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G42-88/JEDEC

Catalog Datasheet MFG & Type PDF Document Tags

G38-87

Abstract: VSC6464 : Semi-standard G38-87, in a wind tunnel Semi-standard G42-88/JEDEC JC 15.1 #1 FR4 PCB 3"x4.5"x0.62" 0 Notice , , 72, 75, 79, 82, 85, 88, 94-96, 106-109, 119, 122, 128, 132, 133, 139, 142, 152-155, 165-167, 173
Vitesse Semiconductor
Original
VSC6464 208PQFP G52219-0

velocity of propagation of FR4

Abstract: register with 7473 Air Velocity (LFPM) 0 r A measurement method: Semi-standard G3S-S7, in a wind tunnel Semi-standard G42-88/JEDEC JC 15.1 #1 FR4 PCB 3"x4.5"x0.62" Notice i-H Theta(ca) °C/W 21.8 15.8 13.8 10.7 9.5 0 100 , , 82, 85, 88, 94-96, 106-109, 119, 122, 128, 132, 133, 139, 142, 152-155, 165-167, 173, 176, 179, 183
-
OCR Scan
velocity of propagation of FR4 register with 7473 DIN63
Abstract: Velocity (LFPM) ©rA measurement method: Semi-standard G38-87, in a wind tunnel Semi-standard G42-88/JEDEC JC 15.1 #1 FR4 PCB 3â'x4.5â'x0.62â' Notice This document contains information about a , , 69, 72, 75, 79, 82, 85, 88, 94-96, 106-109, 119, 122, 128, 132, 133, 139, 142, 152-155, 165-167 -
OCR Scan

uA 741 IC pin configuration

Abstract: internal circuit diagram of IC 741 Semi-standard G42-88/JEDEC JC 15.1 #1 FR4 PCB 3"x4.5"x0.62" 0 Notice This document contains preliminary , . CLKT 88 O TTL Low Speed Clock. TTL version of above. SP 36, 37, 38 I TTL
Vitesse Semiconductor
Original
VSC6424 uA 741 IC pin configuration internal circuit diagram of IC 741 ic 741 datasheet internal diagram of 741 IC uA 741 pin diagram of ic 741 G52236-0 G42-88/JEDEC

JESD51-7

Abstract: JESD51-1 thermal characterization test standards. Currently, the JEDEC organization is the recognized source for , will always be lower than resistance values for a given device/package combination. Current JEDEC , designed to SEMI standards. This then transitioned to the use of test boards designed to JEDEC , the "JEDEC 1S" board. In addition to the above mentioned JEDEC specifications, JESD51-5 should be , Corporation: The SEMI board and JEDEC (1S) board result in similar JA values. With only top side copper
Intersil
Original
TB379 JESD51-7 JESD51-1 JESD-51 G30-88 JESD-51-1 JESD51 ISO9000

BGA 64 PACKAGE thermal resistance

Abstract: G42-88 Devices Engineering Council (JEDEC), and they are documented in the JESD51 series. In addtion, Testing , SPECIFICATION G42-88: "Thermal Test Board Standardization for Measuring Junction-toAmbient Thermal Resistance
Lattice Semiconductor
Original
BGA 64 PACKAGE thermal resistance 492-Ball

202 ball bga

Abstract: Industries Association (EIA) and Joint Electronic Devices Engineering Council (JEDEC), and they are , thermal test board conforming to SEMI SPECIFICATION G42-88: "Thermal Test Board Standardization for
Lattice Semiconductor
Original
202 ball bga

LQFP-48 thermal pad

Abstract: CQFP 240 JEDEC standard boards. The SEMI boards are vertically mounted and comply with the SEMI standard G42-88 , packaging of that device. The JEDEC boards are horizontally mounted. Each board is made of FR4, is 1.57 , low effect thermal conductivity test board. The JEDEC 4 layer boards are intended to give a near best-case thermal performance value. The JEDEC 4 layer board is made of FR4, is 1.60 mm thick, and consists , 58 8.5 JEDEC 2 (19 × 19 mm) BGA 225 23 1.7 SEMI 2 (23 × 23 mm
Analog Devices
Original
LQFP-48 thermal pad CQFP 240 exposed QFP 144 exposed QFP 128 QFP-128 20 x 14 pad BGA-64 pad

PP-069A

Abstract: A3958 rating or a junction temperature of 150°C. B package, per SEMI G42-88 Specification, TA= 25°C LB package, per SEMI G42-88 Specification, TA= 25°C Range S Fault conditions that produce excessive junction , 6.35 ­0.25 A 1 2 For Reference Only (reference JEDEC MS-001 BE) Dimensions in millimeters Dimensions , millimeters (Reference JEDEC MS-013 AD) Dimensions exclusive of mold flash, gate burrs, and dambar protrusions
Allegro MicroSystems
Original
A3958 PP-069A SOIC127P1030X265-24M

A3958SB

Abstract: A3958 PD B package, per SEMI G42-88 Specification, TA= 25°C 3.1 W Operating Ambient Temperature TA Maximum Junction Temperature TJ(max) Storage Temperature LB package, per SEMI G42-88 , JEDEC MS-001 BE) Dimensions in millimeters 7.62 A 1 2 +0.51 3.30 ­0.38 1.27 MIN 2.54 , millimeters (Reference JEDEC MS-013 AD) Dimensions exclusive of mold flash, gate burrs, and dambar
Allegro MicroSystems
Original
A3958SB A3958SB-T A3958SLB A3958SLBTR-T

IN3313

Abstract: EL5001 of IPC/JEDEC J Std-020B. 1 CAUTION: These devices are sensitive to electrostatic discharge , JEDEC JESD51-7 HIGH EFFECTIVE THERMAL CONDUCTIVITY TEST BOARD - HTSSOP EXPOSED DIEPAD SOLDERED TO PCB , 75 85 100 125 150 FIGURE 16. PACKAGE POWER DISSIPATION vs AMBIENT TEMPERATURE JEDEC JESD51-3 AND SEMI G42-88 (SINGLE LAYER) TEST BOARD 0.7 50 AMBIENT TEMPERATURE (°C) POWER , TEMPERATURE 0 6 800mW 0.8 AMBIENT TEMPERATURE (°C) 0.8 5 JEDEC JESD51-3 LOW EFFECTIVE
Intersil
Original
EL5001 EL5001IL IN3313 EL5001IL-T13 EL5001IL-T7 EL5001ILZ FN7376 MDP0046
Abstract: Pb-free requirements of IPC/JEDEC J STD-020. 1 1 CE VS 8 2 GND IOUT 7 3 RFRE GND 6 , Performance Curves (Continued) SEMI G42-88 SINGLE LAYER TEST BOARD SEMI G42-88 SINGLE LAYER TEST Intersil
Original
EL6201 430MH FN7216 MSOP10 5M-1994

2001 heat sink catalog

Abstract: AN9207 the following references for further information. MIL STD 883 Method 1012.1; JEDEC ENG. Bulletin No. 20, January 1975; 1992 Semi Std. Vol. 4, Methods G30-86, G32-86, G42-88, G43-87 All Intersil
Intersil
Original
AN9207 2001 heat sink catalog

CD laser pickup assembly

Abstract: fn7216 temperatures that meet or exceed the Pb-free requirements of IPC/JEDEC J STD-020. 1 1 CE VS 8 2 , Performance Curves (Continued) SEMI G42-88 SINGLE LAYER TEST BOARD SEMI G42-88 SINGLE LAYER TEST
Intersil
Original
CD laser pickup assembly DVD laser pickup assembly pickup HFM CD Laser pickup HFM EL6201CW-T7 EL6201CW-T7A

EL5001

Abstract: EL5001IL TEMPERATURE (°C) JEDEC JESD51-3 AND SEMI G42-88 (SINGLE LAYER) TEST BOARD 0.6 50 FIGURE 16 , meet or exceed the Pb-free requirements of IPC/JEDEC J STD-020C. 1 CAUTION: These devices are , -300 -2 -1 0 1 2 TIME (10ns/DIV) FIGURE 13. SKEW JEDEC JESD51-7 HIGH EFFECTIVE , 0.8 5 JEDEC JESD51-3 LOW EFFECTIVE THERMAL CONDUCTIVITY TEST BOARD 0.9 3 2.857W 2.5 4 , ) JEDEC JESD51-7 HIGH EFFECTIVE THERMAL CONDUCTIVITY TEST BOARD - QFN EXPOSED DIEPAD SOLDERED TO PCB PER
Intersil
Original
EL5001ILZ-T13 EL5001ILZ-T7 EL5001IRE hssop

G43-87

Abstract: G42-88 the following references for further information. MIL STD 883 Method 1012.1; JEDEC ENG. Bulletin No. 20, January 1975; 1992 Semi Std. Vol. 4, Methods G30-86, G32-86, G42-88, G43-87 9-35 Harris
Harris Semiconductor
Original
semi catalog

CD laser pickup assembly

Abstract: DVD laser pickup assembly exceed the Pb-free requirements of IPC/JEDEC J Std-020B. CAUTION: These devices are sensitive to , Typical Performance Curves (Continued) SEMI G42-88 SINGLE LAYER TEST BOARD SEMI G42-88 SINGLE
Intersil
Original
EL6201CWZ-T7 EL6201CY MDP0038

DVD laser pickup assembly

Abstract: CD laser pickup assembly Pb-free requirements of IPC/JEDEC J STD-020C. 1 IOUT RFREQ 5 RAMP 4 EL6201 (8 , (Continued) SEMI G42-88 SINGLE LAYER TEST BOARD SEMI G42-88 SINGLE LAYER TEST BOARD 0.50 0.60
Intersil
Original
optical Pick-Up head DVD optical pick-up assembly HI SPEED PULSED LASER DIODE DRIVER 70MHz optical interconnect EL6201CY-T13 EL6201CY-T7

G43-87

Abstract: AN9207 the following references for further information. MIL STD 883 Method 1012.1; JEDEC ENG. Bulletin No. 20, January 1975; 1992 Semi Std. Vol. 4, Methods G30-86, G32-86, G42-88, G43-87 All Intersil
Intersil
Original

t-120 tw-k

Abstract: AN792 °C 1. TC1016 SC-70 PCB JEDEC J51-7 Semi G42-88 SC-70 450°C/W AN792 "A Method to , "01" Matte Tin Sn JEDEC JEDEC e3 Microchip 2006 Microchip Technology Inc
Microchip Technology
Original
t-120 tw-k DS21666B
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