HE6830-A HI123 UL94V-0 - Datasheet Archive

 

MICROELECTRONICS CORP. Spec. No. : HE6830-A Issued Date : 1994.01.25 Revised Date : 1999.08.01 Page No. : 1/2 HI123 NPN EPITAXIAL

 

HI-SINCERITY MICROELECTRONICS CORP. Spec. No. : HE6830-A HE6830-A Issued Date : 1994.01.25 Revised Date : 1999.08.01 Page No. : 1/2 HI123 HI123 NPN EPITAXIAL PLANAR TRANSISTOR Description The HI123 HI123 is designed for high voltage, high speed switching Circuits, and amplifier applications. Features · High speed switching. · Low saturation voltage. · High reliability. Absolute Maximum Ratings (Ta=25°C) · Maximum Temperatures Storage Temperature . -55~+150°C Junction Temperature .+150°C · Maximum Power Dissipation Total Power Dissipation (Tc=25°C) . 20 W · Maximum Voltages and Currents BVCBO Collector to Base Voltage . 500 V BVCEO Collector to Emitter Voltage. 400 V BVEBO Emitter to Base Voltage . 8 V IC Collector Current . 500 mA Characteristics (Ta=25°C) Symbol BVCBO BVCEO ICBO IEBO VCE(sat)1 VCE(sat)2 VBE(sat)1 VBE(sat)2 hFE1 hFE2 hFE3 Min. 500 400 20 12 6 Typ. - Max. 10 10 0.3 0.9 0.9 1.8 65 - Unit V V uA uA V V V V Test Conditions IC=1mA IC=10mA VCB=500V VEB=9V IC=0.1A, IB=10mA IC=0.3A, IB=30mA IC=0.1A, IB=10mA IC=0.3A, IB=30mA VCE=5V, IC=0.3mA VCE=5V, IC=0.5mA VCE=5V, IC=1A HSMC Product Specification HI-SINCERITY Spec. No. : HE6830-A HE6830-A Issued Date : 1994.01.25 Revised Date : 1999.08.01 Page No. : 2/2 MICROELECTRONICS CORP. TO-251 Dimension A B Marking : C D F HSMC Logo Part Number Date Code Product Series Rank Ink Mark G Style : Pin 1.Base 2.Collector 3.Emitter 3 I K E H 2 1 J 3-Lead TO-251 Plastic Package HSMC Package Code : I *:Typical Inches Min. Max. 0.0177 0.0217 0.0354 0.0591 0.0177 0.0236 0.0866 0.0945 0.2520 0.2677 0.2677 0.2835 DIM A B C D E F Millimeters Min. Max. 0.45 0.55 0.90 1.50 0.45 0.60 2.20 2.40 6.40 6.80 6.80 7.20 DIM G H I J K Inches Min. Max. 0.2559 *0.1811 0.0354 0.0315 0.2047 0.2165 Millimeters Min. Max. 6.50 *4.60 0.90 0.80 5.20 5.50 Notes : 1.Dimension and tolerance based on our Spec. dated May. 24,1995. 2.Controlling dimension : millimeters. 3.Maximum lead thickness includes lead finish thickness, and minimum lead thickness is the minimum thickness of base material. 4.If there is any question with packing specification or packing method, please contact your local HSMC sales office. Material : · Lead : 42 Alloy ; solder plating · Mold Compound : Epoxy resin family, flammability solid burning class:UL94V-0 UL94V-0 Important Notice: · All rights are reserved. Reproduction in whole or in part is prohibited without the prior written approval of HSMC. · HSMC reserves the right to make changes to its products without notice. · HSMC semiconductor products are not warranted to be suitable for use in Life-Support Applications, or systems. · HSMC assumes no liability for any consequence of customer product design, infringement of patents, or application assistance. Head Office And Factory : · Head Office (Hi-Sincerity Microelectronics Corp.) : 10F.,No. 61, Sec. 2, Chung-Shan N. Rd. Taipei Taiwan R.O.C. Tel : 886-2-25212056 Fax : 886-2-25632712, 25368454 · Factory 1 : No. 38, Kuang Fu S. Rd., Fu-Kou Hsin-Chu Industrial Park Hsin-Chu Taiwan. R.O.C Tel : 886-3-5983621~5 Fax : 886-3-5982931 · Factory 2 : No. 17-1, Ta-Tung Rd., Fu-Kou Hsin-Chu Industrial Park Hsin-Chu Taiwan. R.O.C Tel : 886-3-5977061 Fax : 886-3-5979220 HSMC Product Specification