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LT3487EDD#PBF Linear Technology LT3487 - Boost and Inverting Switching Regulator for CCD Bias; Package: DFN; Pins: 10; Temperature Range: -40°C to 85°C visit Linear Technology - Now Part of Analog Devices Buy
LT3472EDD#TR Linear Technology LT3472 - Boost and Inverting DC/DC Converter for CCD Bias; Package: DFN; Pins: 10; Temperature Range: -40°C to 85°C visit Linear Technology - Now Part of Analog Devices Buy
LT3472EDD Linear Technology LT3472 - Boost and Inverting DC/DC Converter for CCD Bias; Package: DFN; Pins: 10; Temperature Range: -40°C to 85°C visit Linear Technology - Now Part of Analog Devices Buy
LT3472EDD#PBF Linear Technology LT3472 - Boost and Inverting DC/DC Converter for CCD Bias; Package: DFN; Pins: 10; Temperature Range: -40°C to 85°C visit Linear Technology - Now Part of Analog Devices Buy
LT3472EDD#TRPBF Linear Technology LT3472 - Boost and Inverting DC/DC Converter for CCD Bias; Package: DFN; Pins: 10; Temperature Range: -40°C to 85°C visit Linear Technology - Now Part of Analog Devices Buy
LT3487EDD Linear Technology LT3487 - Boost and Inverting Switching Regulator for CCD Bias; Package: DFN; Pins: 10; Temperature Range: -40°C to 85°C visit Linear Technology - Now Part of Analog Devices Buy

HALL-EFFECT DEVICES SOLDERING, GLUING, POTTING

Catalog Datasheet MFG & Type PDF Document Tags

HALL-EFFECT DEVICES SOLDERING, GLUING, POTTING, E

Abstract: GH sc-59 GENERAL INFORMATION HALL-EFFECT DEVICES: SOLDERING, GLUING, POTTING, ENCAPSULATING, and LEAD , * Hall-Effect Devices: Soldering, Gluing, Potting, Encapsulating, and Lead Forming Hall-Effect Devices: Soldering, Gluing, Potting, Encapsulating, and Lead Forming plastic body of the part to temperatures in , with the customer. Hall-Effect Devices: Soldering, Gluing, Potting, Encapsulating, and Lead , Devices: Soldering, Gluing, Potting, Encapsulating, and Lead Forming Potting 1. The first rule when
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HALL-EFFECT DEVICES SOLDERING, GLUING, POTTING, E

Abstract: hall effect sensor GENERAL INFORMATION HALL-EFFECT DEVICES: SOLDERING, GLUING, POTTING, ENCAPSULATING, and LEAD , Hall-Effect Devices: Soldering, Gluing, Potting, Encapsulating, and Lead Forming Hall-Effect Devices: Soldering, Gluing, Potting, Encapsulating, and Lead Forming plastic body of the part to temperatures in , with the customer. Hall-Effect Devices: Soldering, Gluing, Potting, Encapsulating, and Lead , Devices: Soldering, Gluing, Potting, Encapsulating, and Lead Forming Potting 1. The first rule when
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N140 ALLEGRO

Abstract: Ultrasonic welding generator Hall-Effect Devices: Soldering, Gluing, Potting, Encapsulating, and Lead Forming plastic body of the part , cooperative effort with the customer. Hall-Effect Devices: Soldering, Gluing, Potting, Encapsulating, and , Application Note 27703.1 GENERAL INFORMATION HALL-EFFECT DEVICES: SOLDERING, GLUING , Devices: Soldering, Gluing, Potting, Encapsulating, and Lead Forming Potting 1. The first rule when , Devices: Soldering, Gluing, Potting, Encapsulating, and Lead Forming 0.030" min 0.030" min
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Loctite 406

Abstract: FLEX THERMOSET COMPOUND Hall-Effect Devices: Soldering, Gluing, Potting, Encapsulating, and Lead Forming plastic body of the part , with the customer. Hall-Effect Devices: Soldering, Gluing, Potting, Encapsulating, and Lead , Application Note 27703.1 GENERAL INFORMATION HALL-EFFECT DEVICES: SOLDERING, GLUING , Devices: Soldering, Gluing, Potting, Encapsulating, and Lead Forming Potting 1. The first rule when , : Soldering, Gluing, Potting, Encapsulating, and Lead Forming and to lengthen the potential moisture
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N140 ALLEGRO

Abstract: HALL-EFFECT DEVICES SOLDERING, GLUING, POTTING, E © 1990, 2002 Allegro MicroSystems, Inc. Hall-Effect Devices: Soldering, Gluing, Potting , Application Note 27703.1B GENERAL INFORMATION HALL-EFFECT DEVICES: SOLDERING, GLUING , Devices: Soldering, Gluing, Potting, Encapsulating, and Lead Forming when using this package and , Devices: Soldering, Gluing, Potting, Encapsulating, and Lead Forming MODULES Allegro offers a , : Soldering, Gluing, Potting, Encapsulating, and Lead Forming 220°C. See reflow chart below. Hand
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Application Note 27701

Abstract: AMS-702 , Application Note 27701; · Hall-Effect Devices: Soldering, Gluing, Potting, Encapsulating, and Lead Forming , Soldering of Surface-Mount Hall-Sensor Devices, Application Note 27703.2. All are provided in Allegro , 1 2 The output of these devices (pin 3) switches low when the magnetic field at the Hall , . Allegro products are not authorized for use as critical components in life-support appliances, devices
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hall current sensor 3A

Abstract: A3134ELT devices is available in: · Hall-Effect IC Applications Guide, Application Note 27701; · Hall-Effect Devices: Soldering, Gluing, Potting, Encapsulating, and Lead Forming, Application Note 27703.1; · , Hall-Sensor Devices, Application Note 27703.2. All are provided in Allegro Electronic Data Book, AMS-702. or , APPLICATIONS INFORMATION The output of these devices (pin 3) switches low when the magnetic field at the , . Allegro products are not authorized for use as critical components in life-support appliances, devices
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A3134 A1201 hall current sensor 3A A3134ELT MH-014E A3240 MH-026

Application Note 27701

Abstract: A1201 , Application Note 27701; · Hall-Effect Devices: Soldering, Gluing, Potting, Encapsulating, and Lead Forming , Soldering of Surface-Mount Hall-Sensor Devices, Application Note 27703.2. All are provided in Allegro , 1 2 The output of these devices (pin 3) switches low when the magnetic field at the Hall , . Allegro products are not authorized for use as critical components in life-support appliances, devices , . 3. Only low-temperature (240°C) reflow-soldering techniques are recommended for SOT89 devices
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Application Note 27701

27631

Abstract: 27701 , Application Note 27701; · Hall-Effect Devices: Soldering, Gluing, Potting, Encapsulating, and Lead Forming , Soldering of Surface-Mount Hall-Sensor Devices, Application Note 27703.2. All are provided in Allegro , 1 2 The output of these devices (pin 3) switches low when the magnetic field at the Hall , . Allegro products are not authorized for use as critical components in life-support appliances, devices , . 3. Only low-temperature (240°C) reflow-soldering techniques are recommended for SOT89 devices
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27631 27701 A 27631 lt 719 PH-003A

HALL-EFFECT DEVICES SOLDERING, GLUING, POTTING

Abstract: 27631 , Application Note 27701; · Hall-Effect Devices: Soldering, Gluing, Potting, Encapsulating, and Lead Forming , Soldering of Surface-Mount Hall-Sensor Devices, Application Note 27703.2. All are provided in Allegro , 1 2 The output of these devices (pin 3) switches low when the magnetic field at the Hall , . Allegro products are not authorized for use as critical components in life-support appliances, devices , . 3. Only low-temperature (240°C) reflow-soldering techniques are recommended for SOT89 devices
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HALL-EFFECT DEVICES SOLDERING, GLUING, POTTING
Abstract: ; · Hall-Effect Devices: Soldering, Gluing, Potting, Encapsulating, and Lead Forming, Application Note , independence and minimal power requirement allow these devices to easily replace reed switches for superior , . -65°C to +170°C Caution: These CMOS devices have input static protection (Class 3) but are still , the mismatching of these resistors. These devices use a proprietary dynamic offset cancellation , sample-andhold circuit and further processed using low-offset bipolar circuitry. This technique produces devices Allegro MicroSystems
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A3212

mh 3212

Abstract: ; · Hall-Effect Devices: Soldering, Gluing, Potting, Encapsulating, and Lead Forming, Application Note , independence and minimal power requirement allow these devices to easily replace reed switches for superior , . -65°C to +170°C Caution: These CMOS devices have input static protection (Class 3) but are still , the mismatching of these resistors. These devices use a proprietary dynamic offset cancellation , sample-andhold circuit and further processed using low-offset bipolar circuitry. This technique produces devices
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mh 3212
Abstract: Hall-effect devices is available in: · Hall-Effect IC Applications Guide , Application Note 27701; · Hall-Effect Devices: Soldering, Gluing, Potting, Encapsulating, and Lead Forming, Application Note 27703.1; · , dependencies, and thermal stress. The two devices differ only in output polarity; the A3361x output current , Hall-Sensor Devices , Application Note 27703.2. More detailed descriptions of the chopper-stabilized circuit , portion of the offset is a result of the mismatching of these resistors. These devices use a proprietary Allegro MicroSystems
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A3361 A3362 A1142 A1143

Allegro Hall-Effect ICs

Abstract: A3163ELT Hall-Effect IC Applications Guide, Application Note 27701; · Hall-Effect Devices: Soldering, Gluing, Potting , 0.0195" 0.50 mm NOM Operation. The output of these devices turns on when a magnetic field (south , , Application Note 27703; · Soldering of Surface-Mount Hall-Sensor Devices, Application Note 27703.2; and · , °C) reflow-soldering techniques are recommended for SOT89 devices. 8 115 Northeast Cutoff, Box 15036 Worcester , life-support appliances, devices, or systems without express written approval. The information included
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A3163ELT A3163EUA Allegro Hall-Effect ICs PH-003-7A

Application Note 27701

Abstract: allegro latchup Hall-Effect IC Applications Guide, Application Note 27701; · Hall-Effect Devices: Soldering, Gluing, Potting , 0.0195" 0.50 mm NOM Operation. The output of these devices turns on when a magnetic field (south , , Application Note 27703; · Soldering of Surface-Mount Hall-Sensor Devices, Application Note 27703.2; and · , °C) reflow-soldering techniques are recommended for SOT89 devices. 8 115 Northeast Cutoff, Box 15036 Worcester , life-support appliances, devices, or systems without express written approval. The information included
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A3163 allegro latchup Application Note 27703

Hall-Effect IC Applications Guide

Abstract: FH-020 ; · Hall-Effect Devices: Soldering, Gluing, Potting, Encapsulating, and Lead Forming, Application Note , SWITCH FUNCTIONAL DESCRIPTION Chopper-Stabilized Technique. These devices use a proprietary dynamic , thermal stress. This technique produces devices that have an extremely stable quiescent Hall output , , then, captured by a sample-and-hold circuit. Operation. The output of these devices turns ON when a , Surface-Mount Hall-Sensor Devices, Application Note 27703.2. More detailed descriptions of the
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Hall-Effect IC Applications Guide FH-020 A3260-- PH-003-5

FH-020

Abstract: A3260 27701; · Hall-Effect Devices: Soldering, Gluing, Potting, Encapsulating, and Lead Forming, Application , . These devices use a proprietary dynamic offset cancellation technique, with an internal high-frequency , overmolding, temperature dependencies, and thermal stress. This technique produces devices that have an , Operation. The output of these devices turns ON when a magnetic field (north pole) perpendicular to the , Soldering of Surface-Mount Hall-Sensor Devices, Application Note 27703.2. More detailed descriptions of the
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A3260 A3260ELHLT A3260EUA A3260LLHLT A3260LUA AN 27701

27631

Abstract: A 27631 27701; · Hall-Effect Devices: Soldering, Gluing, Potting, Encapsulating, and Lead Forming, Application , . These devices use a proprietary dynamic offset cancellation technique, with an internal high-frequency , overmolding, temperature dependencies, and thermal stress. This technique produces devices that have an , Operation. The output of these devices turns ON when a magnetic field (north pole) perpendicular to the , Soldering of Surface-Mount Hall-Sensor Devices, Application Note 27703.2. More detailed descriptions of the
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2 wire LT HALL SENSOR tape hall sensor proximity sensor application notes HALL-EFFECT DEVICES SOLDERING, GLUING, POTTING, E

lt 719

Abstract: 3141 hall sensor Hall-Effect Devices: Soldering, Gluing, Potting, Encapsulating, and Lead Forming, Application Note 27703.1 , devices ideal for use with a simple bar or rod magnet. The four basic devices (3141, 3142, 3143, and 3144 , BRANDED SURFACE Dwg. GH-042-1 1 2 The output of these devices (pin 3) switches low when the , Surface-Mount Hall-Sensor Devices, Application Note 27703.2. 3 All are provided in Allegro Electronic Data , . MH-003E in Dwg. MH-003E mm Devices in the `U' package are NOT RECOMMENDED FOR NEW DESIGN
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A3141 A3142 A3144 3141 hall sensor 3144 hall sensor UGN 3140 sensor a 3140 hall 3141 hall sensor 3144 UGN/UGS3140 UGN/UGS3120 A3209E

A314xxUA-LC

Abstract: LT 3142 Hall-Effect IC Applications Guide, Application Note 27701; · Hall-Effect Devices: Soldering, Gluing, Potting , changes. The unipolar switching characteristic makes these devices ideal for use with a simple bar or rod magnet. The four basic devices (3141, 3142, 3143, and 3144) are identical except for magnetic switch , devices (pin 3) switches low when the magnetic field at the Hall sensor exceeds the operate point , , Application Note 27703; and · Soldering of Surface-Mount Hall-Sensor Devices, Application Note 27703.2. All
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A314xxUA-LC LT 3142 UGN 3030 UGN3175 UGN3177
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