IPD05N03LA IPS05N03LA IPF05N03LA IPU05N03LA P-TO252-3-11 Q67042-S4144 05N03LA

IPS05N03LA G OptiMOS®2 Power-Transistor IPF05N03LA G IPU05N03LA G Product Summary Features V DS · Ideal for

IPD05N03LA IPD05N03LA G IPS05N03LA IPS05N03LA G OptiMOS®2 Power-Transistor IPF05N03LA IPF05N03LA G IPU05N03LA IPU05N03LA G Product Summary Features V DS · Ideal for high-frequency dc/dc converters · Qualified according to JEDEC1) for target application 25 V R DS(on),max (SMD version) 5.1 m ID 50 A · N-channel, logic level · Excellent gate charge x R DS(on) product (FOM) · Superior thermal resistance · 175 °C operating temperature · Pb-free lead plating; RoHS compliant Type IPD05N03LA IPD05N03LA IPF05N03LA IPF05N03LA IPS05N03LA IPS05N03LA IPU05N03LA IPU05N03LA Type Package Ordering Code Marking IPD05N03LA IPD05N03LA P-TO252-3-11 P-TO252-3-11 Q67042-S4144 Q67042-S4144 05N03LA 05N03LA IPF05N03LA IPF05N03LA P-TO252-3-23 P-TO252-3-23 Q67042-S Q67042-S 05N03LA 05N03LA IPS05N03LA IPS05N03LA Package P-TO252-3-11 P-TO252-3-11 P-TO251-3-11 P-TO251-3-11 P-TO252-3-23 P-TO252-3-23 Q67042-S Q67042-S 05N03LA 05N03LA P-TO251-3-11 P-TO251-3-11 P-TO251-3-1 P-TO251-3-1 IPU05N03LA IPU05N03LA Marking 05N03LA 05N03LA P-TO251-3-21 P-TO251-3-21 05N03LA 05N03LA Q67042-S4230 Q67042-S4230 05N03LA 05N03LA 05N03LA 05N03LA 05N03LA 05N03LA Maximum ratings, at T j=25 °C, unless otherwise specified Parameter Symbol Conditions Continuous drain current ID Value T C=25 °C2) 50 T C=100 °C Unit 50 Pulsed drain current I D,pulse T C=25 °C3) 350 Avalanche energy, single pulse E AS I D=45 A, R GS=25 300 Reverse diode dv /dt dv /dt I D=50 A, V DS=20 V, di /dt =200 A/µs, T j,max=175 °C 6 Gate source voltage4) V GS Power dissipation P tot Operating and storage temperature T j, T stg A kV/µs ±20 V 94 W -55 . 175 T C=25 °C IEC climatic category; DIN IEC 68-1 Rev. 2.2 mJ °C 55/175/56 page 1 2008-04-14 IPD05N03LA IPD05N03LA G IPS05N03LA IPS05N03LA G Parameter IPF05N03LA IPF05N03LA G IPU05N03LA IPU05N03LA G Values Symbol Conditions Unit min. typ. max. - - 1.6 minimal footprint - - 75 6 cm2 cooling area5) - - 50 25 - - Thermal characteristics Thermal resistance, junction - case R thJC SMD version, device on PCB R thJA K/W Electrical characteristics, at T j=25 °C, unless otherwise specified Static characteristics Drain-source breakdown voltage V (BR)DSS V GS=0 V, I D=1 mA Gate threshold voltage V GS(th) V DS=V GS, I D=50 µA 1.2 1.6 2 Zero gate voltage drain current I DSS V DS=25 V, V GS=0 V, T j=25 °C - 0.1 1 V DS=25 V, V GS=0 V, T j=125 °C - 10 100 V µA Gate-source leakage current I GSS V GS=20 V, V DS=0 V - 10 100 nA Drain-source on-state resistance R DS(on) V GS=4.5 V, I D=30 A - 6.9 8.6 m V GS=4.5 V, I D=30 A, SMD version - 6.7 8.4 V GS=10 V, I D=30 A - 4.4 5.3 V GS=10 V, I D=30 A, SMD version - 4.2 5.1 - 1 - 31 62 - S Gate resistance RG Transconductance g fs |V DS|>2|I D|R DS(on)max, I D=30 A 1) J-STD20 J-STD20 and JESD22 JESD22 2) Current is limited by bondwire; with an R thJC=1.6 K/W the chip is able to carry 106 A. 3) See figure 3 4) T j,max=150 °C and duty cycle D