500 MILLION PARTS FROM 12000 MANUFACTURERS

DATASHEET SEARCH ENGINE

Search Stock

Shift+Click on the column header for multi-column sorting 
Part
Manufacturer
Supplier
Stock
Best Price
Price Each
Ordering
Part : K1FR-4E11DY6 Supplier : ABB Manufacturer : Newark element14 Stock : - Best Price : $622.50 Price Each : $764.5400
Shipping cost not included. Currency conversions are estimated. 

FR4 epoxy dielectric constant 4.2

Catalog Datasheet MFG & Type PDF Document Tags
Abstract: absorption. The most widely used dielectric material for PCBs is FR-4, a glass laminate with epoxy resin that meets a wide variety of processing conditions. The dielectric constant for FR-4 is between 4.1 , values of W = 9 mil, H = 24 mil, T = 1.4 mil, dielectric constant and (FR-4) = 4.1 with the stripline , dielectric construction material. Dielectric material can be assigned a dielectric constant ( r) that is , dielectric (F/m). Each PCB substrate has a different relative dielectric constant. The dielectric constant Altera
Original
FR4 epoxy dielectric constant 4.4 permittivity FR 4 PCB JTAG series termination resistors permittivity FR 4 permittivity FR 4 Printed circuit board SII52012-1
Abstract: material. Dielectric material can be assigned a dielectric constant (r) that is related to the force (i.e , Board Layout Guidelines Each PCB substrate has a different relative dielectric constant. The dielectric constant is the permittivity of a relative to that of empty space (i.e., Equation 2). Equation 2: o r = Where r = dielectric constant, = permittivity (F/m). o = permittivity of empty space (F/m), The dielectric constant compares the effect of an insulator on the Altera
Original
FR4 epoxy dielectric constant 3.2 relative permittivity copper
Abstract: construction material. Dielectric material can be assigned a dielectric constant (r) that is related to the , constant. The dielectric constant is the permittivity of a relative to that of empty space (i.e., Equation 2). Equation 2: o r = Where r = dielectric constant, = permittivity (F/m). o = permittivity of empty space (F/m), The dielectric constant compares the effect of an insulator on the , loss tangent value for FR-4 and GETEK materials. The most widely used dielectric material for PCBs is Altera
Original
800-EPLD
Abstract: construction material. Dielectric material can be assigned a dielectric constant (r) that is related to the , constant. The dielectric constant is the permittivity of a relative to that of empty space (i.e., Equation 2). Equation 2: o r = Where r = dielectric constant, o = permittivity of empty space (F/m), = permittivity (F/m). The dielectric constant compares the effect of an insulator on the , loss tangent value for FR-4 and GETEK materials. The most widely used dielectric material for PCBs is Altera
Original
loss tangent of FR4 FR4 epoxy dielectric Dielectric constant FR4
Abstract: absorption. The most widely used dielectric material for PCBs is FR-4, a glass laminate with epoxy resin that meets a wide variety of processing conditions. The dielectric constant for FR-4 is between 4.1 , values of W = 9 mil, H = 24 mil, T = 1.4 mil, dielectric constant and (FR-4) = 4.1 with the stripline , construction material. Dielectric material can be assigned a dielectric constant ( r) that is related to the , ). Each PCB substrate has a different relative dielectric constant. The dielectric constant is the Altera
Original
EP2S15 EP2S30 EP2S60 fbga Substrate design guidelines relative permittivity of fr4 FR4 4.9 dielectric constant FR4 dielectric constant 4.9 FBGA 63 Socket MS 034 aaj SII52010-4
Abstract: . Test Method 3Mâ"¢ Bonding Film AF111 Dielectric Constant 4.2 @ 1 kilohertz 4.0 @ 10 , , 2004 3Mâ"¢ Bonding Film AF111 is an epoxy, thermoset film adhesive developed for structural bonding of metals and high-strength plastic materials (epoxy and phenolic). Bonding Film AF111 must be , Resin Epoxy Thickness 10 mil (0.25 mm) Tack Moderate Color Off-White , psi FR-4 (solvent wiped) 1150 psi LCP (solvent wiped) 300 psi Polyimide Film 1750 3M Electronics Markets Materials
Original
Abstract: 3 Epoxy and Hot Melt Adhesives for Electronics Products and Specifications 3M Epoxy and Hot Melt Adhesives have the characteristics an TM 3M Epoxy and Hot Melt Specifications Typical , -HD Epoxy Epoxy Epoxy Epoxy Epoxy Epoxy Epoxy Epoxy Epoxy Epoxy Epoxy Epoxy Epoxy Epoxy Epoxy Epoxy , 40 min. @ 121ºC or 10 min. @ 149ºC or 5 min. @ 177ºC Scotch-Weld One-Part Epoxy Adhesives Scotch-Weld Two-Part Epoxy Adhesives 2214 Hi-Flex 2214 NMF 2290 3748 Dry 15 min. @ 121ºC and Cure 30 min 3M Electronic Markets Materials
Original
DP-190 DP-420 DOD-A-82720 DP-100 Plus DP270 3M DP100 DP-100 DP-125 DP-270 DP-460
Abstract: inferred from the following table, which shows the dielectric constant ranges of the various materials used in each type. Note that tantalum pentoxide has a dielectric constant of 26, some three times , , and the dielectric constant of the insulating material between the plates. COMPARISON OF CAPACITOR , Porcelain Mica Aluminum Oxide Tantalum Pentoxide Ceramic e DIELECTRIC CONSTANT 1.0 2.0 - 6.0 2.1 , the thickness of the tantalum pentoxide film. As the dielectric constant of the tantalum pentoxide Vishay Sprague
Original
marking data code vishay capacitor 293d SPRAGUE Film Capacitors 225 tantalum pentoxide dielectric strength 893D 593D 298D
Abstract: core's dielectric is a cured (hardened) fiberglass-weave material with epoxy resin that acts as an , selection process: "Relative Dielectric Constant" "Loss Tangent" on page 3 "Fiberglass Weave Composition" on page 6 "Skin Effect" on page 7 Relative Dielectric Constant The relative dielectric constant (r) is a measure of a material's ability to be polarized by an electric field , dielectric constant varies with frequency. Material datasheets often refer to this parameter as Dk. Low r or Altera
Original
AN-613-1 Nelco 4000-13 MEGTRON 6 370HR isola 370HR Nelco 4000-13 si Isola FR406
Abstract: dielectric constant ranges of the various materials used in each type. Note that tantalum pentoxide has a dielectric constant of 26, some three times greater than that of aluminum oxide. This, in addition to the , conducting plates, the distance between the plates, and the dielectric constant of the insulating material , Ceramic e DIELECTRIC CONSTANT 1.0 2.0 to 6.0 2.1 to 6.0 2.2 to 2.3 2.7 to 2.8 3.8 to 4.4 4.8 to , . As the dielectric constant of the tantalum pentoxide is high, the capacitance of a tantalum Vishay Sprague
Original
Abstract: MHz. More precisely, the BT/Epoxy dielectric layer offers enhanced characteristics compared to FR4 , RO4003 dielectric layer (Hydrocarbon/Wovenglass) Layer thickness = 200 um Dielectric constant = 3.4 , return Layer 4 BT/Epoxy dielectric layer Layer thickness = 630 mm Layer 5 Copper layer Copper thickness = 35 um Lower ground plane (board mechanical rigidity) Layer 6 BT/Epoxy dielectric , /Epoxy dielectric layers (layers 4 and 6). Considering the severe mechanical constraints due to the Atmel
Original
MC100EL16 meander line PCB TS8308500 TS8308500GL TSX8308500GL TSEV8308500 2165C
Abstract: 900MHz - Test board : FR4 glass epoxy board, dielectric constant = 4.5, thickness = 0.8 mm - Test Tachyonics
Original
DRF1601 smd transistor js UHF POWER TRANSISTOR NPN medium power transistor in a smd power transistor PL SOT223 900MH
Abstract: inferred from the following table, which shows the dielectric constant ranges of the various materials used in each type. Note that tantalum pentoxide has a dielectric constant of 26, some three times , , and the dielectric constant of the insulating material between the plates. COMPARISON OF CAPACITOR , Porcelain Mica Aluminum Oxide Tantalum Pentoxide Ceramic e DIELECTRIC CONSTANT 1.0 2.0 - 6.0 2.1 , the thickness of the tantalum pentoxide film. As the dielectric constant of the tantalum pentoxide Vishay Sprague
Original
sprague catalog SPRAGUE MOLDED CERAMIC capacitor SILVER MICA capacitor SPRAGUE 047 vishay sprague ceramic cap military capacitor codes mica
Abstract: dielectric constant is 4.5 at 1 MHz. The BT/Epoxy dielectric has enhanced characteristics compared to FR4 Epoxy dielectric, namely: ­ higher operating temperature value: 170° C (125° C for FR4), ­ better , traces. The RO4003 dielectric constant is typically 3.4 at 10 GHz. The BT/Epoxy layer is chosen because , VPLUSDOUT Layer 4 BT/Epoxy dielectric layer Layer thickness = 0.4 mm Layer 5 Copper layer Copper thickness = 35 um Power plane: VEE, VCC, VTT, GND Layer 6 BT/Epoxy dielectric layer Layer Atmel
Original
Radiall r112 analog/DIODE MA Radiall R125 620 DIODE g8 Radiall R125 2108d TSEV81102G0 2108D
Abstract: RO4003 dielectric constant is typically 3.4 at 10 GHz. The BT/Epoxy layer is chosen because of its , is 4.5 at 1 MHz. The BT/Epoxy dielectric has enhanced characteristics compared to FR4 Epoxy , Layer 1 Copper layer Layer thickness = 200 um Dielectric constant = 3.4 at 10 GHz -0.044 dB/inch , plane: VEE, VCC, VTT, GND Layer 6 BT/Epoxy dielectric layer Layer thickness = 1.0 mm Layer 7 , by a low insertion loss dielectric (RO4003) layer (layer 2) and by a BT/Epoxy dielectric layer Atmel
Original
TS81102G0 TSEV8388BG atmel 1042 TS8388B TSEV83102G0 2108E AT76C451BCMY-EK2
Abstract: constant is 4.5 at 1 MHz. The BT/epoxy dielectric has enhanced characteristics compared to the FR4 epoxy , Dielectric constant = 3.4 at 10 GHz -0.044 dB/inch loss at 2.5 GHz -0.018 dB/inch loss at 18 GHz Layer 3 , Layer 4 BT/epoxy dielectric layer Layer thickness = 0.4 mm Layer 5 Copper layer Copper thickness = 35 um Power plane: VEE, VCC, VTT, GND Layer 6 BT/epoxy dielectric layer Layer thickness , insertion loss dielectric (RO4003) layer (layer 2) and BT/epoxy dielectric layers (layers 4 and 6). Atmel
Original
TSEV81102G0FS 5362b TSEV83102G0BXX TSEV83102G0BGL TSEV81102G0TPZR3 TS81102G0FS 5362B
Abstract: . The kit uses FR4 epoxy dielectric material, whose relative dielectric constant is between 4.1 and 4.9 , copper) (microstrip signals) Epoxy FR4 Dielectric layer thickness = 0.011" Copper Layer 2 Copper thickness = 0.0014" (1 oz copper) (50 microstrip return; ground plane) Epoxy FR4 Dielectric , return; ground plane) Epoxy FR4 Dielectric layer thickness = 0.011" Copper Layer 4 Copper thickness = 0.0014" (1 oz copper) (VCC/VTT power plane) Epoxy FR4 Dielectric layer thickness = 0.011 Maxim Integrated Products
Original
MAX101 FR4 dielectric j5b6 J5-A25 MC100E116 MAX412CPA MX580KH 250MH MAX101EVKIT-CFR MAX10
Abstract: constant is 4.5 at 1 MHz. The BT/epoxy dielectric has enhanced characteristics compared to the FR4 epoxy , Dielectric constant = 3.4 at 10 GHz -0.044 dB/inch loss at 2.5 GHz -0.018 dB/inch loss at 18 GHz Layer 3 , VPLUSDOUT Layer 4 BT/epoxy dielectric layer Layer thickness = 0.4 mm Layer 5 Copper layer Copper thickness = 35 um Power plane: VEE, VCC, VTT, GND Layer 6 BT/epoxy dielectric layer Layer , insertion loss dielectric (RO4003) layer (layer 2) and BT/epoxy dielectric layers (layers 4 and 6). Atmel
Original
BT 159 5362A cqfp package outline TSEV8388BGL
Abstract: dielectric constant is 4.5 @ 1 MHz. More precisely, the BT / Epoxy dielectric layer offers enhanced , : Copper layer Layer 4 : BT / Epoxy dielectric layer Layer 5 : Copper layer Layer 6 : BT / Epoxy , lines DC signals traces (GORB, GAIN, DIODE) Layer thickness = 200 um dielectric constant = 3.4 @ 10 , by a low insertion loss dielectric layer (RO4003) (layer 2) and two parallel BT/Epoxy dielectric , the routing of the 50 ohms impedance signal traces. (The RO4003 typical dielectric constant is 3.4 @ Atmel
Original
TSEV8388BF TS8388BF CQFP68 HP16500C 10 GSPS ADC FR4 TSEV8388BFS HP8665
Abstract: microstrip lines occupy layers 1 and 3, with layer 2 void. The kit uses FR4 epoxy dielectric material, whose relative dielectric constant is between 4.1 and 4.9. The nominal design is 0.0014 inch (0.0355mm) foil thickness for each copper layer, and 0.011 inch (0.28mm) dielectric thickness between layers. The 50 , = 0.0014" (1 oz copper) (DC signal layer) Copper Layer 1 Epoxy FR4 Copper Layer 2 Epoxy FR4 Copper Layer 3 Epoxy FR4 Copper Layer 4 Epoxy FR4 Copper Layer 5 Epoxy FR4 Copper Layer 6 Figure 1 Maxim Integrated Products
Original
J5-A15 J5-A22 J5C3 U24E MAX101A MAX101/MAX101A
Showing first 20 results.