are not intended for
Intel
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0x199 On Deadlock Problem of On-Chip Buses Supporting Out-of-Order Transactions 0x19B INTEL nehalem CPU

29f400 psop

Abstract: 28Fx00 's pinout, so there is no pin conflict, but since this feature is not supported on the Intel device, it , E AP-643 APPLICATION NOTE Designing Flexible Sockets for Intel® Boot Block Flash Memories , Intel products. No license, express or implied, by estoppel or otherwise, to any intellectual property rights is granted by this document. Except as provided in Intel's Terms and Conditions of Sale for such products, Intel assumes no liability whatsoever, and Intel disclaims any express or implied warranty
Intel
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29f400 psop 28Fx00 AMD marking CODE flash 28F400B5 29LV160 amd 29f200 CG-041493 28F200B5 28F004/400B5 28F800B5 AP-680 29LV160/800/400

sg3524 PWM MOTOR mosfet

Abstract: sg3524 PWM GENERATOR control Controllers Part number Package L297D SO-20 L297 DIP-20 L6506D SO , Package L6225D Typ RDS(on) [] DIP-20 L6226D SO-24 L6226PD PowerSO-36 L6226N , power package (PD) SO-24 L6207PD 0.7 8 to 52 DIP-24 L6207D Dual DMOS full bridge , Package VCC [V] TD310ID SO-16 18 TD310IN DIP-16 18 Part number 4 Output , 0.3 Single drivers Package VCC [V] TD220ID SO-8 18 TD220IDT DIP-8 18
STMicroelectronics
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L298N sg3524 PWM MOTOR mosfet sg3524 PWM GENERATOR L6385D bridgeless pfc ic controller l6599 microstepping L6203 SO-20 L6506 DIP-18 L6201 L6201PS L6202

mmx black anodized aluminum plate

Abstract: Thermagon T-MATE2905 . 9 2.1 2.2 3 Intel® 82854 GMCH Package , total package thermal design power: (Ts ­ Tamb )/TDP. sa , heatsink 8 Intel® 82854 GMCH ­ Thermal Design Guide 2 Mechanical Guidelines 2.1 Intel® 82854 GMCH Package The Intel , the package dimensions of the Intel® 82854 GMCH. The drawing is not drawn to scale and the units , electrical shorts. Figure 1. Intel 82854 GMCH micro-FCBGA package dimensions (mm) Intel® 82854 GMCH ­
Intel
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AF-S-10H-07B mmx black anodized aluminum plate Thermagon T-MATE2905 LAYOUT GUIDELINES DDR Intel motherboard 82854 cooler master THIRD generation chassis D14844-001 335C866801A 51-SA ECB-002272 ECB-00228

1168-ball micro-FCBGA

Abstract: INTEL Micro-FCPGA Package Dimensions Constraint Zone for the Intel® Celeron® M Processor in the micro-FCBGA Package , -01 . 34 Intel® Celeron® M Processor in the Micro-FCBGA Package Heat Sink #1 (EID-BAN24-CUALC-001SS) . 37 Intel® Celeron® M Processor in the Micro-FCPGA Package Heat Sink #2 (EID-BAN24-CUALC , Intel® Celeron® M Processor in the micro-FCBGA Package Intel® Celeron® M Processor on 90 nm Process , 2.2.6.1 Intel® Celeron® M Processor in the Micro-FCBGA Package- Copper Base, Aluminum Fin Heat Sink
Intel
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1168-ball micro-FCBGA INTEL Micro-FCPGA Package Dimensions fujikura heat sink 478 001ss Celeron d 2,26 EID-BAN24-CUALC-002SS EID-BAN15-ALX-003SS EID-LPT13-ALX-003

PLCC 32 intel package dimensions

Abstract: 845 bios chip -623 CONTENTS PAGE 1.0 INTRODUCTION 2.0 INTEL'S BOOT BLOCK FLASH MEMORY 3.0 BOOT BLOCK PACKAGE AND PINOUT , Intel is Sharp. They provide a 2-/4-Mbit flash memory in a 56-lead TSOP package. Again, availability , Figure 17, a board can be designed to accommodate both Sharp's 56-lead TSOP package and Intel's Boot , E AP-623 APPLICATION NOTE Multi-Site Layout Planning with Intel's Boot Block Flash , connection with Intel products. No license, express or implied, by estoppel or otherwise, to any
Intel
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PLCC 32 intel package dimensions 845 bios chip intel 845 circuit diagram all chip TSOP 48 LAYOUT TSOP 48 thermal resistance ap623 AP-607 AB-57 AB-60

GD16585

Abstract: submarine 10Gbps avalanche product brief ® Intel LXT16784/LXT16785 MUX/DeMUX Chipset Product Description The Intel , with Forward Error Correction (FEC), submarine systems, and fiber-optic test equipment. The Intel , Dissipation: 1.4W s High integration s 132 PBGA Package s Small physical form factor (13 , integration s 132 PBGA Package s Small physical form factor (13 x13mm) Reduced board space s , interface into the net device. The Intel® LXT16784 has a DeMUX merged with a CDR and is fully compliant
Intel
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submarine 10Gbps avalanche IXF32003 LXT16784/85 USA/0901/5K/ASI/DC

INTEL fcBGA PACKAGE thermal resistance

Abstract: fcBGA PACKAGE thermal resistance Ultra Low Voltage Intel® Celeron® Processor in the Micro FC-BGA Package Thermal Design Guide , Intel® Celeron® Processor in the Micro FC-BGA Package may contain design defects or errors known as , . 8 Ultra-Low Voltage Intel® Celeron® Processor (0.13 µ) in the Micro FC-BGA Package Thermal Data , Voltage Intel® Celeron® processor in the surface mount, 479-pin, micro FC-BGA package. Detailed , Thermal Design Guide ULV Intel® Celeron® Processor in the Micro FC-BGA Package Table 1
Intel
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INTEL fcBGA PACKAGE thermal resistance fcBGA PACKAGE thermal resistance T725 intel 830 "design guide" 273804 PCB design guide EID-LPT15-ALX-002 PL1664-65

252612

Abstract: ECC-00060-01 . 20 Intel® Pentium® M and Celeron ® M Processors in the Micro-FCBGA Package Mechanical Stack-Up , -00076-01 . 36 Intel® Pentium® M and Celeron® M Processors in the Micro-FCBGA Package- Copper Base , Intel® Pentium® M and Celeron® M Processors in the Micro-FCPGA Package- Copper Base, Aluminum Snap Fin , Processor Package The Intel® Pentium® M and Celeron® M processors are available in the 479-Ball Micro-Flip , centered on the package; therefore, they have a die offset. The die offsets for the Intel Pentium M and
Intel
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252612 ECC-00060-01 thermal design guide -intel G751 micro-FCPGA intel MOTHERBOARD pcb design ECU-PNA1C-35

ECC-00178-01-GP

Abstract: FCBGA 956 pin Processors-Package Information 2.0 Package Information The Intel® CoreTM2 Duo Processor (XE and SV) is , also minimal, so Intel requires the use of a heatsink for all usage conditions. 3.2 Maximum , micro-FCPGA package. Intel® CoreTM 2 Duo Mobile Processors on 45-nm process-Thermal Design Guide TDG 11 , Intel® CoreTM 2 Duo Mobile Processors on 45-nm process for Embedded Applications Thermal Design , WITH INTEL® PRODUCTS. EXCEPT AS PROVIDED IN INTEL'S TERMS AND CONDITIONS OF SALE FOR SUCH PRODUCTS
Intel
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ECC-00178-01-GP FCBGA 956 pin CompactPCI Express specification 45nm 956-ball C1100

EEP-N41ES-02

Abstract: mobile Thermal Design Guide Recommended PCB Volumetric Constraint Zone for the Intel® Pentium® M Processor in the micro-FCBGA Package , ® Pentium® M Processor in the micro-FCPGA Package. 19 Intel® Pentium® M , . 19 Intel® Pentium® M Processor in the micro-FCPGA Package Mechanical Stack-up in the Single-Slot , Intel® Pentium® M Processor in the micro-FCPGA Package Mechanical Stack-up in the 1U Form Factor , -01 . 34 Intel® Pentium® M Processor in the Micro-FCBGA Package Heatsink #1
Intel
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EEP-N41ES-02 mobile Thermal Design Guide EEP-N41CS-01 MPGA479M Intel Pentium 4 Processors 745 EEP-N41SS-01 EID-BAN24-CU/ALC-001SS EID-BAN24-CU/ALC-002SS
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