IPB60R165CP PG-TO263 IPP60R165CP SP000096439 6R165P J-STD20 JESD22

CoolMOSTM Power Transistor Product Summary Features V DS @ Tj,max · Lowest figure-of-merit R ONxQg 650 0.165 R DS(on),max

IPB60R165CP IPB60R165CP CoolMOSTM Power Transistor Product Summary Features V DS @ Tj,max · Lowest figure-of-merit R ONxQg 650 0.165 R DS(on),max · Ultra low gate charge V Q g,typ 39 nC · Extreme dv/dt rated · High peak current capability · Qualified according to JEDEC1) for target applications PG-TO263 PG-TO263 · Pb-free lead plating; RoHS compliant CoolMOS CP is specially designed for: · Hard switching topologies for Server and Telecom Type Package IPP60R165CP IPP60R165CP Ordering Code PG-TO263 PG-TO263 SP000096439 SP000096439 Marking 6R165P 6R165P Maximum ratings, at T j=25 °C, unless otherwise specified Parameter Symbol Conditions Continuous drain current ID Value T C=25 °C 21 T C=100 °C Unit 13 Pulsed drain current2) I D,pulse T C=25 °C 61 Avalanche energy, single pulse E AS I D=7.9 A, V DD=50 V 522 Avalanche energy, repetitive t AR2),3) E AR I D=7.9 A, V DD=50 V 0.79 Avalanche current, repetitive t AR2),3) I AR MOSFET dv /dt ruggedness dv /dt Gate source voltage V GS A mJ P tot Operating and storage temperature A V DS=0.480 V 50 V/ns static ±20 V AC (f >1 Hz) Power dissipation 7.9 ±30 T C=25 °C 192 W -55 . 150 °C T j, T stg Rev. 2.0 page 1 2006-06-19 IPB60R165CP IPB60R165CP Maximum ratings, at T j=25 °C, unless otherwise specified Parameter Continuous diode forward current IS Diode pulse current 2) I S,pulse Reverse diode dv /dt 4) dv /dt Parameter Value Symbol Conditions Symbol Conditions Unit 12 T C=25 °C A 61 15 V/ns Values Unit min. typ. max. - - 0.65 - - 62 Thermal characteristics Thermal resistance, junction - case R thJC Thermal resistance, junction ambient R thJA SMD version, device on PCB, minimal footprint SMD version, device on PCB, 6 cm2 cooling area5) Soldering temperature, reflowsoldering T sold reflow MSL 1 K/W 35 - - 260 °C 600 - - V Electrical characteristics, at T j=25 °C, unless otherwise specified Static characteristics Drain-source breakdown voltage V (BR)DSS V GS=0 V, I D=250 µA Gate threshold voltage V GS(th) V DS=V GS, I D=0.79 mA 2.5 3 3.5 Zero gate voltage drain current I DSS V DS=600 V, V GS=0 V, T j=25 °C - - 1 V DS=600 V, V GS=0 V, T j=150 °C - 10 - µA Gate-source leakage current I GSS V GS=20 V, V DS=0 V - - 100 nA Drain-source on-state resistance R DS(on) V GS=10 V, I D=12 A, T j=25 °C - 0.15 0.165 V GS=10 V, I D=12 A, T j=150 °C - 0.40 - f =1 MHz, open drain - 1.9 - Gate resistance Rev. 2.0 RG page 2 2006-06-19 IPB60R165CP IPB60R165CP Parameter Values Symbol Conditions Unit min. typ. max. - 2000 - - 100 - - 83 - Dynamic characteristics Input capacitance C iss Output capacitance C oss Effective output capacitance, energy related6) C o(er) Effective output capacitance, time related7) C o(tr) - 220 - Turn-on delay time t d(on) - 12 - Rise time tr - 5 - Turn-off delay time t d(off) - 50 - Fall time tf - 5 - Gate to source charge Q gs - 9 - Gate to drain charge Q gd - 13.0 - Gate charge total Qg - 39 52 Gate plateau voltage V plateau - 5.0 - V - 0.9 1.2 V - 390 - ns - 7.5 - µC - 38 - A V GS=0 V, V DS=100 V, f =1 MHz pF V GS=0 V, V DS=0 V to 480 V V DD=400 V, V GS=10 V, I D=12 A, R G=3.3 ns Gate Charge Characteristics V DD=400 V, I D=12 A, V GS=0 to 10 V nC Reverse Diode Diode forward voltage V SD Reverse recovery time V GS=0 V, I F=12 A, T j=25 °C t rr Reverse recovery charge Q rr Peak reverse recovery current V R=400 V, I F=I S, di F/dt =100 A/µs I rrm 1) J-STD20 J-STD20 and JESD22 JESD22 2) Pulse width t p limited by T j,max 3) Repetitive avalanche causes additional power losses that can be calculated as P AV=E AR*f. 4) ISD=ID, di/dtV(BR)DSS, Tj2|I D|R DS(on)max parameter: T j 100 80 0.3 60 98% 0.2 40 typ C °150 20 0.1 0 0 -60 -20 20 60 100 140 180 T j [°C] Rev. 2.0 C °25 I D [A] 0.4 R DS(on) [] 0.5 0 2 4 6 8 10 V GS [V] page 5 2006-06-19 IPB60R165CP IPB60R165CP 9 Typ. gate charge 10 Forward characteristics of reverse diode V GS=f(Q gate); I D=12 A pulsed I F=f(V SD) parameter: V DD parameter: T j 102 10 25 °C, 98% 8 150 °C, 98% 120 V 25 °C 150 °C 101 400 V I F [A] V GS [V] 6 4 100 2 10-1 0 0 10 20 30 0 40 0.5 1 Q gate [nC] 1.5 2 V SD [V] 11 Avalanche energy 12 Drain-source breakdown voltage E AS=f(T j); I D=7.9 A; V DD=50 V V BR(DSS)=f(T j); I D=0.25 mA 600 700 660 E AS [mJ] V BR(DSS) [V] 400 620 200 580 0 540 20 60 100 140 180 T j [°C] Rev. 2.0 -60 -20 20 60 100 140 180 T j [°C] page 6 2006-06-19 IPB60R165CP IPB60R165CP 13 Typ. capacitances 14 Typ. Coss stored energy C =f(V DS); V GS=0 V; f =1 MHz E oss= f(V DS) 105 14 12 104 10 Ciss C [pF] E oss [µJ] 103 Coss 102 8 6 4 10 1 2 Crss 100 0 0 100 200 300 400 500 Rev. 2.0 0 100 200 300 400 500 600 V DS [V] V DS [V] page 7 2006-06-19 IPB60R165CP IPB60R165CP Definition of diode switching characteristics Rev. 2.0 page 8 2006-06-19 IPB60R165CP IPB60R165CP PG-TO263-3-2/TO-263-3-5/TO263-3-22 PG-TO263-3-2/TO-263-3-5/TO263-3-22: Outlines Dimensions in mm/inches Rev. 2.0 page 9 2006-06-19 IPB60R165CP IPB60R165CP Published by Infineon Technologies AG 81726 München, Germany © Infineon Technologies AG 2006. All Rights Reserved. Attention please! The information given in this data sheet shall in no event be regarded as a guarantee of conditions or characteristics ("Beschaffenheitsgarantie"). With respect to any examples or hints given herein, any typical values stated herein and/or any information regarding the application of the device, Infineon Technologies hereby disclaims any and all warranties and liabilities of any kind, including without limitation warranties o non-infringement of intellectual property rights of any third party Information For further information on technology, delivery terms and conditions and prices please contact your neares Infineon Technologies Office (www.infineon.com ). Warnings Due to technical requirements components may contain dangerous substances. For information on the types in question please contact your nearest Infineon Technologies Office. Infineon Technologies Components may only be used in life-support devices or systems with the express written approval of Infineon Technologies, if a failure of such components can reasonably be expected to cause the failure of that life-support device or system, or to affect the safety or effectiveness of that device or system. Life support devices or systems are intended to be implanted in the human body, or to support and/or maintain and sustain and/or protect human life. If they fail, it is reasonable to assume that the health of the user or other persons may be endangered. Rev. 2.0 page 10 2006-06-19