HIP2101 114VDC HIP2100 HIP2101IB HIP2101IR HIP21 1-888-INTERSIL TB379 IRFR120 - Datasheet Archive

 

July 2001 100V/2A Peak, Low Cost, High Frequency Half Bridge Driver HIP2101 (MLFP) TOP VIEW VDD 1 8 LO 2 7 VSS 16 15 14 13 HO 3 6

 

Data Sheet July 2001 100V/2A Peak, Low Cost, High Frequency Half Bridge Driver HIP2101 HIP2101 (MLFP) TOP VIEW VDD 1 8 LO 2 7 VSS 16 15 14 13 HO 3 6 LI HS 4 5 HI Applications VDD LO HB HB HO 12 11 10 9 1 2 3 4 9025 · Drives N-Channel MOSFET Half Bridge · Space Saving SO8 and Low RC-S Micro Leadframe Packages. · Bootstrap Supply Max Voltage to 114VDC 114VDC · On-Chip 1 Bootstrap Diode · Fast Propagation Times Needed for Multi-MHz Circuits · Drives 1000pF Load with Rise and Fall Times Typ. 10ns · TTL Input Thresholds for Improved Noise Immunity · Independent Inputs for Non-Half Bridge Topologies · No Start-Up Problems · Outputs Unaffected by Supply Glitches, HS Ringing Below Ground, or HS Slewing at High dv/dt · Low Power Consumption · Wide Supply Range · Supply Undervoltage Protection · 3 Output Resistance The HIP2101 HIP2101 is a high frequency, 100V Half Bridge N-Channel power MOSFET driver IC available in both 8 lead SOIC and 16 lead MLFP plastic packages. It is equivalent to the HIP2100 HIP2100 with the added advantage of full TTL/CMOS compatible logic input pins. The low-side and high-side gate drivers are independently controlled and matched to 13ns. This gives users total control over dead-time for specific power circuit topologies. Undervoltage protection on both the low-side and high-side supplies force the outputs low. An onchip diode eliminates the discrete diode required with other driver ICs. A new level-shifter topology yields the low-power benefits of pulsed operation with the safety of DC operation. Unlike some competitors, the high-side output returns to its correct state after a momentary undervoltage of the highside supply. HIP2101 HIP2101 (SOIC) TOP VIEW File Number Features · · · · VSS LI Telecom Half Bridge Power Supplies Avionics DC-DC Converters Two-Switch Forward Converters Active Clamp Forward Converters Ordering Information PART NUMBER HIP2101IB HIP2101IB TEMP. RANGE ( oC) -40oC to 85oC 8 Ld SOIC (N) M8.15 HIP2101IR HIP2101IR 5 6 7 8 HS HI -40oC to 85oC 16 Ld MLFP L16.5x5 PACKAGE PKG. NO. Application Block Diagram +12V +100V SECONDARY CIRCUIT VDD HB DRIVE HI HI PWM CONTROLLER LI CONTROL [ /Title (HIP21 HIP21 01) /Subjec t (100V/ 2A Peak, Low Cost, High Freque ncy Half Bridge Driver) /Autho r () /Keyw ords (Intersi l Corpor ation, Semico nducto r, HIP21 HIP21 0X, Halfbridge, half bridge, driver, predriv ers, gate, N- HIP2101 HIP2101 TM HS DRIVE LO HIP2101 HIP2101 VSS 1 HO LO REFERENCE AND ISOLATION CAUTION: These devices are sensitive to electrostatic discharge; follow proper IC Handling Procedures. 1-888-INTERSIL 1-888-INTERSIL or 321-724-7143 | Intersil and Design is a trademark of Intersil Americas Inc. Copyright © Intersil Americas Inc. 2001, All Rights Reserved HIP2101 HIP2101 Functional Block Diagram 2 HB VDD 1 UNDER VOLTAGE 3 HO 4 HS 8 LEVEL SHIFT LO DRIVER HI 5 UNDER VOLTAGE DRIVER LI 6 VSS 7 +48V +12V PWM SECONDARY CIRCUIT HIP 2101 ISOLATION FIGURE 1. TWO-SWITCH FORWARD CONVERTER +48V SECONDARY CIRCUIT +12V PWM HIP 2101 ISOLATION FIGURE 2. FORWARD CONVERTER WITH AN ACTIVE CLAMP 2 HIP2101 HIP2101 Absolute Maximum Ratings Thermal Information Supply Voltage, VDD, V HB-VHS (Notes 1, 2) . . . . . . . . -0.3V to 18V LI and HI Voltages (Note 2) . . . . . . . . . . . . . . . . . . . . . -0.3V to 7.0V Voltage on LO (Note 2) . . . . . . . . . . . . . . . . . . . -0.3V to VDD +0.3V Voltage on HO (Note 2) . . . . . . . . . . . . . . . VHS -0.3V to VHB +0.3V Voltage on HS (Continuous) (Note 2) . . . . . . . . . . . . . . -1V to 110V Voltage on HB (Note 2) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . +118V Average Current in V DD to HB diode . . . . . . . . . . . . . . . . . . . 100mA ESD Classification . . . . . . . . . . . . . . . . . . . . . . . . . . . Class 1 (1kV) Thermal Resistance (Typical) JA (oC/W) SOIC (Note 3) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 160 MLFP on Thermal Conductive Copper (Note 4) . . . . . 35 Max Power Dissipation at 25oC in Free Air (SOIC, Note 3) . 780mW Max Power Dissipation at 25oC in Free Air (MLFP, Note 4). . . .3.5W Storage Temperature Range . . . . . . . . . . . . . . . . . . -65oC to 150oC Junction Temperature Range. . . . . . . . . . . . . . . . . . -55oC to 150oC Lead Temperature (Soldering 10s - Lead Tips Only). . . . . . . 300oC CAUTION: Stresses above those listed in "Absolute Maximum Ratings" may cause permanent damage to the device. This is a stress only rating and operation of the device at these or any other conditions above those indicated in the recommended operating conditions of this specification is not implied. NOTES: 1. The HIP2101 HIP2101 is capable of derated operation at supply voltages exceeding 14V. Figure 16 shows the high-side voltage derating curve for this mode of operation. 2. All Voltages Referenced to Pin 7, VSS Unless Otherwise Specified. 3. JA is measured with the component mounted on a low thermal conductivity test board in free air. See Tech Brief TB379 TB379 for details. 4. JA is measured in free air with the component mounted on a high effective thermal conductivity test board with "direct attach" features. See Tech Brief TB379 TB379. Maximum Recommended Operating Conditions Supply Voltage, VDD . . . . . . . . . . . . . . . . . . . . . . . . +9V to 14.0VDC Voltage on HS . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . -1V to 100V Electrical Specifications Voltage on HS Voltage on HB HS Slew Rate . . . . . . . . . . . . . . . (Repetitive Transient) -5V to 105V VHS +8V to VHS +14.0V and VDD -1V to VDD +100V . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .