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| Part Number | Manufacturer | Description | ||||||
| 1. |  HCFXXXXBEY |
ST Microelectronics | HEX BUFFER/CONVERTERS | 300.05 Kb | 13 Pg. |
| « Previous 1 Next » |
| 1. |  287.72 Kb • 13 Pages |
Abstract: ... HCCXXXXBF HCFXXXXBM1 HCFXXXXBEY HCFXXXXBC1. F. (Ceramic Package) M1. (Micro Package) C1. (Chip Carrier) PIN CONNECTIONS. The HCC4000B, HCC4001B, HCC4002B and HCC4025B (extended temperature ... Labels: HCFXXXXBEY |
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| 2. |  333.53 Kb • 13 Pages |
Abstract: ... HCCXXXXBF HCFXXXXBM1 HCFXXXXBEY HCFXXXXBC1. F. (Ceramic Package) M1. (Micro Package) C1. (Chip Carrier) PIN CONNECTIONS. The HCC4000B, HCC4001B, HCC4002B and HCC4025B (extended temperature ... Labels: HCFXXXXBEY |
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| 3. |  300.04 Kb • 13 Pages |
Abstract: ... HCCXXXXBF HCFXXXXBM1 HCFXXXXBEY HCFXXXXBC1. F. (Ceramic Package) M1. (Micro Package) C1. (Chip Carrier) PIN CONNECTIONS. The HCC4009UB/4010B (extended temperature range) and the HCF4009UB ... Labels: HCFXXXXBEY |
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| 4. |  347.16 Kb • 13 Pages |
Abstract: ... HCCXXXXBF HCFXXXXBM1 HCFXXXXBEY HCFXXXXBC1. F. (Ceramic Package) M1. (Micro Package) C1. (Chip Carrier) PIN CONNECTIONS. The HCC4009UB/4010B (extended temperature range) and the HCF4009UB ... Labels: HCFXXXXBEY |
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