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G38-87

Catalog Datasheet MFG & Type PDF Document Tags

Theta JB

Abstract: JC15-1 Freescale Semiconductor, Inc. Thermal Measurement Report Freescale Semiconductor, Inc. Package Description: DATE: 5/8/96 revised 11/18/96 Package: 240 32 x 32 mm QFP Die Down Flag: 10.6 mm Square Leadframe: SIDN 1234625 Die Attach: JMI 2500AN Mold Compound: Sumitomo 7304LC Assembled: ANAM Die: PST6 - 10.16 mm Square Junction to Ambient Thermal Resistance or Theta JA (RJA) was measured per SEMI Test Method G38-87 at 1.5 watts in a horizontal configuration. The test board conforms
Freescale Semiconductor
Original
Theta JB JC15-1 G30-88 EIA/JESD51-2 RXMN60 RBDT20

G30-88

Abstract: Theta JB Thermal Measurement Report Package Description: DATE: 5/8/96 revised 11/18/96 Package: 240 32 x 32 mm QFP Die Down Flag: 10.6 mm Square Leadframe: SIDN 1234625 Die Attach: JMI 2500AN Mold Compound: Sumitomo 7304LC Assembled: ANAM Die: PST6 - 10.16 mm Square Junction to Ambient Thermal Resistance or Theta JA (RJA) was measured per SEMI Test Method G38-87 at 1.5 watts in a horizontal configuration. The test board conforms to EIA/JESD 51-3; it is a single layer 115x102 mm board designed to
Motorola
Original
QFP PACKAGE thermal resistance die down G-38-87 Theta-J JC JB jt QFP PACKAGE thermal resistance 32 QFP PACKAGE thermal resistance

202 ball bga

Abstract: documented in the JESD51 series. In addtion, Testing was performed per SEMI TEST METHOD G38-87: "Still and
Lattice Semiconductor
Original
202 ball bga G42-88

BGA 64 PACKAGE thermal resistance

Abstract: G42-88 was performed per SEMI TEST METHOD G38-87: "Still and Forced-Air Junction-toAmbient Thermal
Lattice Semiconductor
Original
BGA 64 PACKAGE thermal resistance 492-Ball

G42-88

Abstract: was performed per SEMI TEST METHOD G3887: "Still and Forced-Air Junction-to-Ambient Thermal
Lattice Semiconductor
Original

G42-88

Abstract: SEMI TEST METHOD G3887: "Still and Forced-Air Junction-to-Ambient Thermal Resistance Measurements of
Lattice Semiconductor
Original

FP4451

Abstract: Theta JB Ambient Thermal Resistance or Theta JA (RqJA) was measured per SEMI Test Method G38-87 at 3 watts in a
Freescale Semiconductor
Original
DCDA37480-M014-001 R1004 FP4451 2330B 2332B hysol adhesive 698-100AB 304-TBGA hysol E04480002-0-50

G42-88

Abstract: to "MIL-M-38510, Appendix C." Testing was performed per SEMI TEST METHOD G3887: "Still and
Lattice Semiconductor
Original

Theta-JC QFP die down

Abstract: G30-88 Freescale Semiconductor, Inc. Thermal Measurement Report Freescale Semiconductor, Inc. Package Description: DATE: 5/8/96 revised 11/18/96 Package: 240 32 x 32 mm QFP Die Down Flag: 10.6 mm Square Leadframe: SIDN 1234625 Die Attach: JMI 2500AN Mold Compound: Sumitomo 7304LC Assembled: ANAM Die: PST6 - 10.16 mm Square Junction to Ambient Thermal Resistance or Theta JA (RJA) was measured per SEMI Test Method G38-87 at 1.5 watts in a horizontal configuration. The test board conforms
Freescale Semiconductor
Original
Theta-JC QFP die down

JESD51-7

Abstract: JESD51-1 ] SEMI G38-87, Still and forced air junction-to-ambient thermal resistance measurements. [12] SEMI G42
Intersil
Original
TB379 JESD51-7 JESD51-1 JESD-51 JESD-51-1 JESD51-5 ISO9000

mark EA SOT23-5

Abstract: rca sot23-5 resistance data that was collected using the 2-layer method described in the SEMI G38-87 standard , . SEMI G38-87, Still and forced air junction-toambient thermal resistance measurements. 10. SEMI G42
Microchip Technology
Original
AN792 mark EA SOT23-5 rca sot23-5 MARK RCA SOT23-5 thermal resistance standards microchip circuit collection 2L SOT23-5 11F-3 DK-2750 D-81739 D-82152 DS00792A-
Abstract: thermal resistance. 2. Per SEMI G38-87. 3. Indicates the average thermal resistance between the die and , board thermal resistance. 2. Per SEMI G38-87. 3. Indicates the average thermal resistance between the -
OCR Scan
MCM69P819 69P819 MCM69P819ZP4 MCM69P819ZP4R MCM69P819TQ4 MCM69P819TQ4R

SPEC-883 cold plate method

Abstract: G-38-87 thermal resistance. 2. Per SEMI G38-87. 3. Indicates the average thermal resistance between the die and , , board population, and board thermal resistance. 2. Per SEMI G38-87. 3. Indicates the average thermal
-
OCR Scan
SPEC-883 cold plate method SPEC-883 5bw 78 MCM69F737 69F737 MCM69F737ZP7 MCM69F737TQ7 MCM69F737ZP8 MCM69F737ZP8R
Abstract: population, and board thermal resistance. 2. Per SEMI G38-87. 3. Indicates the average thermal resistance , population, and board thermal resistance. 2. Per SEMI G38-87. 3. Indicates the average thermal resistance -
OCR Scan
MCM69P737 69P737 MCM69P737ZP4 MCM69P737ZP4R MCM69P737TQ4 MCM69P737TQ4R
Abstract: population, and board thermal resistance. 2. Per SEMI G38-87. 3. Indicates the average thermal resistance , population, and board thermal resistance. 2. Per SEMI G38-87. 3. Indicates the average thermal resistance -
OCR Scan
MCM69F819 69F819 MCM69F819ZP7 MCM69F819TQ7 MCM69F81 MCM69F819ZP8

LQFP-48 thermal pad

Abstract: CQFP 240 Thermal Characteristics of IC Assembly method for using this board is specified by the SEMI standard G38-87. These standards are available in the SEMI International Standards book, Volume 4, for packaging. INTRODUCTION The purpose of this document is to provide a centralized listing of package thermal characteristics (Junction-toAmbient and Junction-to-Case). This listing is not specific to individual devices sold by Analog Devices; it is representative of typical values for a given package and
Analog Devices
Original
LQFP-48 thermal pad CQFP 240 exposed QFP 144 exposed QFP 128 QFP-128 20 x 14 pad BGA-64 pad
Abstract: Materials International) G38-87 in natural convection. 2. Junction-to-case thermal resistance is based on -
OCR Scan
Abstract: ) temperature, ambient temperature, air flow, board population, and board thermal resistance. 2. Per SEMI G38-87 -
OCR Scan
MCM69Q618 A0-A15 69Q618 MCM69Q618TQ6 MCM69Q618TQ8 MCM69Q618TQ10

SPEC-883 cold plate method

Abstract: MCM67Q709/MCM67B618 , air flow, board population, and board thermal resistance. 2. Per SEMI G38-87. 3. Indicates the average
-
OCR Scan
MCM67Q709/MCM67B618 vd 5205 MCM69D618 69D618 MCM69D618TQ6 MCM69D61BTQ6R MCM69D618TQ8 MCM690618TQ8R

G38-87

Abstract: VSC6464 : Semi-standard G38-87, in a wind tunnel Semi-standard G42-88/JEDEC JC 15.1 #1 FR4 PCB 3"x4.5"x0.62" 0 Notice
Vitesse Semiconductor
Original
VSC6464 208PQFP G52219-0

K2218

Abstract: SPEC-883 ) temperature, ambient temperature, air flow, board population, and board thermal resistance. 2. Per SEMI G38­87 , , and board thermal resistance. 2. Per SEMI G38­87. 3. Indicates the average thermal resistance
Freescale Semiconductor
Original
K2218 MCM69F819ZP11 MCM69F819ZP8R MCM69F819TQ8 MCM69F819TQ8R MCM69F819/D

MCM69F737

Abstract: MCM69F737TQ8 ) temperature, ambient temperature, air flow, board population, and board thermal resistance. 2. Per SEMI G38­87 , , and board thermal resistance. 2. Per SEMI G38­87. 3. Indicates the average thermal resistance
Freescale Semiconductor
Original
MCM69F737TQ8 MCM69F737TQ8R MCM69F737ZP11 MCM69F737/D

MCM69F819

Abstract: MCM69F819TQ8 ) temperature, ambient temperature, air flow, board population, and board thermal resistance. 2. Per SEMI G38­87 , , and board thermal resistance. 2. Per SEMI G38­87. 3. Indicates the average thermal resistance
Motorola
Original

MCM69P819ZP4

Abstract: MCM69P819ZP4R ) temperature, ambient temperature, air flow, board population, and board thermal resistance. 2. Per SEMI G38­87 , , and board thermal resistance. 2. Per SEMI G38­87. 3. Indicates the average thermal resistance
Freescale Semiconductor
Original
MCM69P819/D

MCM69P819

Abstract: MCM69P819TQ4 temperature, air flow, board population, and board thermal resistance. 2. Per SEMI G38­87. 3. Indicates the , thermal resistance. 2. Per SEMI G38­87. 3. Indicates the average thermal resistance between the die and
Motorola
Original

MCM69P737

Abstract: MCM69P737TQ4 resistance. 2. Per SEMI G38­87. 3. Indicates the average thermal resistance between the die and the printed , , board population, and board thermal resistance. 2. Per SEMI G38­87. 3. Indicates the average thermal
Motorola
Original
MCM69P737/D

SPEC-883 cold plate method

Abstract: MCM69F737ZP8R ) temperature, ambient temperature, air flow, board population, and board thermal resistance. 2. Per SEMI G38­87 , , and board thermal resistance. 2. Per SEMI G38­87. 3. Indicates the average thermal resistance
Motorola
Original

MCM69P737

Abstract: MCM69P737TQ4 , ambient temperature, air flow, board population, and board thermal resistance. 2. Per SEMI G38­87. 3 , , and board thermal resistance. 2. Per SEMI G38­87. 3. Indicates the average thermal resistance
Motorola
Original

G38-87

Abstract: temperature, air flow, board population, and board thermal resistance. 2. Per SEMI G38-87. 3. Indicates the , temperature, air flow, board population, and board thermal resistance. 2. Per SEMI G38-87. 3. Indicates the
-
OCR Scan
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