IRFR024 IRFU024 SiHFR024 SiHFU024 SiHFR024-E3 SiHFR024T-E3a SiHFR024Ta - Datasheet Archive

 

Vishay Siliconix Power MOSFET FEATURES PRODUCT SUMMARY VDS (V) · Dynamic dV/dt Rating 60 RDS(on) () VGS = 10 V Qg (Max.)

 

IRFR024 IRFR024, IRFU024 IRFU024, SiHFR024 SiHFR024, SiHFU024 SiHFU024 Vishay Siliconix Power MOSFET FEATURES PRODUCT SUMMARY VDS (V) · Dynamic dV/dt Rating 60 RDS(on) () VGS = 10 V Qg (Max.) (nC) 5.8 Qgd (nC) 11 Configuration · Fast Switching · Ease of Paralleling Single · Simple Drive Requirements · Lead (Pb)-free Available IPAK (TO-251) DESCRIPTION Third generation Power MOSFETs from Vishay provide the designer with the best combination of fast switching, ruggedized device design, low on-resistance and cost-effectiveness. The DPAK is designed for surface mounting using vapor phase, infrared, or wave soldering techniques. The straight lead version (IRFU, SiHFU series) is for through-hole mounting applications. Power dissipation levels up to 1.5 W are possible in typical surface mount applications. D D G G COMPLIANT · Available in Tape and Reel D DPAK (TO-252) RoHS* · Straight Lead (IRFU024 IRFU024, SiHFU024 SiHFU024) 25 Qgs (nC) Available · Surface Mount (IRFR024 IRFR024, SiHFR024 SiHFR024) 0.10 S G D S S N-Channel MOSFET ORDERING INFORMATION Package Lead (Pb)-free SnPb DPAK (TO-252) IRFR024PbF SiHFR024-E3 SiHFR024-E3 IRFR024 IRFR024 SiHFR024 SiHFR024 DPAK (TO-252) IRFR024TRPbFa SiHFR024T-E3a SiHFR024T-E3a IRFR024TRa SiHFR024Ta SiHFR024Ta DPAK (TO-252) IRFR024TRLa SiHFR024TLa SiHFR024TLa IPAK (TO-251) IRFU024PbF SiHFU024-E3 SiHFU024-E3 IRFU024 IRFU024 SiHFU024 SiHFU024 Note a. See device orientation. ABSOLUTE MAXIMUM RATINGS TC = 25 °C, unless otherwise noted PARAMETER SYMBOL LIMIT Drain-Source Voltage VDS 60 Gate-Source Voltage VGS ± 20 Continuous Drain Current VGS at 10 V TC = 25 °C TC = 100 °C Pulsed Drain Currenta ID IDM 0.33 0.020 EAS TC = 25 °C Maximum Power Dissipation (PCB Mount)e TA = 25 °C Peak Diode Recovery dV/dtc 91 42 2.5 dV/dt for 10 s 5.5 TJ, Tstg Operating Junction and Storage Temperature Range Soldering Recommendations (Peak Temperature) PD A 56 Linear Derating Factor Single Pulse Avalanche Energyb V 14 9.0 Linear Derating Factor (PCB Mount)e Maximum Power Dissipation UNIT - 55 to + 150 260d W/°C mJ W V/ns °C Notes a. Repetitive rating; pulse width limited by maximum junction temperature (see fig. 11). b. VDD = 25 V, starting TJ = 25 °C, L = 541 µH, RG = 25 , IAS = 14 A (see fig. 12). c. ISD 17 A, dI/dt 110 A/µs, VDD VDS, TJ 150 °C. d. 1.6 mm from case. e. When mounted on 1" square PCB (FR-4 or G-10 material). * Pb containing terminations are not RoHS compliant, exemptions may apply Document Number: 91264 S09-0287-Rev. B, 23-Feb-09 www.vishay.com 1 IRFR024 IRFR024, IRFU024 IRFU024, SiHFR024 SiHFR024, SiHFU024 SiHFU024 Vishay Siliconix THERMAL RESISTANCE RATINGS SYMBOL MIN. TYP. MAX. Maximum Junction-to-Ambient PARAMETER RthJA - - 110 Maximum Junction-to-Ambient (PCB Mount)a RthJA - - 50 Maximum Junction-to-Case (Drain) RthJC - - UNIT 3.0 °C/W Note a. When mounted on 1" square PCB (FR-4 or G-10 material). SPECIFICATIONS TJ = 25 °C, unless otherwise noted PARAMETER SYMBOL TEST CONDITIONS MIN. TYP. MAX. UNIT VDS VGS = 0 V, ID = 250 µA 60 - - V VDS/TJ Reference to 25 °C, ID = 1 mA - 0.073 - V/°C VGS(th) VDS = VGS, ID = 250 µA 2.0 - 4.0 V nA Static Drain-Source Breakdown Voltage VDS Temperature Coefficient Gate-Source Threshold Voltage Gate-Source Leakage Zero Gate Voltage Drain Current Drain-Source On-State Resistance Forward Transconductance VGS = ± 20 V - - ± 100 VDS = 60 V, VGS = 0 V - - 25 VDS = 48 V, VGS = 0 V, TJ = 125 °C - - 250 IGSS IDSS RDS(on) gfs µA - - 0.10 VDS = 25 V, ID = 8.4 Ab 6.2 - - S VGS = 0 V, VDS = 25 V, f = 1.0 MHz, see fig. 5 - 640 - - 360 - - 79 - - - 25 ID = 8.4 Ab VGS = 10 V Dynamic Input Capacitance Ciss Output Capacitance Coss Reverse Transfer Capacitance Crss Total Gate Charge Qg Gate-Source Charge Qgs - - 5.8 Gate-Drain Charge Qgd - - 11 Turn-On Delay Time td(on) - 13 - - 58 - - 25 - - 42 - - 4.5 - - 7.5 - - - 14 - - 56 - - 1.5 pF Rise Time Turn-Off Delay Time Fall Time tr td(off) VGS = 10 V ID = 17 A, VDS = 48 V, see fig. 6 and 13b VDD = 30 V, ID = 17A, RG = 18 , RD = 1.7 , see fig. 10b tf Internal Drain Inductance LD Internal Source Inductance LS Between lead, 6 mm (0.25") from package and center of die contact nC ns D nH G S Drain-Source Body Diode Characteristics Continuous Source-Drain Diode Current IS Pulsed Diode Forward Currenta ISM Body Diode Voltage VSD Body Diode Reverse Recovery Time trr Body Diode Reverse Recovery Charge Qrr Forward Turn-On Time ton MOSFET symbol showing the integral reverse p - n junction diode D A G S TJ = 25 °C, IS = 14 A, VGS = 0 Vb TJ = 25 °C, IF = 17 A, dI/dt = 100 A/µsb V - 88 180 ns - 0.29 0.64 µC Intrinsic turn-on time is negligible (turn-on is dominated by LS and LD) Notes a. Repetitive rating; pulse width limited by maximum junction temperature (see fig. 11). b. Pulse width 300 µs; duty cycle 2 %. www.vishay.com 2 Document Number: 91264 S09-0287-Rev. B, 23-Feb-09 IRFR024 IRFR024, IRFU024 IRFU024, SiHFR024 SiHFR024, SiHFU024 SiHFU024 Vishay Siliconix TYPICAL CHARACTERISTICS 25 °C, unless otherwise noted Fig. 1 - Typical Output Characteristics, TC = 25 °C Fig. 2 - Typical Output Characteristics, TC = 150 °C Document Number: 91264 S09-0287-Rev. B, 23-Feb-09 Fig. 3 - Typical Transfer Characteristics Fig. 4 - Normalized On-Resistance vs. Temperature www.vishay.com 3 IRFR024 IRFR024, IRFU024 IRFU024, SiHFR024 SiHFR024, SiHFU024 SiHFU024 Vishay Siliconix Fig. 5 - Typical Capacitance vs. Drain-to-Source Voltage Fig. 6 - Typical Gate Charge vs. Gate-to-Source Voltage www.vishay.com 4 Fig. 7 - Typical Source-Drain Diode Forward Voltage Fig. 8 - Maximum Safe Operating Area Document Number: 91264 S09-0287-Rev. B, 23-Feb-09 IRFR024 IRFR024, IRFU024 IRFU024, SiHFR024 SiHFR024, SiHFU024 SiHFU024 Vishay Siliconix VDS VGS RD D.U.T. RG + - VDD 10 V Pulse width 1 µs Duty factor 0.1 % Fig. 10a - Switching Time Test Circuit VDS 90 % 10 % VGS td(on) Fig. 9 - Maximum Drain Current vs. Case Temperature tr td(off) tf Fig. 10b - Switching Time Waveforms Fig. 11 - Maximum Effective Transient Thermal Impedance, Junction-to-Case Document Number: 91264 S09-0287-Rev. B, 23-Feb-09 www.vishay.com 5 IRFR024 IRFR024, IRFU024 IRFU024, SiHFR024 SiHFR024, SiHFU024 SiHFU024 Vishay Siliconix L Vary tp to obtain required IAS VDS VDS tp VDD D.U.T RG + - I AS V DD VDS 10 V 0.01 tp Fig. 12a - Unclamped Inductive Test Circuit IAS Fig. 12b - Unclamped Inductive Waveforms Fig. 12c - Maximum Avalanche Energy vs. Drain Current Current regulator Same type as D.U.T. 50 k QG 10 V 12 V 0.2 µF 0.3 µF QGS QGD + D.U.T. VG - VDS VGS 3 mA Charge IG ID Current sampling resistors Fig. 13a - Basic Gate Charge Waveform www.vishay.com 6 Fig. 13b - Gate Charge Test Circuit Document Number: 91264 S09-0287-Rev. B, 23-Feb-09 IRFR024 IRFR024, IRFU024 IRFU024, SiHFR024 SiHFR024, SiHFU024 SiHFU024 Vishay Siliconix Peak Diode Recovery dV/dt Test Circuit + D.U.T Circuit layout considerations · Low stray inductance · Ground plane · Low leakage inductance current transformer + - - RG · · · · dV/dt controlled by RG Driver same type as D.U.T. ISD controlled by duty factor "D" D.U.T. - device under test Driver gate drive P.W. + Period D= + - VDD P.W. Period VGS = 10 V* D.U.T. ISD waveform Reverse recovery current Body diode forward current dI/dt D.U.T. VDS waveform Diode recovery dV/dt Re-applied voltage VDD Body diode forward drop Inductor current Ripple 5 % ISD * VGS = 5 V for logic level devices Fig. 14 - For N-Channel Vishay Siliconix maintains worldwide manufacturing capability. Products may be manufactured at one of several qualified locations. Reliability data for Silicon Technology and Package Reliability represent a composite of all qualified locations. For related documents such as package/tape drawings, part marking, and reliability data, see www.vishay.com/ppg?91264. Document Number: 91264 S09-0287-Rev. B, 23-Feb-09 www.vishay.com 7 Legal Disclaimer Notice Vishay Disclaimer All product specifications and data are subject to change without notice. Vishay Intertechnology, Inc., its affiliates, agents, and employees, and all persons acting on its or their behalf (collectively, "Vishay"), disclaim any and all liability for any errors, inaccuracies or incompleteness contained herein or in any other disclosure relating to any product. Vishay disclaims any and all liability arising out of the use or application of any product described herein or of any information provided herein to the maximum extent permitted by law. The product specifications do not expand or otherwise modify Vishay's terms and conditions of purchase, including but not limited to the warranty expressed therein, which apply to these products. No license, express or implied, by estoppel or otherwise, to any intellectual property rights is granted by this document or by any conduct of Vishay. The products shown herein are not designed for use in medical, life-saving, or life-sustaining applications unless otherwise expressly indicated. Customers using or selling Vishay products not expressly indicated for use in such applications do so entirely at their own risk and agree to fully indemnify Vishay for any damages arising or resulting from such use or sale. Please contact authorized Vishay personnel to obtain written terms and conditions regarding products designed for such applications. Product names and markings noted herein may be trademarks of their respective owners. Document Number: 91000 Revision: 18-Jul-08 www.vishay.com 1