NEW DATABASE - 350 MILLION DATASHEETS FROM 8500 MANUFACTURERS
NEW DATABASE - 350 MILLION DATASHEETS FROM 8500 MANUFACTURERS
| Part | Manufacturer | Description | Samples | Ordering |
| DC-PLCC/SO-6664-D-F-01 | Ironwood Electronics | Device Conversion Adapters; Top Pin Count: 32; Bottom Pin Count: 28; Top Interface: PLCC: AMD AM27C64; Bottom Interface: SO: Harris HS6664RH; Device Specific: yes; Compatible Part 1: N/A; Part Description: Device Converter; | 
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| Catalog Datasheet Results | Type | Document Tags |
| Abstract: of the one-time fee for this software package, Customer receives from Harris Corporation ("Harris , SERINADE TM The right to use this software package is sold only on the condition that the , other rights in software to any person or organization may be granted. 6. Harris reserves the right to , the product to Harris or, with Harris' prior written consent, provide Harris with a certificate of , modification by anyone other than Harris or Harris' authorized representatives. There is no warranty on the ... | Original |
1 pages, |
HARRIS PACKAGE HARRIS datasheet abstract |
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| Abstract: performances include: A CD74FCT244T CD74FCT244T device in a plastic DIP package from Harris Semiconductor and two other , POSITIVE NEGATIVE PACKAGE GROUND LEAD INDUCTANCE RELATIVE GROUND BOUNCE Harris, D Speed , Harris Semiconductor No. AN9646 AN9646 Harris Logic December 1996 Ground Bounce in 8-Bit High , Harris Semiconductor are now available with propagation delay down to 3.6ns (maximum) for some , summarizes the results. The results show that Harris Semiconductor's FCT device has significantly lower ... | Original |
3 pages, |
CD74FCT240T CD74FCT241T CD74FCT244T CD74FCT273T CD74FCT377T CD74FCT540T CD74FCT541* harris CD74FCT544T CD74FCT623T CD74FCT646T CD74FCT652T DE 9646 Ground bounce Harris CMOS Integrated Circuits AN9646 AN9646 abstract |
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| Abstract: Harris Semiconductor No. AN9713 AN9713 Harris Wireless Products March 1997 Using the HFA3663 HFA3663 , applications in the 2.0 to 2.3GHz and 2.3 to 2.7GHz ranges. Manufactured in the Harris UHF1X process, these , outline 20 lead SSOP package ideally suited for PCMCIA card applications. IF_IN: Upconverter mixer , PRE_VCC1 PRE_IN TXM_RF AGC CONTROL Copyright AGC_CTRL © Harris Corporation 1997 PRISMTM and the PRISMTM logo are trademarks of Harris Corporation. 1 Low Transmit Mode LO_BY ... | Original |
2 pages, |
2.45Ghz oscillator circuit HFA3764 HFA3664 HFA3663 FAR-F6CE-2G4500-L2WA diode 1334 2.45Ghz oscillator 9713 harris preamplifier AGC circuit diagram of energy saving device AN9713 AN9713 abstract |
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| Abstract: TEMPERATURE RANGE PACKAGE 48 Lead MQFP PKG. NO. Q48.12 x12-S · Surface Mounting Package , Copyright © Harris Corporation 1996 1 File Number 4109.1 HI3026 HI3026, CXA3026Q CXA3026Q Metric Plastic Quad Flatpack Packages (MQFP) D Q48.12x12-S D1 48 LEAD METRIC PLASTIC QUAD FLATPACK PACKAGE , Harris Semiconductor products are manufactured, assembled and tested under ISO9000 ISO9000 quality systems certification. Harris Semiconductor products are sold by description only. Harris Semiconductor reserves the ... | Original |
2 pages, |
HI3026JCQ HI3026 CXA3026Q HI3026 abstract |
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| Abstract: Pinout PACKAGE HI20206JCP HI20206JCP, CX20206 CX20206 · Low Power Consumption . . . . . . . . . . . . . 360mW (Typ , discharge. Users should follow proper IC Handling Procedures. Copyright © Harris Corporation 1996 1 , 42 LEAD SHRINK DUAL-IN-LINE PLASTIC PACKAGE E1 INDEX AREA 1 2 3 INCHES N/2 SYMBOL , dimensions control. 2. Dimensions A, A1 and L are measured with the package seated in JEDEC seating plane , 0 2/96 All Harris Semiconductor products are manufactured, assembled and tested under ISO9000 ISO9000 ... | Original |
2 pages, |
HI20206JCP HI20206 CX20206 HI20206 abstract |
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| Abstract: Supply Operation Available -20oC HI3086JCQ HI3086JCQ, CXA3086Q CXA3086Q · Surface Mounting Package TEMPERATURE RANGE to +75oC PACKAGE 48 Lead Metric Plastic Quad Flatpack Pinout DVCC2 NC DGND1 , Procedures. Copyright © Harris Corporation 1996 1 File Number 4110 HI3086 HI3086, CXA3086 CXA3086 Metric , PACKAGE INCHES SYMBOL MIN MILLIMETERS MAX MIN MAX NOTES A 0.081 0.100 2.05 , Harris Semiconductor products are manufactured, assembled and tested under ISO9000 ISO9000 quality systems ... | Original |
2 pages, |
HI3086JCQ HI3086 CXA3086Q CXA3086 RBS 2111 HI3086 abstract |
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| Abstract: Lead MQFP Package TEMPERATURE RANGE -20oC to +75oC HI2309JCQ HI2309JCQ, CXD2309Q CXD2309Q PACKAGE 48 Lead , Copyright © Harris Corporation 1996 1 File Number 4118 HI2309 HI2309, CXD2309 CXD2309 Metric Plastic Quad Flatpack Packages (MQFP) D Q48.12x12-S D1 48 LEAD METRIC PLASTIC QUAD FLATPACK PACKAGE INCHES , Harris Semiconductor products are manufactured, assembled and tested under ISO9000 ISO9000 quality systems certification. Harris Semiconductor products are sold by description only. Harris Semiconductor reserves the ... | Original |
2 pages, |
HI2309JCQ HI2309 CXD2309Q CXD2309 HI2309 abstract |
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| Abstract: · Low Glitch Noise TEMPERATURE RANGE -20oC to +75oC HI1178JCQ HI1178JCQ, CXD1178Q CXD1178Q PACKAGE 48 Lead , electrostatic discharge. Users should follow proper IC Handling Procedures. Copyright © Harris Corporation , Q48.12x12-S D1 48 LEAD METRIC PLASTIC QUAD FLATPACK PACKAGE INCHES SYMBOL MIN MILLIMETERS MAX , positions. B A1 0o-10o L 0.10/0.25 0.004/0.010 All Harris Semiconductor products are manufactured, assembled and tested under ISO9000 ISO9000 quality systems certification. Harris Semiconductor products ... | Original |
2 pages, |
HI1178JCQ HI1178 CXD1178 CXD1178Q HI1178 abstract |
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| Abstract: TEMPERATURE RANGE -20oC to +75oC PACKAGE 64 Lead Metric Plastic Quad Flatpack Block Diagram R1 , © Harris Corporation 1996 1 File Number 4117 HI2307 HI2307, CXD2307 CXD2307 Metric Plastic Quad Flatpack Packages (MQFP) D Q64.10x10-S D1 64 LEAD METRIC PLASTIC QUAD FLATPACK PACKAGE INCHES SYMBOL , number of terminal positions. B A1 0o-10o L 0.107/0.177 0.004/0.007 All Harris Semiconductor products are manufactured, assembled and tested under ISO9000 ISO9000 quality systems certification. Harris ... | Original |
2 pages, |
HI2307JCQ HI2307 CXD2307R CXD2307 HI2307 abstract |
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| Abstract: Ordering Information PART NUMBER HI2315JCQ HI2315JCQ, CXD2315Q CXD2315Q TEMP. RANGE -20oC to +75oC PACKAGE 32 , electrostatic discharge. Users should follow proper IC Handling Procedures. Copyright © Harris Corporation , ) Q32.7x7-S D 32 LEAD METRIC PLASTIC QUAD FLATPACK PACKAGE D1 INCHES MILLIMETERS SYMBOL , positions. B A1 0o-10o L 0.077/0.227 0.003/0.009 All Harris Semiconductor products are manufactured, assembled and tested under ISO9000 ISO9000 quality systems certification. Harris Semiconductor products ... | Original |
2 pages, |
HI2315JCQ HI2315 CXD2315Q CXD2315 CXD2306Q HI2315 abstract |
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| Abstract | Saved from | Date Saved | File Size | Type | Download |
| Over 1.1 million files (1986-2013): html articles, reference designs, gerber files, chemical content, spice models, programs, code, pricing, images, circuits, parametric data, RoHS data, cross references, pcns, military data, and more. Please note that due to their age, these files do not always format correctly in modern browsers. Disclaimer. |
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| Packaging Information Harris Corporation's Home Page ¤ Semiconductor's Home Page ¤ Packaging Information Packaging Information ICs - Hermetic Packages ICs - Plastic Packages Discrete Power Packages ICs - Hermetic Packages Ceramic Frit Seal Cerpack Package (Cerpack) Ceramic Dual-In-Line Metal Seal Packages (SBDIP) Ceramic Dual-In-Line Frit Seal Packages (CerDIP) Ceramic Pin Grid Array Packages (CPGA) Ceramic Leadless Chip Carrier Packages (CLCC) Ceramic Metal www.datasheetarchive.com/files/harris/packages/index.htm |
Harris | 15/08/1997 | 5.59 Kb | HTM | index.htm |
| IH5043 IH5043 IH5043 IH5043 Harris Corporation's Home Page ¤ Semiconductor's Home Page ¤ Product GDIP1-T16 GDIP1-T16 GDIP1-T16 GDIP1-T16 (D-2, Configuration A) 16 Lead Ceramic Dual-In-Line Frit Seal Package E16.3 (JEDEC MS-001-BB MS-001-BB MS-001-BB MS-001-BB Issue D) 16 Lead Dual-In-Line Plastic Package M16.3 (JEDEC MS-013-AA MS-013-AA MS-013-AA MS-013-AA Issue C) 16 Lead Wide Body Small Outline Plastic Package Here's where you can find out how to get your free copy of Adobe's acrobat reader . All Harris Semiconductor www.datasheetarchive.com/files/harris/data/fn/fn3/fn3130/index.htm |
Harris | 15/08/1997 | 3.01 Kb | HTM | index.htm |
| DG200 DG200 DG200 DG200, DG201 DG201 DG201 DG201 Harris Corporation's Home Page ¤ Semiconductor's Home Page Package T10.B Mil-Std-1835 MACY1-X10 MACY1-X10 MACY1-X10 MACY1-X10 (A2) 10 Lead Metal Can Package E14.3 (JEDEC MS-001-AA MS-001-AA MS-001-AA MS-001-AA Issue D) 14 Lead Dual-In-Line Plastic Package Here's where you can find out how to get your free copy of Adobe's acrobat reader . All Harris . Harris Semiconductor products are sold by description only. Harris Semiconductor reserves the right to www.datasheetarchive.com/files/harris/data/fn/fn3/fn3115/index.htm |
Harris | 15/08/1997 | 3.01 Kb | HTM | index.htm |
| DG308A DG308A DG308A DG308A, DG309 DG309 DG309 DG309 Harris Corporation's Home Page ¤ Semiconductor's Home Page Package E16.3 (JEDEC MS-001-BB MS-001-BB MS-001-BB MS-001-BB Issue D) 16 Lead Dual-In-Line Plastic Package M16.15 (JEDEC MS-012-AC MS-012-AC MS-012-AC MS-012-AC Issue C) 16 Lead Narrow Body Small Outline Plastic Package Harris Semiconductor products are manufactured, assembled and tested under ISO9000 ISO9000 ISO9000 ISO9000 quality systems certification. Harris Semiconductor products are sold by description only. Harris Semiconductor reserves the www.datasheetarchive.com/files/harris/data/fn/fn3/fn3120/index.htm |
Harris | 15/08/1997 | 3.05 Kb | HTM | index.htm |
| ICM7228 ICM7228 ICM7228 ICM7228 Harris Corporation's Home Page ¤ Semiconductor's Home Page ¤ Product .6 Mil-Std-1835 GDIP1-T28 GDIP1-T28 GDIP1-T28 GDIP1-T28 (D-10, Configuration A) 28 Lead Ceramic Dual-In-Line Frit Seal Package E28.6 (JEDEC MS-011-AB MS-011-AB MS-011-AB MS-011-AB Issue B) 28 Lead Dual-In-Line Plastic Package M28.3 (JEDEC MS-013-AE MS-013-AE MS-013-AE MS-013-AE Issue C) 28 Lead Wide Body Small Outline Plastic Package Here's where you can find out how to get your free copy of Adobe's acrobat reader . All Harris www.datasheetarchive.com/files/harris/data/fn/fn3/fn3160/index.htm |
Harris | 15/08/1997 | 3.03 Kb | HTM | index.htm |
| ICM7170 ICM7170 ICM7170 ICM7170 Harris Corporation's Home Page ¤ Semiconductor's Home Page ¤ Product GDIP1-T24 GDIP1-T24 GDIP1-T24 GDIP1-T24 (D-3, Configuration A) 24 Lead Ceramic Dual-In-Line Frit Seal Package E24.6 (JEDEC MS-011-AA MS-011-AA MS-011-AA MS-011-AA Issue B) 24 Lead Dual-In-Line Plastic Package M24.3 (JEDEC MS-013-AD MS-013-AD MS-013-AD MS-013-AD Issue C) 24 Lead Wide Body Small Outline Plastic Package Here's where you can find out how to get your free copy of Adobe's acrobat reader . All Harris Semiconductor www.datasheetarchive.com/files/harris/data/fn/fn3/fn3019/index.htm |
Harris | 15/08/1997 | 3.01 Kb | HTM | index.htm |
| ICL7621 ICL7621 ICL7621 ICL7621, ICL7641 ICL7641 ICL7641 ICL7641, ICL7642 ICL7642 ICL7642 ICL7642 Harris Corporation's Home Page ¤ Semiconductor's Home Page bytes) Packaging T8.C Mil-Std-1835 MACY1-X8 (A1) 8 Lead Metal Can Package E8.3 (JEDEC MS-001-BA MS-001-BA MS-001-BA MS-001-BA Issue D) 8 Lead Dual-In-Line Plastic Package M8.15 (JEDEC MS-012-AA MS-012-AA MS-012-AA MS-012-AA Issue C) 8 Lead Narrow Body Small Outline Plastic Package Here's where you can find out how to get your free copy of Adobe's acrobat reader . All Harris www.datasheetarchive.com/files/harris/data/fn/fn3/fn3403/index.htm |
Harris | 15/08/1997 | 3.04 Kb | HTM | index.htm |
| DG441 DG441 DG441 DG441, DG442 DG442 DG442 DG442 Harris Corporation's Home Page ¤ Semiconductor's Home Page Package E16.3 (JEDEC MS-001-BB MS-001-BB MS-001-BB MS-001-BB Issue D) 16 Lead Dual-In-Line Plastic Package M16.15 (JEDEC MS-012-AC MS-012-AC MS-012-AC MS-012-AC Issue C) 16 Lead Narrow Body Small Outline Plastic Package Harris Semiconductor products are manufactured, assembled and tested under ISO9000 ISO9000 ISO9000 ISO9000 quality systems certification. Harris Semiconductor products are sold by description only. Harris Semiconductor reserves the www.datasheetarchive.com/files/harris/data/fn/fn3/fn3281/index.htm |
Harris | 15/08/1997 | 3.04 Kb | HTM | index.htm |
| HM-65162 HM-65162 HM-65162 HM-65162 Harris Corporation's Home Page ¤ Semiconductor's Home Page ¤ Product -Std-1835 GDIP1-T24 GDIP1-T24 GDIP1-T24 GDIP1-T24 (D-3, Configuration A) 24 Lead Ceramic Dual-In-Line Frit Seal Package J32.A Mil-Std-1835 CQCC1-N32 CQCC1-N32 CQCC1-N32 CQCC1-N32 (C-12) 32 Pad Ceramic Leadless Chip Carrier Package E24.6 (JEDEC MS-011-AA MS-011-AA MS-011-AA MS-011-AA Issue B) 24 Lead Dual-In-Line Plastic Package Here's where you can find out how to get your free copy of Adobe's acrobat reader . All Harris www.datasheetarchive.com/files/harris/data/fn/fn3/fn3000/index.htm |
Harris | 15/08/1997 | 3.02 Kb | HTM | index.htm |
| DG411 DG411 DG411 DG411, DG412 DG412 DG412 DG412, DG413 DG413 DG413 DG413 Harris Corporation's Home Page ¤ Semiconductor's Home Page -In-Line Frit Seal Package E16.3 (JEDEC MS-001-BB MS-001-BB MS-001-BB MS-001-BB Issue D) 16 Lead Dual-In-Line Plastic Package M16.15 (JEDEC MS-012-AC MS-012-AC MS-012-AC MS-012-AC Issue C) 16 Lead Narrow Body Small Outline Plastic Package Here's where you can find out how to get your free copy of Adobe's acrobat reader . All Harris Semiconductor products are manufactured, assembled and tested under ISO9000 ISO9000 ISO9000 ISO9000 www.datasheetarchive.com/files/harris/data/fn/fn3/fn3282/index.htm |
Harris | 15/08/1997 | 3.06 Kb | HTM | index.htm |