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PMP5585 Texas Instruments Constant Input Current 400mA Cap Charger visit Texas Instruments
UCC28701DBVR Texas Instruments Constant-Voltage, Constant-Current PWM With Primary-Side Regulation 6-SOT-23 -20 to 125 visit Texas Instruments
UCC28710D Texas Instruments Constant-Voltage, Constant-Current PWM Controller with Primary-Side Regulation 7-SOIC -40 to 125 visit Texas Instruments Buy
UCC28713D Texas Instruments Constant-Voltage, Constant-Current Controller with Primary-Side Regulation 7-SOIC -40 to 125 visit Texas Instruments
UCC28712D Texas Instruments Constant-Voltage, Constant-Current Controller with Primary-Side Regulation 7-SOIC -40 to 125 visit Texas Instruments
UCC28701DBVT Texas Instruments Constant-Voltage, Constant-Current PWM With Primary-Side Regulation 6-SOT-23 -20 to 125 visit Texas Instruments Buy

FR4 epoxy dielectric constant 4.2

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FR4 epoxy dielectric constant 4.2

Abstract: FR4 epoxy dielectric constant 4.4 absorption. The most widely used dielectric material for PCBs is FR-4, a glass laminate with epoxy resin that meets a wide variety of processing conditions. The dielectric constant for FR-4 is between 4.1 , values of W = 9 mil, H = 24 mil, T = 1.4 mil, dielectric constant and (FR-4) = 4.1 with the stripline , dielectric construction material. Dielectric material can be assigned a dielectric constant ( r) that is , dielectric (F/m). Each PCB substrate has a different relative dielectric constant. The dielectric constant
Altera
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relative permittivity copper

Abstract: FR4 epoxy dielectric constant 3.2 material. Dielectric material can be assigned a dielectric constant (r) that is related to the force (i.e , Board Layout Guidelines Each PCB substrate has a different relative dielectric constant. The dielectric constant is the permittivity of a relative to that of empty space (i.e., Equation 2). Equation 2: o r = Where r = dielectric constant, = permittivity (F/m). o = permittivity of empty space (F/m), The dielectric constant compares the effect of an insulator on the
Altera
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FR4 dielectric constant and loss tangent at 2.4 G

Abstract: FR4 substrate epoxy dielectric constant 4.4 construction material. Dielectric material can be assigned a dielectric constant (r) that is related to the , constant. The dielectric constant is the permittivity of a relative to that of empty space (i.e., Equation 2). Equation 2: o r = Where r = dielectric constant, = permittivity (F/m). o = permittivity of empty space (F/m), The dielectric constant compares the effect of an insulator on the , loss tangent value for FR-4 and GETEK materials. The most widely used dielectric material for PCBs is
Altera
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loss tangent of FR4

Abstract: FR4 dielectric constant and loss tangent at 2.4 G construction material. Dielectric material can be assigned a dielectric constant (r) that is related to the , constant. The dielectric constant is the permittivity of a relative to that of empty space (i.e., Equation 2). Equation 2: o r = Where r = dielectric constant, o = permittivity of empty space (F/m), = permittivity (F/m). The dielectric constant compares the effect of an insulator on the , loss tangent value for FR-4 and GETEK materials. The most widely used dielectric material for PCBs is
Altera
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fbga Substrate design guidelines

Abstract: FR4 substrate epoxy dielectric constant 4.4 absorption. The most widely used dielectric material for PCBs is FR-4, a glass laminate with epoxy resin that meets a wide variety of processing conditions. The dielectric constant for FR-4 is between 4.1 , values of W = 9 mil, H = 24 mil, T = 1.4 mil, dielectric constant and (FR-4) = 4.1 with the stripline , construction material. Dielectric material can be assigned a dielectric constant ( r) that is related to the , ). Each PCB substrate has a different relative dielectric constant. The dielectric constant is the
Altera
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Abstract: . Test Method 3Mâ"¢ Bonding Film AF111 Dielectric Constant 4.2 @ 1 kilohertz 4.0 @ 10 , , 2004 3Mâ"¢ Bonding Film AF111 is an epoxy, thermoset film adhesive developed for structural bonding of metals and high-strength plastic materials (epoxy and phenolic). Bonding Film AF111 must be , Resin Epoxy Thickness 10 mil (0.25 mm) Tack Moderate Color Off-White , psi FR-4 (solvent wiped) 1150 psi LCP (solvent wiped) 300 psi Polyimide Film 1750 3M Electronics Markets Materials
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DOD-A-82720

Abstract: FR4 epoxy dielectric constant 4.2 3 Epoxy and Hot Melt Adhesives for Electronics Products and Specifications 3M Epoxy and Hot Melt Adhesives have the characteristics an TM 3M Epoxy and Hot Melt Specifications Typical , -HD Epoxy Epoxy Epoxy Epoxy Epoxy Epoxy Epoxy Epoxy Epoxy Epoxy Epoxy Epoxy Epoxy Epoxy Epoxy Epoxy , 40 min. @ 121ºC or 10 min. @ 149ºC or 5 min. @ 177ºC Scotch-Weld One-Part Epoxy Adhesives Scotch-Weld Two-Part Epoxy Adhesives 2214 Hi-Flex 2214 NMF 2290 3748 Dry 15 min. @ 121ºC and Cure 30 min
3M Electronic Markets Materials
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DP-190 DP-420 DOD-A-82720 FR4 epoxy dielectric constant 4.2 DP-100 Plus DP270 DP460 DP-100 DP-125 DP-270 DP-460

FR4 epoxy dielectric constant 4.4

Abstract: marking data code vishay capacitor 293d inferred from the following table, which shows the dielectric constant ranges of the various materials used in each type. Note that tantalum pentoxide has a dielectric constant of 26, some three times , , and the dielectric constant of the insulating material between the plates. COMPARISON OF CAPACITOR , Porcelain Mica Aluminum Oxide Tantalum Pentoxide Ceramic e DIELECTRIC CONSTANT 1.0 2.0 - 6.0 2.1 , the thickness of the tantalum pentoxide film. As the dielectric constant of the tantalum pentoxide
Vishay Sprague
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FR4 epoxy dielectric constant 4.4 marking data code vishay capacitor 293d tantalum pentoxide dielectric strength SPRAGUE Film Capacitors 225 292D 293D

Nelco 4000-13

Abstract: MEGTRON 6 core's dielectric is a cured (hardened) fiberglass-weave material with epoxy resin that acts as an , selection process: "Relative Dielectric Constant" "Loss Tangent" on page 3 "Fiberglass Weave Composition" on page 6 "Skin Effect" on page 7 Relative Dielectric Constant The relative dielectric constant (r) is a measure of a material's ability to be polarized by an electric field , dielectric constant varies with frequency. Material datasheets often refer to this parameter as Dk. Low r or
Altera
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AN-613-1 Nelco 4000-13 MEGTRON 6 370HR isola 370HR Nelco 4000-13 si Isola FR406
Abstract: dielectric constant ranges of the various materials used in each type. Note that tantalum pentoxide has a dielectric constant of 26, some three times greater than that of aluminum oxide. This, in addition to the , conducting plates, the distance between the plates, and the dielectric constant of the insulating material , Ceramic e DIELECTRIC CONSTANT 1.0 2.0 to 6.0 2.1 to 6.0 2.2 to 2.3 2.7 to 2.8 3.8 to 4.4 4.8 to , . As the dielectric constant of the tantalum pentoxide is high, the capacitance of a tantalum Vishay Sprague
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FR4 substrate epoxy dielectric constant 4.4

Abstract: FR4 epoxy dielectric constant 4.4 MHz. More precisely, the BT/Epoxy dielectric layer offers enhanced characteristics compared to FR4 , RO4003 dielectric layer (Hydrocarbon/Wovenglass) Layer thickness = 200 µm Dielectric constant = 3.4 , return Layer 4 BT/Epoxy dielectric layer Layer thickness = 630 mm Layer 5 Copper layer Copper thickness = 35 µm Lower ground plane (board mechanical rigidity) Layer 6 BT/Epoxy dielectric , /Epoxy dielectric layers (layers 4 and 6). Considering the severe mechanical constraints due to the
Atmel
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FR4 substrate epoxy dielectric constant 4.4 FR4 substrate epoxy dielectric constant 4.6 meander line PCB MC100EL16 TS8308500 TS8308500GL TSEV8308500 2165C

DRF1601

Abstract: smd transistor js 900MHz - Test board : FR4 glass epoxy board, dielectric constant = 4.5, thickness = 0.8 mm - Test
Tachyonics
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DRF1601 smd transistor js UHF POWER TRANSISTOR NPN medium power transistor in a smd power transistor smd transistor 026 900MH

FR4 epoxy dielectric constant 4.4

Abstract: FR4 epoxy dielectric constant 4.2 inferred from the following table, which shows the dielectric constant ranges of the various materials used in each type. Note that tantalum pentoxide has a dielectric constant of 26, some three times , , and the dielectric constant of the insulating material between the plates. COMPARISON OF CAPACITOR , Porcelain Mica Aluminum Oxide Tantalum Pentoxide Ceramic e DIELECTRIC CONSTANT 1.0 2.0 - 6.0 2.1 , the thickness of the tantalum pentoxide film. As the dielectric constant of the tantalum pentoxide
Vishay Sprague
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sprague catalog SPRAGUE MOLDED CERAMIC capacitor military capacitor codes mica SILVER MICA capacitor SPRAGUE 047 vishay sprague ceramic cap

Radiall r112

Abstract: analog/DIODE MA dielectric constant is 4.5 at 1 MHz. The BT/Epoxy dielectric has enhanced characteristics compared to FR4 Epoxy dielectric, namely: ­ higher operating temperature value: 170° C (125° C for FR4), ­ better , traces. The RO4003 dielectric constant is typically 3.4 at 10 GHz. The BT/Epoxy layer is chosen because , VPLUSDOUT Layer 4 BT/Epoxy dielectric layer Layer thickness = 0.4 mm Layer 5 Copper layer Copper thickness = 35 µm Power plane: VEE, VCC, VTT, GND Layer 6 BT/Epoxy dielectric layer Layer
Atmel
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Radiall r112 analog/DIODE MA Radiall R125 620 Radiall R125 DIODE g8 2108d TSEV81102G0 2108D

FR4 epoxy dielectric

Abstract: Radiall R125 RO4003 dielectric constant is typically 3.4 at 10 GHz. The BT/Epoxy layer is chosen because of its , is 4.5 at 1 MHz. The BT/Epoxy dielectric has enhanced characteristics compared to FR4 Epoxy , Layer 1 Copper layer Layer thickness = 200 µm Dielectric constant = 3.4 at 10 GHz -0.044 dB/inch , plane: VEE, VCC, VTT, GND Layer 6 BT/Epoxy dielectric layer Layer thickness = 1.0 mm Layer 7 , by a low insertion loss dielectric (RO4003) layer (layer 2) and by a BT/Epoxy dielectric layer
Atmel
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TS81102G0 TSEV8388BG FR4 epoxy dielectric atmel 1042 TS8388B TSEV83102G0 2108E AT76C451BCMY-EK2

5362b

Abstract: standard 15 pin connector MALE constant is 4.5 at 1 MHz. The BT/epoxy dielectric has enhanced characteristics compared to the FR4 epoxy , Dielectric constant = 3.4 at 10 GHz -0.044 dB/inch loss at 2.5 GHz -0.018 dB/inch loss at 18 GHz Layer 3 , Layer 4 BT/epoxy dielectric layer Layer thickness = 0.4 mm Layer 5 Copper layer Copper thickness = 35 µm Power plane: VEE, VCC, VTT, GND Layer 6 BT/epoxy dielectric layer Layer thickness , insertion loss dielectric (RO4003) layer (layer 2) and BT/epoxy dielectric layers (layers 4 and 6).
Atmel
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TSEV81102G0FS 5362b standard 15 pin connector MALE FR4 epoxy dielectric constant 3.2 FR4 dielectric constant 4.6 TS81102G0FS 5362B

j5b6

Abstract: J5-A25 . The kit uses FR4 epoxy dielectric material, whose relative dielectric constant is between 4.1 and 4.9 , copper) (microstrip signals) Epoxy FR4 Dielectric layer thickness = 0.011" Copper Layer 2 Copper thickness = 0.0014" (1 oz copper) (50 microstrip return; ground plane) Epoxy FR4 Dielectric , return; ground plane) Epoxy FR4 Dielectric layer thickness = 0.011" Copper Layer 4 Copper thickness = 0.0014" (1 oz copper) (VCC/VTT power plane) Epoxy FR4 Dielectric layer thickness = 0.011
Maxim Integrated Products
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MAX101 j5b6 J5-A25 FR4 dielectric J5-A13 J5-C19 LM337T 250MH MAX101EVKIT-CFR MAX10

BT 159

Abstract: TS81102G0FS constant is 4.5 at 1 MHz. The BT/epoxy dielectric has enhanced characteristics compared to the FR4 epoxy , Dielectric constant = 3.4 at 10 GHz -0.044 dB/inch loss at 2.5 GHz -0.018 dB/inch loss at 18 GHz Layer 3 , VPLUSDOUT Layer 4 BT/epoxy dielectric layer Layer thickness = 0.4 mm Layer 5 Copper layer Copper thickness = 35 µm Power plane: VEE, VCC, VTT, GND Layer 6 BT/epoxy dielectric layer Layer , insertion loss dielectric (RO4003) layer (layer 2) and BT/epoxy dielectric layers (layers 4 and 6).
Atmel
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BT 159 TSEV81102G0TPZR3 TSEV83102G0BGL TSEV83102G0BXX TSEV8388BGL 5362A

FR4 epoxy dielectric constant 4.4

Abstract: FR4 epoxy dielectric constant 4.2 dielectric constant is 4.5 @ 1 MHz. More precisely, the BT / Epoxy dielectric layer offers enhanced , : Copper layer Layer 4 : BT / Epoxy dielectric layer Layer 5 : Copper layer Layer 6 : BT / Epoxy , lines DC signals traces (GORB, GAIN, DIODE) Layer thickness = 200 µm dielectric constant = 3.4 @ 10 , by a low insertion loss dielectric layer (RO4003) (layer 2) and two parallel BT/Epoxy dielectric , the routing of the 50 ohms impedance signal traces. (The RO4003 typical dielectric constant is 3.4 @
Atmel
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TSEV8388BF TS8388BF CQFP68 HP16500C 10 GSPS ADC FR4 FR4 epoxy pcb double sided

J5-A15

Abstract: J5-A22 microstrip lines occupy layers 1 and 3, with layer 2 void. The kit uses FR4 epoxy dielectric material, whose relative dielectric constant is between 4.1 and 4.9. The nominal design is 0.0014 inch (0.0355mm) foil thickness for each copper layer, and 0.011 inch (0.28mm) dielectric thickness between layers. The 50 , = 0.0014" (1 oz copper) (DC signal layer) Copper Layer 1 Epoxy FR4 Copper Layer 2 Epoxy FR4 Copper Layer 3 Epoxy FR4 Copper Layer 4 Epoxy FR4 Copper Layer 5 Epoxy FR4 Copper Layer 6 Figure 1
Maxim Integrated Products
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J5-A15 J5-A22 MC100E116 J5C3 U24E MAX101A MAX101/MAX101A
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