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LT1030CS#TR Linear Technology IC LINE DRIVER QUAD LP 14SOIC visit Linear Technology - Now Part of Analog Devices
LT1236BILS8-5#PBF Linear Technology LT1236LS8 - Precision, Low Noise, Low Profile Hermetic Voltage Reference; Package: LCC; Pins: 8; Temperature Range: -40°C to 85°C visit Linear Technology - Now Part of Analog Devices Buy
LT1236AILS8-5#PBF Linear Technology LT1236LS8 - Precision, Low Noise, Low Profile Hermetic Voltage Reference; Package: LCC; Pins: 8; Temperature Range: -40°C to 85°C visit Linear Technology - Now Part of Analog Devices Buy
LTC2246HLX#PBF Linear Technology LTC2246H - 14-Bit, 25Msps 125°C ADC In LQFP; Package: LQFP; Pins: 48; Temperature Range: -40°C to 125°C visit Linear Technology - Now Part of Analog Devices Buy
LTC2226HLX#PBF Linear Technology LTC2226H - 12-Bit, 25Msps 125°C ADC in LQFP; Package: LQFP; Pins: 48; Temperature Range: -40°C to 125°C visit Linear Technology - Now Part of Analog Devices Buy
LTC2758BILX#PBF Linear Technology LTC2758 - Dual Serial 18-Bit SoftSpan IOUT DACs; Package: LQFP; Pins: 48; Temperature Range: -40°C to 85°C visit Linear Technology - Now Part of Analog Devices Buy

Heraeus paste profile

Catalog Datasheet MFG & Type PDF Document Tags

heraeus pd944

Abstract: heraeus pd945 profile of the leads at the immersion point. Fig.4 Applying solder paste by screen printing , thermosetting epoxy resin Heraeus PD944 or Amicon D125F DR for small components, or Heraeus PD945 or Amicon , Philips Semiconductors IC Packages SMD mounting methods Chapter 5 Solder paste is applied to the , the areas where paste is required, is placed over the PC board (see Fig.4). A squeegee is then passed across the screen to force solder paste through the areas in the emulsion and onto the solder
Philips Semiconductors
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heraeus pd944 heraeus pd945 Amicon d125f D125F3 AMICON TSSOP footprint MLC741 MLC742

Heraeus SOLDER PASTE F645

Abstract: heraeus f816 on the package. Figure 1. Reflow Profile for SnPb Solder Paste · · · · · 4 Figure 2. Reflow Profile for SnAgCu Solder Paste The following solder pastes have been used for the evaluation: Lead-free (SAC) Heraeus F645 SA30C5-89M30 (Alloy Sn/Ag/Cu ­ 96.5/3/0.5) Lead (SnPb) Heraeus F816 SN63 , Steam Aging Units placed on Test Board #45. SnAgCu solder paste for lead-free balls, peak temperature , solder paste for lead-free balls, peak temperature 240°C Figure 7. Virgin Units Figure 8. Steam
Texas Instruments
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Heraeus SOLDER PASTE F645 heraeus f816 heraeus F645 SN63-90 Heraeus paste profile Heraeus paste profile F645 SLVA333 SLVA304

Heraeus paste profile

Abstract: PD922 Methods and Qualification Requirements for Surface Mount Solder Attachment, using temperature profile as , classification procedures. The suggested Pb-free solder paste is Sn/Ag/Cu (SAC) The recommended linear reflow profile using Sn/Ag/Cu solder is shown in Fig. 1. Soldering outside of the recommended profile requires , profile o Preheating rate < 1 C/second o Minimum dwell time of 45 seconds above 217 C o Minimum , Solder Paste The customer side PWB should have solder paste printed on with a stencil foil thickness
Lineage Power
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PD922 reflow profile FOR LGA COMPONENTS J-STD-033 J-STD-033A IPC-9701 heraeus AN007-0001 AN07-001

szza026

Abstract: Finishes Profile for SnPbAg Solder Alloy . 9 Reflow Profile for SnAgCu Solder Alloy , solder paste alloys and an OSP PWB surface finish.[10,11] A limited number of NiPdAu-finished units also , SnAgCu solder alloy because this alloy is becoming the predominant Pb-free paste being used.[13] The control paste chosen for comparison was 62Sn/36Pb/2Ag. Melting point and peak reflow temperatures used
Texas Instruments
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szza026 Finishes Cu OSP and Cu SOP IPC-A610C CU-106A IPC-A-610C SZZA026

multicore solder paste

Abstract: JESD22-B111 paste. The solder paste was printed (DEK 265 Horizon) with a 124 µmthick laser drilled stainless steel , 3.0 2.0 (2.6) convection oven (EPM/Heraeus EWOS 5.1 N2) under air atmosphere. Figure 2 shows the structure of the solder interconnections. The temperature profile was set according to the recommendations of the solder paste manufacturer. Temperature inside the components was measured with the help of
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JESD22-B111 multicore solder paste JESD22-b111 drop JEOL 6335F JESD22B111 6335F HUTEPT-13 9512279843/T

JESD22-B111

Abstract: JESD22B111 oven (EPM/Heraeus EWOS 5.1 N2) under air atmosphere. The temperature profile was set according to the recommendations of the solder paste manufacturer. The peak temperature underneath the components was measured , 2) [1]. The circuit boards were assembled using Sn3.8Ag0.7Cu (Multicore) solder paste. The solder paste was printed (DEK 265 Horizon) with a 127 mm thick laser drilled stainless steel stencil and
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LLP48 SN50A AA36 AA-36 super mole AA100