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CC112X-IPC-4L-868RD Texas Instruments CC112x IPC 868/915MHz 4 layer Reference Design visit Texas Instruments
CC112X-IPC-2L-868RD Texas Instruments CC112x IPC 868/915MHz 2 layer Reference Design visit Texas Instruments
DLPC200ZEW Texas Instruments Digital Controller for DLP5500 DMD 780-BGA visit Texas Instruments
DLPC200ZEWCM Texas Instruments Digital Controller for DLP5500 DMD 780-BGA visit Texas Instruments
DLPC200ZEWT Texas Instruments SPECIALTY CONSUMER CIRCUIT, PBGA780, PLASTIC, FBGA-780 visit Texas Instruments
DLPC200 Texas Instruments SPECIALTY MICROPROCESSOR CIRCUIT, PBGA780, PLASTIC, FBGA-780 visit Texas Instruments

IPC-SM-780 solder paste

Catalog Datasheet MFG & Type PDF Document Tags

IPC-SM-780

Abstract: IPC-SM-786 circuit boards (PCBs). These reflow processes consist of applying a eutectic solder paste to a circuit board, placing devices onto the paste, drying the paste, and then conveying the board through an oven , Because different board designs use different solder paste, circuit boards, number of devices, and types , stage, the solder paste dries while its more volatile ingredients evaporate. After preheating, the , Melting Temperature of Solder (183° C) Temperature (° C) 150 2 Minutes or More 1° to 3° C per
Altera
Original

IPC-SM-780

Abstract: IPC-SM-786 circuit boards (PCBs). These reflow processes consist of applying a eutectic solder paste to a circuit board, placing devices onto the paste, drying the paste, and then conveying the board through an oven , different board designs use different solder paste, circuit boards, number of devices, and types of devices , Temperature of Solder (183° C) 50 1° to 3° C per Second Preheat Flux Activation 50 100 150 Time (Seconds) Reflow 200 250 Cool 0 0 Reflow In the preheat stage, the solder paste dries while its more
Altera
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IPC-SM-786A

Abstract: BGA and QFP Altera Package mounting profile These reflow processes consist of applying a eutectic solder paste to a circuit board, placing devices onto the paste, and then conveying the board through an oven with successive heating elements of , different number and types of devices, solder paste, and circuit boards, no single temperature profile , 100 200 250 Time (Seconds) Reflow Stages In the preheat stage, the solder paste dries , 250 Maximum Package Body Temperature (220o C) 200 o Melting Temperature of Solder (183 C
Altera
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IPC-SM-780

Abstract: applying a eutectic solder paste to a circuit board, placing devices onto the paste, drying the paste, and , . Temperature Profiles Because different board designs use different solder paste, circuit boards, number and , Time (Seconds) Reflow 200 250 Cool 0 0 Reflow Stages In the preheat stage, the solder paste , Temperature (o C) 150 2 Minutes or More 100 1 to 3 C per Second o o Melting Temperature of Solder (183 C , 150° C for a minimum of two minutes so the flux in the paste can clean the bonding surfaces properly
Altera
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BGA and QFP Altera Package mounting profile

Abstract: BGA PROFILING boards (PCBs). The reflow process consists of applying a eutectic solder paste to a circuit board , temperature profile that is dependent on application, available equipment, and solder paste. However, the , recommendations from the solder paste manufacturer to avoid damaging the device and create a reliable solder , the preheat stage, the solder paste dries while its more volatile ingredients evaporate. After , , along with Qualitex 778 water-soluble solder paste. Altera reliability stress boards are between four
Altera
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IPC-7525

Abstract: jedec package MO-220 or viscosity of solder paste flux matrix, solder void percentage, or different land pattern designs , ratio is critical for the release of the printed solder paste and is dependent on the aperture , solder paste during the board mounting process. Non-clean paste is preferred over clean paste due to , Pb-free pastes. Once the solder paste is printed, the MLP component should be placed and convection/IR , shock. 2. Soaking Zone: Thermal soak zone to remove solder paste violates and for activation of flux
Fairchild Semiconductor
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QFN-48 LAND PATTERN

Abstract: QFN PACKAGE thermal resistance package and the system board is made by printing the solder paste on the system board and reflowing it , designing the system board pad pattern and solder paste printing. The QFN package has a Exposed Pad , include: amount of solder paste coverage in thermal pad region, stencil design for peripheral and , board, type of solder paste, and reflow profile. It should be emphasized that this is just a guideline , between the component and the PCB can be made by screen printing solder paste on the PCB and re-flowing
Cypress Semiconductor
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alpha OM-338

Abstract: OM-338 Solder paste type · Reflow soldering process parameters A1 E A b e D · Solder mask opening 2 , solder paste is applied to the PCB by using a screen print process. The recommended stencil thickness for , Thickness of 80 m Note · A wider stencil opening will result in a better solder paste release from the , , and opening. If a tilting of the package is observed, the amount of solder paste should be reduced slightly. Please also take into consideration the direct relation between the amount of solder paste and
Vishay Semiconductors
Original

AN-1112

Abstract: thick bga die size . Solder Paste Reflow and Cleaning , surface mount assembly operations include, PCB Layout · Printing solder paste on PCB. · Component , solder paste for printing. 3 www.national.com AN-1112 Surface Mount Assembly Considerations , to be exerted during placement. It is recommended that bumps be dipped into solder paste on PCB to greater than 20% of paste block height. The following sections describe solder joint reliability
National Semiconductor
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thick bga die size solder joint reliability Semiconductor smd marking BY Solder paste stencil life SMD 420 IPC-SM-785

AN-772

Abstract: EM-99 thickness, PCB perimeter pad design, thermal paddle and via design, stencil design, solder paste, and , solder. It is generally accepted that the toe fillets are formed depending on the type of solder paste , good side fillet on the outside. The first step in achieving good standoff is the solder paste , AN-772 solder balling) if the solder paste coverage is too big. It is recommended that smaller multiple openings in the stencil should be used instead of one big opening for printing solder paste on
Analog Devices
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MO220 MO229 EM-99 20-lead lfcsp ipc-SM-782* tssop land pattern for TSsOP 16 Amkor CSP mold compound tssop 16 exposed pad stencil AN-617 EM-99-19 EM-99-03 EM-98-57

IPC-SM-785

Abstract: GENERAL SEMICONDUCTOR MARKING UM Printing Process Component Placement Solder Paste Reflow and Cleaning Rework Qualification Solder , MOUNT ASSEMBLY CONSIDERATIONS Printing solder paste on PCB. · · Component placement using , embrittlement. · Use Type 3 (25 to 45 micron particle size range) or finer solder paste for printing , force needs to be exerted during placement. It is recommended that bumps be dipped into solder paste , respective product qualification reports. SOLDER PASTE REFLOW AND CLEANING · Micro SMD is
National Semiconductor
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GENERAL SEMICONDUCTOR MARKING UM micro solder ball BGA and CSP WLCSP stencil design AN100926-46

gold embrittlement

Abstract: ADXL278 application note connections to one pad would lead to solder migration. Balanced trace entry to the pad minimizes component rotation. Vias and through holes should not be part of the pad. Additionally, solder mask thickness has to be monitored if the component is not placed into a solder mask window , (but within the limits of the castellation). The surface tension of the liquid solder pulls the , mismatch, so the solder has to handle this stress. The larger the LCC package, the higher the stress. An
Analog Devices
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AN-652 IPC-SM-782 gold embrittlement ADXL278 application note ADXL278 ADXL78 cte table ADXL78/ADXL278/ADXL193 E03707

IPC-SM-785

Abstract: stencil tension Printing Process Component Placement Solder Paste Reflow and Cleaning Rework Qualification Solder , AN100926 www.national.com AN-1112 SURFACE MOUNT ASSEMBLY CONSIDERATIONS Printing solder paste on , particle size range) or finer solder paste for printing. · The fan-out for the traces should be , placement. It is recommended that bumps be dipped into solder paste on PCB to greater than 20% of paste , reports. SOLDER PASTE REFLOW AND CLEANING · Micro SMD is compatible with industry standard reflow
National Semiconductor
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stencil tension PT100 bridge

JESD22-A113

Abstract: QFN-20 reflow Design, PCB thickness, type of components, component density and recommended solder paste profile. The , recommended during reflow. Type 3 or 4 Solder Paste is recommended, particularly for QFN packages due to the fine pitch. The maximum reflow temperature for the solder paste should not be exceeded. Reference , ://www.carsem.com/. · See the applicable Silicon Laboratories Datasheet for the recommended Solder Mask Layout , Metcal APR-5000 (http://www.metcal.com/) III. QFN and QFP Solder Profile Guidelines MCU Products MSL
Silicon Laboratories
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JESD47 JESD22-A113 QFN-24 QFN-20 reflow JESD-47 QFN-20 JEDEC SMT reflow profile J-STD-020C 1F301-GM C8051F316-GM C8051F311-GM

2225 capacitor footprint dimension

Abstract: ipc-SM-782 PHASE processes, where the solder volume is controlled by the solder paste deposition on the circuit , is to introduce the IPC-SM-782 methodology for solder reflow land patterns. The methodology will be , accuracy along with desired solder fillets. NOVACAP strongly recommends the user review the IPC-SM , additional modifications needed for solder fillet visual requirements and level of robustness. The amount of solder applied to the chip capacitor will influence the reliability of the device. Excessive
Novacap
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2225 capacitor footprint dimension IPC-SM-782 0805 2211 size footprint 0603 footprint IPC ceramic capacitor footprint 0402 dimension 1206 footprint IPC

PCB design for 0.2mm pitch csp package

Abstract: led matrix 8x8 mini circuits Voiding 4.4 Stencil Thickness and Solder Paste 4.5 Solder joint standoff height and fillet formation 4.6 Reflow Profile Rework Process 7.1 Component Removal 7.2 Site Redress 7.3 Solder Paste , include: amount of solder paste coverage in thermal pad region, stencil design for peripheral and thermal , , type of solder paste, and reflow profile. This applications note provides the guidelines for this , electrical connection between the package and the motherboard is made by printing the solder paste on the
Amkor Technology
Original
PCB design for 0.2mm pitch csp package led matrix 8x8 mini circuits 0.3mm pitch csp package E30JA led 3mm 8x8 matrix mlf 0.3mm pitch
Abstract: 0.4 0.22 0.4 solder paste deposit solder land plus solder paste R 0.025 0.12 22740 , better solder paste release from the stencil. So the best quality can be obtained by using the optimum , observed, the amount of solder paste should be reduced slightly. Please also take into consideration the direct relation between the amount of solder paste and the package shear strength. soldering mask , 0.22 solder paste deposit solder land plus solder paste 3. SCREEN PRINT PROCESS R 0.025 Vishay Semiconductors
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VCUT05E1-SD0 CLP0603 VCUT05E1-SD0-G4-08 STD-020 2011/65/EU 2002/95/EC

SMD Thick Film Chip Resistor

Abstract: ipc-SM-782 joints and low manufacturing defects. As a side note, the total equivalent wet laydown of solder paste , solder paste. FORCE DUE TO ADHESION OF SOLDER TO THE LAND FORCE EXERTED BY THE MASS OF THE PART , , reflowing the solder paste on to the component termination. Asymmetry in pad thermal mass results in , sources with a problem board. Screening solder paste on the pads with a stencil and then reflowing the , beginning to insure yields and reliability. You cannot slap components down on a PC board with solder and
AVX
Original
SMD Thick Film Chip Resistor AVX film chip capacitors NY MAKING TRANSISTOR smd TRANSISTOR NY solder joint Kyocera Electronic Components 5M1093-R
Abstract: : 0.85 solder land 0.4 0.22 0.4 solder paste deposit solder land plus solder paste R , better solder paste release from the stencil. So the best quality can be obtained by using the optimum , observed, the amount of solder paste should be reduced slightly. Please also take into consideration the direct relation between the amount of solder paste and the package shear strength. soldering mask , paste deposit solder land plus solder paste R 0.025 3. SCREEN PRINT PROCESS The solder paste is Vishay Semiconductors
Original
VBUS05B1-SD0 VBUS05B1-SD0-G4-08 JS709A
Abstract: general term "reflow" refers to several methods used in heating the circuit so that solder paste reflows , solder paste that is screened onto the circuit. Recommended temperature limits for solder reflow are , circuit passes through the zone the vapor condenses on the solder paste, pad, and termination resulting in heat transfer and reflow of the solder paste. Vapor phase reflow produces consistent circuit heating , micro-cracking conditions. SOLDER PRE-HEAT CYCLE Proper preheating is essential to prevent thermal shock Johanson Technology
Original
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