500 MILLION PARTS FROM 12000 MANUFACTURERS

HSMS-000X HSMS-280X/1X/2X HSMS-280A/1A/2A MIL-STD-750 5965-8867E MIL-STD-202 - Datasheet Archive

Reliability Data HSMS-000X HSMS-280X/1X/2X HSMS-280A/1A/2A The following cumulative test results have been obtained from testing

Surface Mount Schottky Diodes Reliability Data HSMS-000X HSMS-000X HSMS-280X/1X/2X HSMS-280X/1X/2X HSMS-280A/1A/2A HSMS-280A/1A/2A The following cumulative test results have been obtained from testing performed at HewlettPackard in accordance with the latest revision of MIL-STD-750 MIL-STD-750. Data was gathered from the product qualification, reliability monitor, and engineering evaluation. For the purpose of this reliability data sheet, a failure is any part which fails to meet the electrical and/or mechanical specification listed in the Hewlett-Packard Communications Components Designer's Catalog. 1. Life Test A. Demonstrated Performance Test Test Conditions Units Tested Total Device Hrs. Total Failed Failure Rate 1%/1K Hrs. High Temp. Rev. Bias (HTRB) VR = 80% VBR, TA = 150°C 804 828,045 0 0 Operating Life (O.L.) TA = 25°C, PFM = 250 mW VR = 80% VBR, 60 Hz 1,068 999,884 0 0 High Temp. Operating Life (HTOL) 10 mA DC, TA = 150°C 250 251,900 0 0 High Temp. Storage (HTS) TA = 150°C 2,917 1,836,660 0 0 B. Failure Rate Prediction The failure rate will depend on the junction temperature of the device. The estimated life at different temperatures is calculated, using the Arrhenius plot with activation energy of 1.33 eV, and listed in the following table. Point[1] 90% Confidence Level[2] Junction Temp. TJ* (°C) MTTF* (Hours) FIT[3] MTTF (Hours) FIT[3] 150 140 130 120 100 75 50 1.8 x 106 4.4 x 106 1.1 x 106 2.9 x 107 2.4 x 108 4.8 x 109 1.5 x 1011 556.0 227.0 91.0 34.0 4.0 0.20 0.007 7.8 x 105 1.9 x 106 4.8 x 106 1.3 x 107 1.0 x 108 2.1 x 109 6.5 x 1010 1282.0 526.0 208.0 77.0 10.0 0.48 0.015 *MTTF data collected in Hermetic and Plastic Packages. *TJ was calculated using a JA of 500°C/W. (Notes on reverse side.) 5965-8867E 5965-8867E 3-96 400 350 4.0 3.0 300 JUNCTION TEMPERATURE, Tj (°C) 1.5 200 Ea = 1.33 eV 1.0 150 0.9 0.8 100 ACTIVATION ENERGY (eV) 2.0 250 0.7 0.6 50 25 10 2 10 3 10 4 10 5 10 6 10 7 10 8 10 9 0.5 MEAN TIME TO FAILURE, MTTF (HRS) Notes: 1. The point MTTF is simply the total device hours divided by the number of failures. 2. The MTTF and failure rate represent the performance level for which there is a 90% probability of the device doing better than the stated value. The confidence level is based on the statistics of failure distribution. The assumed distribution is exponential. This particular distribution is commonly used in describing useful life failures. 3. FIT is defined as Failure in Time, or specifically, failures per billion hours. The relationship between MTTF and FIT is as follows: FIT = 109/(MTTF). C. Example of Failure Rate Calculation At 50°C with a device operating 8 hours a day, 5 days a week, the percent utilization is: % Utilization = (8 hrs/day x 5 days/wk) ÷ 168 hrs/wk 25% Then the point failure rate per year is: (7.0 x 10-12/hr) x (25%) x (8760 hrs/yr) = 1.5 x 10-6% per year Likewise, the 90% confidence level failure rate per year is: (1.5 x 10-11/hr) x (25%) x (8760 hrs/yr) = 3.3 x 10-6% per year 3-97 2. Environmental and Mechanical Tests Test MIL-STD-750 MIL-STD-750 Reference Test Conditions Units Tested Total Failed Solderability 2026 215°C, 5 seconds 500 0 Solder Heat 2031 260°C, 10 seconds 426 0 Resistance to Solvent 1022 4 Solvent Groups 98 0 Autoclave HP GSS 12-109 121°C, 15 PSIG, 96 hrs. 1204 0 Moisture Resistance HP GSS 12-107, Method B 85°C/85% RH, biased, 1000 hrs. 311 0 Thermal Shock 1056 -65/150°C, 5 min dwell, 200 cycles 615 0 Temperature Cycle 1051 -65/150°C, 10 min dwell, 200 cycles 637 0 2.0 pounds minimum 140 0 Lead Integrity 3. Flammability Test (MIL-STD-202 MIL-STD-202, Method 111): Meets Needle Flame Test per UL Category D (Flaming Time