|
68418-200HLF
|
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Amphenol Communications Solutions
|
BergStik®, Board to Board connector, Unshrouded Vertical Header, Through Hole, Single Row, 0 Positions, 2.54 mm (0.100in) Pitch. |
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67998-200H
|
|
Amphenol Communications Solutions
|
BergStik®, Board to Board connector, Unshrouded Vertical Header, Through Hole, Double Row, 0 Positions, 2.54 mm (0.100in) Pitch. |
|
|
|
67998-200HLF
|
|
Amphenol Communications Solutions
|
BergStik®, Board to Board connector, Unshrouded Vertical Header, Through Hole, Double Row, 0 Positions, 2.54 mm (0.100in) Pitch. |
|
|
|
LMH6646 MDC
|
|
Texas Instruments
|
2.7V, 650µA, 55MHz Rail-to-Rail Input and Output Amplifiers with Shutdown Option 0-DIESALE -40 to 85 |
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|
LMH6629 MDC
|
|
Texas Instruments
|
Ultra-Low Noise, High-Speed Operational Amplifier with Shutdown 0-DIESALE -40 to 85 |
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OPA2681N1
|
|
Texas Instruments
|
SpeedPlus(TM) Wideband, Current Feedback Operational Amplifier with Disable 14-SOIC |
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