G9911-04 FRC-1509-01 QCC-1795 QR-991101 P99-04-05 RP-119-4 71016N QEH60330 - Datasheet Archive

 

2975 Stender Way, Santa Clara, CA - 95054 PRODUCT/PROCESS CHANGE NOTICE (PCN) DATE: November 18, 1999 MEANS OF DISTINGUISHING

 

Integrated Device Technology, Inc. 2975 Stender Way, Santa Clara, CA - 95054 PRODUCT/PROCESS CHANGE NOTICE (PCN) DATE: November 18, 1999 MEANS OF DISTINGUISHING CHANGED DEVICES: PCN #: G9911-04 G9911-04 Product Affected: All Plastic packages Product Mark Back Mark Manufacturing Location Affected: ALL Date Code Other: "assembly cut-off lot number" Date Effective: February 18, 2000 Contact: Title: Phone #: Fax #: E-mail: PS Tow Corporate Quality / Reliability Manager (408) 492-8206 (408) 727-2328 pstow@idt.com Additional Data: Samples: DESCRIPTION AND PURPOSE OF CHANGE: Die Technology Wafer Fabrication Process Assembly Process Add Ablebond 8340 silver epoxy as qualified die attached material for all Plastic Equipment Packages. Material Testing Manufacturing Site Data Sheet RELIABILITY/QUALIFICATION SUMMARY: Please see attached qualification reports (Attachment 1 & 2) CUSTOMER ACKNOWLEDGMENT OF RECEIPT: IDT records indicate that you require written notification of this change. Please use the acknowledgement below or E-Mail to grant approval or request additional information. If IDT does not receive acknowledgement within 30 days of this notice it will be assumed that this change is acceptable. Customer: Approval for shipments prior to effective date. Name/Date: E-Mail Address: Title: Phone# /Fax# : CUSTOMER COMMENTS: RECD. BY: IDT FRC-1509-01 FRC-1509-01 (Rev. 04) 4/15/99 DATE: Page 1 of 1 Refer to QCC-1795 QCC-1795 ATTACHMENT #1 PCN # G9911-04 G9911-04 Integrated Device Technology, Inc. Reliability Qualification Report I. QUAL DESCRIPTION Qual Report # : QR-991101 QR-991101 Qual Type : NEW ASSEMBLY TECHNIQUE Reference Qual Plan # : P99-04-05 P99-04-05 Qual Objective : QUALIFICATION OF 8340 (RP-119-4 RP-119-4) DIE ATTACH MATERIAL Product Group Device Type Die Size Wafer Lot # Assembly Lot # : SRAM 71016N 71016N 196 x 175 mils 449010431A QEH60330 QEH60330 SRAM 71016N 71016N 196 x 175 mils 449010431A QEH60331 QEH60331 SRAM 71V416Z 71V416Z 155 x 556 mils 449010431A QEH60285 QEH60285 Package Type Body Size Package Thickness Lead Pitch : PH44 (44 Leads TSOP) 10.16 x 18.41 mm 1.0 mm 0.80 mm PH44 (44 Leads TSOP) 10.16 x 18.41 mm 1.0 mm 0.80 mm PH44 (44 Leads TSOP) 10.16 x 18.41 mm 1.0 mm 0.80 mm Lead frame type Lead frame thickness Die Pad Size : : Olin C7025 C7025 5 mils 276 x 236 mils Olin C7025 C7025 5 mils 276 x 236 mils Olin C7025 C7025 5 mils 189 x 575 mils Die Attach Material : 8340 (RP-119-4 RP-119-4 / ABLESTIK) 8340 (RP-119-4 RP-119-4 / ABLESTIK) 8340 (RP-119-4 RP-119-4 / ABLESTIK) Wire Bond : GL2 1.0mil Au (TANAKA) GL2 1.0mil Au (TANAKA) GL2 1.0mil Au (TANAKA) Mold Compound : 2184VA-9 2184VA-9 (ARATRONIC) 2184VA-9 2184VA-9 (ARATRONIC) 2184VA-9 2184VA-9 (ARATRONIC) Lead Finish : SnPb Plating SnPb Plating SnPb Plating Assembly Location : IDT-Penang IDT-Penang IDT-Penang II. QUAL VEHICLE : : : : : : : : Corporate QA/Rel Engineering Integrated Device Technology, Inc. ATTACHMENT #2 PCN # G9911-04 G9911-04 Reliability Qualification Report III. QUALIFICATION MATRIX DATA and RESULTS Assy # #REF! #REF! #REF! PH44 Group B : Package / Process Test PH44 PH44 QL* ACC/SS TEST POINT QUAL RESULTS QUAL RESULTS QUAL RESULTS 0/45 Description B7 X-RAY : IDT Spec. MAC-3012 MAC-3012 (Package voids, Die attach voids and Wire sweep) 0/45 - 0/45 0/45 B11 INTERNAL VISUAL INSPECTION : Mil-Std-883, Method 2010 0/5 - 0/5 0/5 0/5 B12 DIE SHEAR TEST : Mil-Std-883, Method 2019 0/5 - 0/5 0/5 0/5 B13 MOISTURE CLASSIFICATION : IDT Spec QCA-1416 QCA-1416 0/30 Level 3 0/30 0/30 0/30 Precondition (L3) 0/45 0/45 0/33 100 hrs 0/45 0/45 0/33 Precondition (L3) 0/45 0/45 1/45 (b) 0/45 1/44 (c) Group C : Package / Die Integrity Test C2B Description HIGHLY ACCELERATED STRESS TEST (HAST), Vcc max static bias, TA = 130°C/85% RH + 0/45 END POINT ELECTRICAL TEST Group D : Package Design Test D3 Description TEMPERATURE CYCLE (T/C) : Mil-Std-883, Method 1010, Cond. C (-65°C to 150°C) + 0/45 END POINT ELECTRICAL TEST 500 cyc QL* - Quality Level, number of units Notes: S.A.T. - Scanning Acoustic Tomography (a) FA# 4064 (S-7390 S-7390) - Failing due to mechanical stress. Delaminations noted on the corner of the die. Closed as invalid as failure is not related to the die attach material qual. (b) FA# S-7383 S-7383 - 1 reject passed on retest. Closed as invalid. (c) 1 mechanical reject. 1/4