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    HLMP-EG15-RU0000 Search Results

    HLMP-EG15-RU0000 Result Highlights (6)

    Part ECAD Model Manufacturer Description Download Buy
    L77HDEG15SOL2RM8 Amphenol Communications Solutions Dsub, Stamped Signal 3A, High Density, Straight PCB Thru Hole, 15 Socket, Flash Gold, M3 Fixed Front Screwlock, Standoff 6.0mm (0.236\\), With Boardlock 4.2mm (0.165\\) Visit Amphenol Communications Solutions
    L717HDEG15POL2RM5C309 Amphenol Communications Solutions Dsub, Stamped Signal 3A, High Density, Straight PCB Thru Hole, 15 Pin, 0.76m (30 in) Gold, M3 Rear Threaded Insert, M3 Threaded Standoff 6.0mm (0.236\\), With Boardlock 4.2mm (0.165\\) Visit Amphenol Communications Solutions
    L177HDEG15SOL2RM8 Amphenol Communications Solutions Dsub, Stamped Signal 3A, High Density, Straight PCB Thru Hole, 15 Socket, 0.38m (15 in) Gold, M3 Fixed Front Screwlock, Standoff 6.0mm (0.236\\), With Boardlock 4.2mm (0.165\\) Visit Amphenol Communications Solutions
    L177HDEG15S Amphenol Communications Solutions Dsub, Stamped Signal 3A, High Density, Straight Soldercup, 15 Socket, 0.38m (15 in) Gold, M3 Rear Threaded Insert, Without Bracket, Without Boardlock Visit Amphenol Communications Solutions
    L77HDEG15SOL2RM5 Amphenol Communications Solutions Dsub, Stamped Signal 3A, High Density, Straight PCB Thru Hole, 15 Socket, Flash Gold, M3 Rear Threaded Insert, M3 Threaded Standoff 6.0mm (0.236\\), With Boardlock 4.2mm (0.165\\) Visit Amphenol Communications Solutions
    L717HDEG15POL2 Amphenol Communications Solutions Dsub, Stamped Signal 3A, High Density, Straight PCB Thru Hole, 15 Pin, Flash Gold, M3 Rear Nut Height 5.9mm, Without Bracket, Without Boardlock Visit Amphenol Communications Solutions