NEW DATABASE - 350 MILLION DATASHEETS FROM 8500 MANUFACTURERS
NEW DATABASE - 350 MILLION DATASHEETS FROM 8500 MANUFACTURERS
| Catalog Datasheet Results | Type | Document Tags |
| Abstract: UFBGA package constructed using the glass epoxy FR4 substrate. Contact: Preliminary qualification , PROCESS CHANGE NOTIFICATION PCN0407 PCN0407 UFBGA 88 PACKAGE SUBSTRATE CHANGE Change Description: The substrate for the 88 Lead Ultra FineLine BGA® package assembled by Sharp will change from polyimide tape to glass epoxy FR4. This change does not affect form, fit, or function. Reason for Change: The polyimide tape is being discontinued. Products Affected: This substrate change affects the configuration ... | Original |
1 pages, |
EPC16UC88AA EPC16UC88 FR4 epoxy Substrate FR4 substrate PCN0407 PCN0407 abstract |
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| Abstract: Surface Mount Types 6 pad FR4 substrate. 2.5 mm H M62T_G VM62T VM62T_G 4 pad FR4 substrate. 2.5mm H M42T_G VM42T VM42T_G 6 pad FR4 substrate. 4.7 mm H M64T_G VM64T VM64T_G 32.768 KHz 4 pad FR4 substrate. 4.7 mm H M44T_G VM44T VM44T_G (1) (1) 4 pad ceramic substrate. 5x7 mm Same Same Under development Same(1) 4 pad ceramic substrate. 5x3.2 mm Same (1) Available Frequency Range For RoHS equivalent model please add "G" after ... | Original |
8 pages, |
VM28T VM38T5-32 FR4 substrate datasheet abstract |
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| Abstract: 4. Device mounted on FR-4 substrate, 2"x2", 2 oz. copper, single-sided, cathode pad dimensions 0.50" x 1.0", anode pad dimensions 0.50"x1.0". RqJA in range of 30-40°C/W. 5. Device mounted on FR-4 , 0.25"x1.0". RqJA in range of 18-23°C/W. 4. Device mounted on FR-4 substrate, 2"x2", 2 oz. copper , /W. 5. Device mounted on FR-4 substrate, 2"x2", 2 oz. copper, single-sided, pad layout as per Diodes , , RqJS = 2.0°C/W, RqSA = 0°C/W. 3. Device mounted on ceramic substrate, 2"x2", 2 oz. copper ... | Original |
3 pages, |
SBM4150-13 SBM41 J-STD-020A fr 4 substrate AP2001 DEVICE MARKING CODE X1 FR4 substrate SBM4150 SBM4150 abstract |
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| Abstract: M29GS M29GS_ VM29GS VM29GS_ Leadless Surface Mount Types 10.0 ~ 26 MHz 6 pad FR4 substrate. 2.5 mm H M62GS M62GS_ VM62GS VM62GS_ 10.0 ~ 26 MHz 4 pad FR4 substrate. 2.5mm H M42GS M42GS_ VM42GS VM42GS_ 9.6 ~ 26 MHz 6 pad FR4 substrate. 4.7 mm H M64GS M64GS_ VM64GS VM64GS_ 9.6 ~ 26 MHz 4 pad FR4 substrate. 4.7 mm H M44GS M44GS_ VM44GS VM44GS_ (1) (1) 10.0 ~ 26 MHz 4 pad ceramic substrate. 5x7 mm Same Same (1) (1) 12.5 ~26 MHz 4 pad ceramic substrate ... | Original |
8 pages, |
VM57S5 vm42 vm28 M15S VM64S M29S M28S VM24S VM25S M57S FR4 substrate M28S Equivalent datasheet abstract |
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| Abstract: FR4 substrate. 2.5 mm H M42GT M42GT_ VM42GT VM42GT_ 4 pad FR4 substrate. 2.5mm H 1.6 ~ 156 MHz M64GT M64GT_ VM64GT VM64GT_ 6 pad FR4 substrate. 4.7 mm H 32.768 KHz M44GT M44GT_ VM44GT VM44GT_ 4 pad FR4 substrate. 4.7 mm H (1) (1) 4 pad ceramic substrate. 5x7 mm Same Same (1) 4 pad ceramic substrate. 5x3.2 mm Under ... | Original |
8 pages, |
M64GT M47GT FR4 substrate datasheet abstract |
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| Abstract: : 142-0701-881 (Johnson Components) SUBSTRATE The jig is a multilayer FR4 substrate. Thickness between , PLANE FR4 SUBSTRATE Side View Substrate Material: FR4 Substrate Thickness: 0.2mm Note: Slight changes in electrical parameters should be expected if a different substrate is used. 30 ... | Original |
3 pages, |
CP0805 CP0805A0836AW CP0805A0881AW CP0805A0947AW CP0805B1842AW CP0805B1890AW CP0805B1907AW CP0805B1950AW directional coupler chip 8 GHz smd resistor 151 FR4 substrate CP0805 abstract |
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| Abstract: Semiconductor for applicability. SMT PROCESS RECOMMENDATIONS (FR4) Table 1 SUBSTRATE TYPE CSP DESCRIPTION FR4 FR4 Fine Pitch 2-4 bumps with 0.40 mm pitch; 5 or more bumps with 0.50 mm 5 or more bumps , qualification. The levels of reliability are detailed in Table 4. For FR4 substrate applications, it is useful , size. CSP RELIABILITY LEVELS (FR4 SUBSTRATE) Table 4 LEVEL ENCAPSULATION 0 None 1 , typical FR4 substrates. The CSP is not limited to FR4 and has been utilized on Flex substrates. General ... | Original |
3 pages, |
PCB design for csp package FR4 substrate epoxy SN63A with or without underfill FR4 substrate underfill datasheet abstract |
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| Abstract: PAD CONNECTIONS AND COORDINATES, SEE TABLE 1 4. UNDERFILL RECOMMENDED FOR FR4 SUBSTRATE APPLICATION , CDUNTER-CLDCK WISE IN THIS VIEW RECOMMENDED SUBSTRATE LAND PATTERN SIZE A FSCM NO, DWG NO. DS2430AX DS2430AX REV B ... | OCR Scan |
2 pages, |
DS2430AX datasheet abstract |
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| Abstract: MASK; FOR PAD CONNECTIONS AND COORDINATES, SEE TABLE 1 4. UNDERFILL RECOMMENDED FOR FR4 SUBSTRATE , PADS NUMBERED CEIUNTERCLDCKWISE IN THIS VIEV RECOMMENDED SUBSTRATE LAND PATTERN SIZE A FSCM NO, DWG ... | OCR Scan |
2 pages, |
FR4 substrate DS2417X underfill datasheet abstract |
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| Abstract: D085-002 SOLDER MASK; FOR PAD CONNECTIONS AND CCQRDINATES, SEE TABLE 1 4. UNDERFILL RECOMMENDED FOR FR4 SUBSTRATE , NUMBERED CDUNTERCLDCKWISE IN THIS VIEV RECOMMENDED SUBSTRATE LAND PATTERN SIZE A FSCM NO, DWG NO. DS2415X DS2415X ... | OCR Scan |
2 pages, |
underfill FR4 substrate DS2415X datasheet abstract |
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| Abstract | Saved from | Date Saved | File Size | Type | Download |
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| processor (66MHz bus) with a standard FR4 substrate. The Pentium processor comes in a tape carrier www.datasheetarchive.com/files/intel/design/intarch/embdmodl.htm |
Intel | 03/08/1997 | 6.45 Kb | HTM | embdmodl.htm |
| processor (66MHz bus) with a standard FR4 substrate. The Pentium processor comes in a tape carrier www.datasheetarchive.com/files/intel/design/intarch/embdmodl-v1.htm |
Intel | 10/02/1998 | 7.15 Kb | HTM | embdmodl-v1.htm |
| processor (66MHz bus) with a standard FR4 substrate. The Pentium processor comes in a tape carrier www.datasheetarchive.com/files/intel/design/intarch/embdmodl-v5.htm |
Intel | 06/08/1998 | 13.53 Kb | HTM | embdmodl-v5.htm |
| processor (66MHz bus) with a standard FR4 substrate. The Pentium processor comes in a tape carrier www.datasheetarchive.com/files/intel/design/intarch/embdmodl-v3.htm |
Intel | 30/04/1998 | 13.57 Kb | HTM | embdmodl-v3.htm |
| processor (66MHz bus) with a standard FR4 substrate. The Pentium processor comes in a tape carrier www.datasheetarchive.com/files/intel/design/intarch/embdmodl-v6.htm |
Intel | 15/11/1998 | 13.27 Kb | HTM | embdmodl-v6.htm |
| processor (66MHz bus) with a standard FR4 substrate. The Pentium processor comes in a tape carrier www.datasheetarchive.com/files/intel/design/intarch/embdmodl-v4.htm |
Intel | 08/02/1999 | 22.53 Kb | HTM | embdmodl-v4.htm |
| processor (66MHz bus) with a standard FR4 substrate. The Pentium processor comes in a tape carrier www.datasheetarchive.com/files/intel/design/intarch/embdmodl-v2.htm |
Intel | 01/11/1997 | 7.14 Kb | HTM | embdmodl-v2.htm |
| -layer printed circuit board including a 133 MHz Pentium processor (66MHz bus) with a standard FR4 substrate www.datasheetarchive.com/files/intel/design/platform/embedpc/2diagram-v4.htm |
Intel | 02/02/1999 | 18.4 Kb | HTM | 2diagram-v4.htm |
| -layer printed circuit board including a 133 MHz Pentium processor (66MHz bus) with a standard FR4 substrate www.datasheetarchive.com/files/intel/design/platform/embedpc/2diagram-v1.htm |
Intel | 06/08/1998 | 18.42 Kb | HTM | 2diagram-v1.htm |
| -layer printed circuit board including a 133 MHz Pentium processor (66MHz bus) with a standard FR4 substrate www.datasheetarchive.com/files/intel/design/platform/embedpc/2diagram.htm |
Intel | 13/02/1998 | 18.26 Kb | HTM | 2diagram.htm |