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Part Manufacturer Description Datasheet BUY
LTC1706EMS-82#TR Linear Technology LTC1706-82 - VID Voltage Programmer for Intel VRM9.0/9.1; Package: MSOP; Pins: 10; Temperature Range: -40°C to 85°C visit Linear Technology - Now Part of Analog Devices Buy
LTC1706EMS-82#TRPBF Linear Technology LTC1706-82 - VID Voltage Programmer for Intel VRM9.0/9.1; Package: MSOP; Pins: 10; Temperature Range: -40°C to 85°C visit Linear Technology - Now Part of Analog Devices Buy
LTC1706EMS-82 Linear Technology LTC1706-82 - VID Voltage Programmer for Intel VRM9.0/9.1; Package: MSOP; Pins: 10; Temperature Range: -40°C to 85°C visit Linear Technology - Now Part of Analog Devices Buy
LTC1706EMS-82#PBF Linear Technology LTC1706-82 - VID Voltage Programmer for Intel VRM9.0/9.1; Package: MSOP; Pins: 10; Temperature Range: -40°C to 85°C visit Linear Technology - Now Part of Analog Devices Buy
LTC1706EMS-85#PBF Linear Technology LTC1706-85 - VID Voltage Programmer for Intel VRM 8.5; Package: MSOP; Pins: 10; Temperature Range: -40°C to 85°C visit Linear Technology - Now Part of Analog Devices Buy
LTC1706EMS-85#TR Linear Technology LTC1706-85 - VID Voltage Programmer for Intel VRM 8.5; Package: MSOP; Pins: 10; Temperature Range: -40°C to 85°C visit Linear Technology - Now Part of Analog Devices Buy

Intel SCSP

Catalog Datasheet MFG & Type PDF Document Tags

Intel SCSP

Abstract: strataflash retention Intel® Wireless Flash Memory (W18 SCSP) 32-Mbit W18 + 8-Mbit SRAM (38F1020W0YTQ1, 38F1020W0YBQ1 , S-VCC SCSP Packaging - 0.8 mm Ball-Pitch Intel® SCSP - Area: 8x10 mm, Height: 1.2 mm max - 88 , Bits This datasheet describes the key features of the Intel® Wireless Flash Memory (W18 SCSP) device , Corporation. All rights reserved. 28 Jun 2005 2 Intel StrataFlash® Wireless Memory (W18 SCSP) Order , . 23 Datasheet Intel StrataFlash® Wireless Memory (W18 SCSP) Order Number: 252635, Revision
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Intel SCSP strataflash retention 7900 Intel intel sram W18 Package 252635 32-KW B5102-01

38F1020W0YBQ0

Abstract: flash "high temperature data retention" mechanism Intel® Wireless Flash Memory (W18 SCSP) 32-Mbit W18 + 8-Mbit SRAM (38F1020W0YTQ0, 38F1020W0YBQ0 , Top and Bottom Parameter Configuration Flash Software - Intel® Flash Data Integrator (Intel® FDI) Optimized - Common Flash Interface (CFI) SCSP Architecture - 32 , Easy Migration to Future SCSP Devices SCSP Voltage - 1.7 V to 1.95 V VCC/VCCQ and S-VCC SCSP Packaging - 0.8 mm Ball-Pitch Intel® SCSP - Area: 8x10 mm, Height: 1.2 mm max - 88-Ball (8
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flash "high temperature data retention" mechanism 28F320W18 20W0YBQ0

FLASH MEMORY 38F

Abstract: 28F320W18 Intel® Wireless Flash Memory (W18 SCSP) 32-Mbit W18 + 8-Mbit SRAM (38F1020W0YTQ0, 38F1020W0YBQ0 , Top and Bottom Parameter Configuration Flash Software - Intel® Flash Data Integrator (Intel® FDI) Optimized - Common Flash Interface (CFI) SCSP Architecture - 32 , SCSP Packaging - 0.8 mm Ball-Pitch Intel® SCSP - Area: 8x10 mm, Height: 1.2 mm max - 88-Ball (8 , information pertaining to the Intel® Wireless Flash Memory (W18 SCSP); 32-Mbit W18 + 8-Mbit SRAM SCSP device
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FLASH MEMORY 38F 88-ball

Intel SCSP

Abstract: FLASH MEMORY 38F Intel® Advanced+ Boot Block Flash Memory (C3) SCSP Family Datasheet Product Features , Technologies The Intel® Advanced+ Boot Block Flash Memory (C3) Stacked Chip Scale Package (SCSP) device , the Intel® Flash Data Integrator (Intel® FDI) software, the C3 SCSP memory device provides a , Corporation. All rights reserved. 26 Aug 2005 2 Intel® Advanced+ Boot Block Flash Memory (C3) SCSP , . 27 Intel® Advanced+ Boot Block Flash Memory (C3) SCSP Family Order Number: 252636, Revision
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PF38F1010C0ZTL0 RD28F3204C3B70 RD28F1604C3BD70 28F160C3 28F320C3 intel 28f RD28F3208C3T70 RD28F3208C3B90 PF38F1010C0ZBL0 RD38F1020C0ZTL0

Intel SCSP

Abstract: Intel Stacked CSP Intel® Advanced+ Boot Block Flash Memory (C3) SCSP Family Datasheet Product Features , (Intel® FDI) software, the C3 SCSP memory device provides a cost-effective, flexible, code plus data , Minor text edits. 5 Contents 6 Datasheet Intel® Advanced+ Boot Block Flash Memory SCSP , . Datasheet 7 Intel® Advanced+ Boot Block Flash Memory SCSP Family Flash program and erase , ballout. Table 2. Symbol Intel® Advanced+ Boot Block SCSP Ball Descriptions (Sheet 1 of 2) Type
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Intel Stacked CSP BA 658 RD38F1010C0ZTL0 RD38F1010C0ZBL0 RD28F3208C3T90 RD28F3208C3B70 RD38F1020C0ZBL0 RD28F3204C3T70

RFUS 20

Abstract: 298161 Intel StrataFlash£ Wireless Memory System (LV18 SCSP) 1024-Mbit LVX Family with LPSDRAM , Intel StrataFlash® Wireless Memory System (LV18 SCSP) with Low-Power SDRAM (LVX family) offers a , changes to them. The Intel StrataFlash® Wireless Memory System (LV18 SCSP); 1024-Mbit LVX Family with , this document is to provide information where these SCSP products differ from the Intel StrataFlash , flash-only or LPSDRAM stacked memory combinations. The Intel® SCSP package in a x16D Performance ballout
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RFUS 20 298161 strataflash 256 x 2 Mbits 1024-M 256-M 16-KW 64-KW 38F/48F 128-M

strataflash 256 x 2 Mbits

Abstract: Migration Guide for Intel StrataFlash Memory J Intel StrataFlash£ Wireless Memory System (LV18 SCSP) 1024-Mbit LVX Family with LPSDRAM , Intel StrataFlash® Wireless Memory System (LV18 SCSP) with Low-Power SDRAM (LVX family) offers a , changes to them. The Intel StrataFlash® Wireless Memory System (LV18 SCSP); 1024-Mbit LVX Family with , this document is to provide information where these SCSP products differ from the Intel StrataFlash , flash-only or LPSDRAM stacked memory combinations. The Intel® SCSP package in a x16D Performance ballout
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Migration Guide for Intel StrataFlash Memory J 253853 253854 512-M 128SD

FLASH MEMORY 38F

Abstract: 88-ball Intel® Wireless Flash Memory (W30 SCSP) 128WQ Family Datasheet Flash Architecture - , (Flash only) - 2.7 V to 3.1 V VCCQ (Flash + PSRAM) SCSP Packaging - 0.8 mm Ball-Pitch Intel® SCSP , VIII Process This versatile and compact Stacked Chip Scale Package (SCSP) solution from Intel is , high-performance, low-power, board-constrained memory applications, the Intel® Wireless Flash Memory (W30 SCSP , finalize a design with this information. The Intel® Wireless Flash Memory (W30 SCSP) family may contain
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128W30B 128W30T 64PSRAM RD38F3350WWZDQ1

252063

Abstract: Intel® Wireless Flash Memory (W30 SCSP) 128WQ Family Datasheet Flash Architecture - , Flash Software - Intel® Flash Data Integrator (FDI) Optimized - Common Flash Interface (CFI) SCSP , Packaging - 0.8 mm Ball-Pitch Intel® SCSP - Area: 8x10 mm, Height: 1.2mm and 1.4mm - 88-Ball (8 x 10 , Package (SCSP) solution from Intel is created by combining the Intel® Wireless Flash Memory (W30) device , Intel® Wireless Flash Memory (W30 SCSP) family retains all the features of the Intel® Wireless Flash
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252063

W18 88

Abstract: FLASH MEMORY 38F Intel® Wireless Flash Memory (W18/W30 SCSP) 128-Mbit WQ Family with Asynchronous SRAM , (Typ) - I/O: VCCQ = 1.8 V or 3.0 V (Typ) SCSP Packaging - 0.8 mm Ball-Pitch Intel® SCSP - Area , VIII Process This versatile and compact Stacked Chip Scale Package (SCSP) solution from Intel is , high-performance, low-power, board-constrained memory applications, the Intel® Wireless Flash Memory (W18/W30 SCSP , finalize a design with this information. The Intel® Wireless Flash Memory (W18/W30 SCSP); 128-Mbit WQ
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W18 88 intel 24024 FLASH MEMORY 48F W18/30 128W18 128W30 PF48F3300W0YD0 RD38F3350W0ZDQ0

252063

Abstract: Intel® Wireless Flash Memory (W18/W30 SCSP) 128-Mbit WQ Family with Asynchronous SRAM Datasheet , ) SCSP Packaging - 0.8 mm Ball-Pitch Intel® SCSP - Area: 8x10 mm - Height: 1.2mm and 1.4mm - 88 , Scale Package (SCSP) solution from Intel is created by combining the Intel® Wireless Flash Memory (W18 , applications, the Intel® Wireless Flash Memory (W18/W30 SCSP) family retains all the features of the Intel , and signal ballout for all SCSP combinations. Manufactured on Intel® 0.13 micron ETOXTM VIII process
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PF48F3300W0YDQ0

RD38F4

Abstract: 1024-Mbit Intel StrataFlash Wireless Memory System (LV18 SCSP) 1024-Mbit LVX Family with LPSDRAM , technology Intel StrataFlash® Wireless Memory System (LV18 SCSP) with Low-Power SDRAM (LVX family) offers , , without notice. The Intel StrataFlash® Wireless Memory System (LV18 SCSP) 1024-Mbit LVX Family with , intent of this document is to provide information where these SCSP products differ from the Intel , , supporting flash-only or flash with LPSDRAM stacked memory combinations. The Intel® SCSP package in a x16D
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RD38F4 1024-Mbit rd58f0012lvybb0 30094* intel
Abstract: Intel StrataFlash£ Wireless Memory System (LV18 SCSP) 1024-Mbit LVX Family with LPSDRAM , Intel StrataFlash® Wireless Memory System (LV18 SCSP) with Low-Power SDRAM (LVX family) offers a , changes to them. The Intel StrataFlash® Wireless Memory System (LV18 SCSP); 1024-Mbit LVX Family with , (Intel® UT-SCSP) programming socket technology is backward compatible for Intel SCSP packages. This , production. The specifications are subject to change without notice. Verify with your local Intel sales Intel
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290737

Abstract: Intel SCSP ball) Stacked Chip Scale Package (SCSP) for the 128-Mbit device and in an 88-ball (80active ball) Intel , Intel StrataFlash® Wireless Memory (L18) 28F640L18, 28F128L18, 28F256L18 Datasheet Product , Power Savings (APS) mode - 20 µs (Typ) program suspend - 20 µs (Typ) erase suspend - Intel , Packaging - 64-, 128- and 256-Mbit density in VF BGA packages - 128/0, and 256/0 density in SCSP - 16-bit wide data bus The Intel StrataFlash® wireless memory (L18) device is the latest generation of Intel
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RD48F4000L0YTQ0 RD48F4000L0YBQ0 PF48F4000L0YBQ0 290737 PF48F3000 L18105 Intel StrataFlash Memory k3 RD48F2000L0YTQ0 RD48F2000L0YBQ0 RD48F3000L0YTQ0 RD48F3000L0YBQ0 PF48F3000L0YTQ0 PF48F3000L0YBQ0

256l18

Abstract: 28F128L18 Package Ballout · SCSP Package Ballout 4.1.1 VF BGA Package Ballout The Intel StrataFlash® Wireless , Intel StrataFlash® Wireless Memory (L18) 4.2.2 128/0 and 256/0 SCSP Package Signal Descriptions , Intel StrataFlash® Wireless Memory (L18) 28F640L18, 28F128L18, 28F256L18 Datasheet Product , Software - 20 µs (Typ) program suspend - 20 µs (Typ) erase suspend - Intel® Flash Data Integrator , -, and 256-Mbit density in VF BGA packages - 128/0 and 256/0 density in SCSP - 16-bit wide data bus
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256l18 8x10x1 etox 16x128 NZ48F3000L0YTQ0 NZ48F3000L0YBQ0 JZ48F3000L0YTQ0 JZ48F3000L0YBQ0 NZ48F4000L0YTQ0 NZ48F4000L0YBQ0
Abstract: /0 density in SCSP - 16-bit wide data bus The Intel StrataFlash® wireless memory (L18) device is , Intel StrataFlash® Wireless Memory (L18) 4.1.2 SCSP Package Ballout The L18 wireless memory in , Intel StrataFlash® Wireless Memory (L18) Table 2. WP# Device Signal Descriptions for SCSP (Sheet , Intel StrataFlash® Wireless Memory (L18) 28F640L18, 28F128L18, 28F256L18 Datasheet Product , ) erase suspend - Intel® Flash Data Integrator optimized - Basic Command Set (BCS) and Extended Command Intel
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PF48F4000L0YTQ0

vf bga

Abstract: PF48F Package Ballout · SCSP Package Ballout 4.1.1 VF BGA Package Ballout The Intel StrataFlash® Wireless , Intel StrataFlash® Wireless Memory (L30) 28F640L30, 28F128L30, 28F256L30 Datasheet Product , suspend - 20 µs (Typ) erase suspend - Intel® Flash Data Integrator (FDI) optimized - Basic Command , Intel StrataFlash® wireless memory (L30) product is the latest generation of Intel StrataFlash® memory , in the background. The L30 device is manufactured using Intel® 0.13 µm ETOXTM VIII process
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vf bga PF48F RD48F4000L0ZTQ0 NZ48F3000L0ZTQ0 NZ48F3000L0ZBQ0 JZ48F3000L0ZTQ0 JZ48F3000L0ZBQ0 NZ48F4000L0ZTQ0 NZ48F4000L0ZBQ0

251902

Abstract: /0 Density in SCSP - 16-bit wide data bus The Intel StrataFlash® wireless memory (L18) device is , Ballout and Signal Descriptions Signal Ballout 4.1.2 SCSP Package Ballout The Intel StrataFlash , Package (SCSP) for the 128-Mbit device and in an 88-ball (80active ball) Intel® Ultra-Thin Stacked Chip , Intel StrataFlash® Wireless Memory (L18) 28F640L18, 28F128L18, 28F256L18 Datasheet Product , suspend - 20 µs (Typ) erase suspend - Intel® Flash Data Integrator optimized - Basic Command Set (BCS
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251902 JZ48F4000L0YTQ0 JZ48F4000L0YBQ0

251903

Abstract: .12 Intel UT SCSP Packages , Datasheet Intel StrataFlash® Flash Memory (L30) 11 Package Information SCSP Packages 3.2 , SCSP Packages Package Information 3.3 Intel UT SCSP Packages Figure 4. 256-Mbit, 88 , Intel StrataFlash® Wireless Memory (L30) 28F640L30, 28F128L30, 28F256L30 Datasheet Product , ) program suspend - 20 µs (Typ) erase suspend - Intel® Flash Data Integrator (FDI) optimized - Basic
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251903 64K-W RD48F2000L0ZTQ0 RD48F2000L0ZBQ0 RD48F3000L0ZTQ0 RD48F3000L0ZBQ0 PF48F3000L0ZTQ0

PF48F

Abstract: 28F128L18 17 Intel StrataFlash® Wireless Memory (L18) 4.1.2 SCSP Package Ballout The L18 wireless , Intel StrataFlash® Wireless Memory (L18) 28F640L18, 28F128L18, 28F256L18 Datasheet Product , Software - 20 µs (Typ) program suspend - 20 µs (Typ) erase suspend - Intel® Flash Data Integrator , -, and 256-Mbit density in VF BGA packages - 128/0 and 256/0 density in SCSP - 16-bit wide data bus The Intel StrataFlash® wireless memory (L18) device is the latest generation of Intel StrataFlash
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