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HMC188MS8 HMC443LP4 - Datasheet Archive
HMC188MS8 HMC188MS8 v02.1201 GaAs MMIC SMT PASSIVE FREQUENCY DOUBLER, 1.25 - 3.0 GHz INPUT Typical Applications Features The HMC188MS8 HMC188MS8 is suitable for: Conversion Loss: 15 dB · Wireless Local Loop Fo, 3Fo, 4Fo Isolation: 45 dB · LMDS, VSAT, and Pt to Pt Radios Input Drive Level: 10 to 20 dBm · UNII & HiperLAN 11 · Test Equipment FREQ. MULTIPLIERS - SMT Functional Diagram General Description The HMC188MS8 HMC188MS8 is a miniature frequency doubler in a plastic 8-lead MSOP package. The suppression of undesired fundamental and higher order harmonics is 45 dB typical with respect to input signal levels. The doubler uses the same diode/balun technology used in Hittite MMIC mixers. The doubler is ideal for high volume applications where frequency doubling of a lower frequency is more economical than directly generating a higher frequency. The passive Schottky diode doubler technology contributes no measurable additive phase noise onto the multiplied signal. Electrical Specifications, TA = +25° C, As a Function of Drive Level Input = +10 dBm Parameter Frequency Range, Input Frequency Range, Output Conversion Loss Min. Typ. Input = +15 dBm Max. Min. Typ. Input = +20 dBm Max. Min. Typ. Max. Units 1.75 - 2.75 1.5 - 2.5 1.25 - 3.0 GHz 3.5 - 5.5 3.0 - 5.0 2.5 - 6.0 GHz 19 22 15 18 16 19 dB FO Isolation (with respect to input level) 45 dB 3FO Isolation (with respect to input level) 43 50 dB 4FO Isolation (with respect to input level) 11 - 16 35 38 45 dB For price, delivery, and to place orders, please contact Hittite Microwave Corporation: 20 Alpha Road, Chelmsford, MA 01824 Phone: 978-250-3343 Fax: 978-250-3373 Order On-line at www.hittite.com HMC188MS8 HMC188MS8 v02.1201 GaAs MMIC SMT FREQUENCY DOUBLER, 1.25 - 3.0 GHz INPUT GaAs Loss @ +15 dBm Drive Level PUMPED MIXER 17 - 25 GHz Conversion MMIC SUB-HARMONICALLY Isolation @ +15 dBm Drive Level* 0 -10 -20 -30 -40 -50 -60 -70 -80 -90 -100 -10 ISOLATION (dB) CONVERSION LOSS (dB) -40C -20 -30 +85C +25C -40 -50 0 1 2 3 4 5 6 7 8 Fo 4Fo 11 3Fo 0 5 10 FREQUENCY (GHz) 15 20 OUTPUT FREQUENCY (GHz) *With respect to input level Output Return Loss vs. Drive Level Input Return Loss vs. Drive Level 0 OUTPUT RETURN LOSS (dB) 0 -5 -10 -15 Input = +15 dBm -20 Input = +20 dBm -25 0 1 2 3 4 5 6 7 Input = +15 dBm -5 Input = +10 dBm -10 -15 -20 Input = +20 dBm -25 8 0 1 2 3 4 5 6 7 8 OUTPUT FREQUENCY (GHz) INPUT FREQUENCY (GHz) Note: Output return loss measured at 2fo, with +10dBm, +15 dBm, and +20 dBm drive levels on input of doubler. Conversion Loss vs. Drive Level 0 Input = +20 dBm CONVERSION LOSS (dB) INPUT RETURN LOSS (dB) Input = +10 dBm FREQ. MULTIPLIERS - SMT 0 -10 -20 Input = +10 dBm -30 Input = +13 dBm -40 Input = +15 dBm -50 0 1 2 3 4 5 6 7 8 OUTPUT FREQUENCY (GHz) For price, delivery, and to place orders, please contact Hittite Microwave Corporation: 20 Alpha Road, Chelmsford, MA 01824 Phone: 978-250-3343 Fax: 978-250-3373 Order On-line at www.hittite.com 11 - 17 v02.1201 HMC188MS8 HMC188MS8 GaAs MMIC SMT FREQUENCY DOUBLER, 1.25 - 3.0 GHz INPUT Absolute Maximum Ratings Input Drive +27 dBm Storage Temperature -65 to +150 °C Operating Temperature -40 to +85 °C ESD Sensitivity (HBM) Class 1A FREQ. MULTIPLIERS - SMT 11 ELECTROSTATIC SENSITIVE DEVICE OBSERVE HANDLING PRECAUTIONS Outline Drawing NOTES: 1. PACKAGE BODY MATERIAL: LOW STRESS INJECTION MOLDED PLASTIC SILICA AND SILICON IMPREGNATED. 2. LEADFRAME MATERIAL: COPPER ALLOY 3. LEADFRAME PLATING: Sn/Pb SOLDER 4. DIMENSIONS ARE IN INCHES [MILLIMETERS]. 5. DIMENSION DOES NOT INCLUDE MOLDFLASH OF 0.15 mm PER SIDE. 6. DIMENSION DOES NOT INCLUDE MOLDFLASH OF 0.25 mm PER SIDE. 7. ALL GROUND LEADS MUST BE SOLDERED TO PCB PF GROUND. 8. CLASSIFIED AS MOISTURE SENSITIVITY LEVEL (MSL) 1. 11 - 18 For price, delivery, and to place orders, please contact Hittite Microwave Corporation: 20 Alpha Road, Chelmsford, MA 01824 Phone: 978-250-3343 Fax: 978-250-3373 Order On-line at www.hittite.com v02.1201 HMC188MS8 HMC188MS8 GaAs MMIC SMT FREQUENCY DOUBLER, 1.25 - 3.0 GHz INPUT Evaluation PCB The circuit board used in the final application should be generated with proper RF circuit design techniques. Signal lines should have 50 ohm impedance while the package ground leads and exposed paddle should be connected directly to the ground plane similar to that shown. The evaluation circuit board shown is available from Hittite upon request. List of Materials Item Description J1 - J3 PC Mount SMA Connector C1 1,000 pF Capacitor, 0603 Pkg. U1 HMC443LP4 HMC443LP4, x4 Active Multiplier PCB* FREQ. MULTIPLIERS - SMT 11 104610 Eval Board * Circuit Board Material: Rogers 4350 For price, delivery, and to place orders, please contact Hittite Microwave Corporation: 20 Alpha Road, Chelmsford, MA 01824 Phone: 978-250-3343 Fax: 978-250-3373 Order On-line at www.hittite.com 11 - 19