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Part Manufacturer Description Datasheet BUY
HM1-65642B/883 Intersil Corporation 8KX8 STANDARD SRAM, 150ns, CDIP28 visit Intersil
24502BVA Intersil Corporation 1KX4 STANDARD SRAM, 120ns, CDIP18 visit Intersil
HM1-6514/883 Intersil Corporation 1KX4 STANDARD SRAM, 320ns, CDIP18, CERAMIC, DIP-18 visit Intersil
ISL6841IUZ-T Intersil Corporation Improved Industry-Standard Single-Ended PWM Controller; MSOP8; Temp Range: -40° to 85°C visit Intersil Buy
ISL85001IRZ Intersil Corporation 1A Standard Buck PWM Regulator; DFN12; Temp Range: -40° to 85°C visit Intersil Buy
ISL6841IUZ Intersil Corporation Improved Industry-Standard Single-Ended PWM Controller; MSOP8; Temp Range: -40° to 85°C visit Intersil Buy

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IPC/JEDECJ-STD-002B

Catalog Datasheet MFG & Type PDF Document Tags

xmxx

Abstract: YC162-JR-071K ) TEST Solderability - Wetting TEST METHOD IPC/JEDECJ-STD-002B test B IEC 60068-2-58 PROCEDURE , tinned (95% covered) No visible damage - Leaching IPC/JEDECJ-STD-002B test D IEC 60068-2-58
Yageo
Original
YC162 xmxx YC162-JR-071K IPC/JEDECJ-STD-002B MIL-STD-202G-

xmxx

Abstract: thick film SMD chip resistor array ) TEST Solderability - Wetting TEST METHOD IPC/JEDECJ-STD-002B test B IEC 60068-2-58 PROCEDURE , tinned (95% covered) No visible damage - Leaching IPC/JEDECJ-STD-002B test D IEC 60068-2-58
Yageo
Original
thick film SMD chip resistor array MIL-STD-202G-method

2010 resistors phycomp

Abstract: 2322 phycomp IPC/JEDECJ-STD-002B test B Electrical Test not required Well tinned (95% covered) IEC , Leaching IPC/JEDECJ-STD-002B test D - Resistance to Soldering Heat No visible damage IEC
Yageo
Original
RC2010 PRC111 2010 resistors phycomp 2322 phycomp yageo Phycomp 2322 MP 1008 es PRC111 2322 760 60

smd resistor 0402 footprint dimension

Abstract: 0603 footprint IPC (1.0%+0.0005 ) No visible damage Solderability - Wetting IPC/JEDECJ-STD-002B test B Electrical Test , visible damage - Leaching IPC/JEDECJ-STD-002B test D Leadfree solder, 260 °C, 30 seconds
Yageo
Original
PT0805 smd resistor 0402 footprint dimension 0603 footprint IPC 2512 footprint IPC 2512 footprint 0402 0603 0805 1206 PT2512

xmxx

Abstract: 324 (RoHS Compliant) TEST Solderability - Wetting TEST METHOD IPC/JEDECJ-STD-002B test B IEC , REQUIREMENTS Well tinned (95% covered) No visible damage - Leaching IPC/JEDECJ-STD-002B test D IEC
Yageo
Original
YC324

xmxx

Abstract: YC102 METHOD IPC/JEDECJ-STD-002B test B IEC 60068-2-58 PROCEDURE Electrical Test not required , damage - Leaching IPC/JEDECJ-STD-002B test D IEC 60068-2-58 Leadfree solder, 260 °C, 30 seconds
Yageo
Original
YC102 1K20 smd code marking resistor
Abstract: (1.0%+0.0005 ) No visible damage Solderability - Wetting IPC/JEDECJ-STD-002B test B Electrical Test , visible damage - Leaching IPC/JEDECJ-STD-002B test D Leadfree solder, 260 °C, 30 seconds Yageo
Original

0805 footprint dimension

Abstract: 2512 footprint (1.0%+0.0005 ) No visible damage Solderability - Wetting IPC/JEDECJ-STD-002B test B Electrical Test , visible damage - Leaching IPC/JEDECJ-STD-002B test D Leadfree solder, 260 °C, 30 seconds
Yageo
Original
0805 footprint dimension
Abstract: REQUIREMENTS Solderability - Wetting IPC/JEDECJ-STD-002B test B Electrical Test not required IEC , Dipping time: 3± 0.5 seconds - Leaching IPC/JEDECJ-STD-002B test D - Resistance to Soldering Yageo
Original

xmxx

Abstract: yc324jk REQUIREMENTS Solderability - Wetting IPC/JEDECJ-STD-002B test B Electrical Test not required IEC , : 3±0.5 seconds - Leaching IPC/JEDECJ-STD-002B test D - Resistance to Soldering Heat No
Yageo
Original
yc324jk YC324-JK YNSC069 yc324-jk-071k YAGEO CHIP RESISTORS MARKING yc 324 PC/JEDECJ-STD-002B

yageo Phycomp 2322

Abstract: yageo Phycomp 2322 762 IPC/JEDECJ-STD-002B test B Electrical Test not required Well tinned (95% covered) IEC , Leaching IPC/JEDECJ-STD-002B test D - Resistance to Soldering Heat No visible damage IEC
Yageo
Original
PRC221 yageo Phycomp 2322 762 phycomp 2322 series resistors IEC60115-1 RESISTOR 0R 2512 smd code marking NE transistor smd marking mx RC2512

xmxx

Abstract: YC102 METHOD IPC/JEDECJ-STD-002B test B IEC 60068-2-58 PROCEDURE Electrical Test not required , damage - Leaching IPC/JEDECJ-STD-002B test D IEC 60068-2-58 Leadfree solder, 260 °C, 30 seconds
Yageo
Original

0603 footprint IPC

Abstract: 1206 footprint IPC Solderability - Wetting IPC/JEDECJ-STD-002B test B Electrical Test not required Magnification 50X SMD , Dipping time: 3±0.5 seconds Well tinned (95% covered) No visible damage - Leaching IPC/JEDECJ-STD-002B
Yageo
Original
1206 footprint IPC Yageo part marking

yageo Phycomp 2322

Abstract: yageo Phycomp 2322 762 PROCEDURE REQUIREMENTS Solderability - Wetting IPC/JEDECJ-STD-002B test B Electrical Test not , °C Dipping time: 3±0.5 seconds - Leaching IPC/JEDECJ-STD-002B test D - Resistance to
Yageo
Original
YAGEO RC2512 yageo 2322 RC yageo V3 SMD MARKING CODE YAGEO CHIP RESISTORS Mounting SMD MARKING CODE MX

RC0805

Abstract: 0805/1206 (RoHS Compliant) TEST Solderability - Wetting TEST METHOD IPC/JEDECJ-STD-002B test B , seconds REQUIREMENTS Well tinned (95% covered) No visible damage - Leaching IPC/JEDECJ-STD-002B
Yageo
Original
RC0805 RC0805/1206
Abstract: METHOD PROCEDURE REQUIREMENTS Solderability - Wetting IPC/JEDECJ-STD-002B test B , : leadfree solder bath at 245± 3 °C Dipping time: 3± 0.5 seconds - Leaching IPC/JEDECJ-STD-002B Yageo
Original
AF122 AF124 ASTM-B-809-95

0603 footprint IPC

Abstract: 1206 footprint IPC Solderability - Wetting IPC/JEDECJ-STD-002B test B Electrical Test not required Magnification 50X SMD , Dipping time: 3±0.5 seconds Well tinned (95% covered) No visible damage - Leaching IPC/JEDECJ-STD-002B
Yageo
Original

xxmx

Abstract: MP 1008 es Solderability - Wetting IPC/JEDECJ-STD-002B test B Electrical Test not required Well tinned (95 , : 3±0.5 seconds - Leaching IPC/JEDECJ-STD-002B test D - Resistance to Soldering Heat No
Yageo
Original
xxmx HRC11 smd transistor marking MX yageo RC0805 yageo Phycomp 2350 YAGEO RC1206

xmxx

Abstract: yageo RC0805 Compliant) TEST TEST METHOD PROCEDURE REQUIREMENTS Solderability - Wetting IPC/JEDECJ-STD-002B , 2nd step: leadfree solder bath at 245±3 °C Dipping time: 3±0.5 seconds - Leaching IPC/JEDECJ-STD-002B test D - Resistance to Soldering Heat No visible damage IEC 60068-2-58 Leadfree
Yageo
Original
smd marking mp RC11 resistor RC11 0805 yageo Phycomp 2322 734 6

YC358

Abstract: YC158 REQUIREMENTS Solderability - Wetting IPC/JEDECJ-STD-002B test B Electrical Test not required IEC , : 3±0.5 seconds - Leaching IPC/JEDECJ-STD-002B test D - Resistance to Soldering Heat No
Yageo
Original
YC358 YC158 RESISTOR NETWORK SMD 10PIN YC358T ARRAY resistor Phycomp Components 2350 series YC158/358
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