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ACS74KMSR Intersil Corporation ACS74KMSR, FP-14 ri Buy
HS9-26CT32RH-Q Intersil Corporation QUAD LINE RECEIVER, CDFP16, CERAMIC, FP-16 ri Buy
5962R9572201QXC Intersil Corporation 16-BIT, 5MHz, MICROPROCESSOR, CDFP42, FP-42 ri Buy

FP-24DS

Catalog Datasheet Type PDF Document Tags
Abstract: Hitachi Semiconductor Package Data Book ADE�0�1B 3rd Edition March/97 Semiconductor & Integrated Circuit Devision, Hitachi, Ltd. Introduction Thank you for using Hitachi's semiconductor devices. The growing market for electronic equipment requires mounting semiconductor devices with higher functional capacity and higher density and developing packages for housing them. As we deal with the contradictory aims of enlarging chip sizes and making packages smaller, the concerted efforts ... Original
datasheet

461 pages,
4604.18 Kb

IC51-0684-390-1 IC51-1004-809 IC235-0442 7313 28 pin transistor fpq 630 Enplas OTS-48 fpq-144-0.5-03 IC 7418 KS 0302 IC51-2084-1052-11 Enplas drawings PT740 AB TSSOP YAMAICHI SOCKET FP-20-0.65-01 datasheet abstract
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Abstract: Hitachi Semiconductor Package DATA BOOK ADE 410-001A Introduction Thank you for using Hitachi's semiconductor devices. The growing market for electronic equipment requires mounting semiconductor devices with higher functional capacity and higher density and developing packages for housing them. As we deal with the contradictory aims of enlarging chip sizes and making packages smaller, the concerted efforts of the entire company are focused on advances being made in development of ... Original
datasheet

333 pages,
6822.82 Kb

7408 texas diode 42B DO-35 COB(CHIP ON BOARD) hitachi led DPAK-2 PACKAGE 14 pin ic 7404 datasheet IC AND GATE 7408 dpak DIODE ANODE COMMON MH 7404 ic 7408 TO-3P Jedec package outline 12pin QFN LCC ic 7404 datasheet datasheet abstract
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Abstract: Hitachi Semiconductor Package Data Book ADE-410-001J ADE-410-001J 11th Edition March/2002 Semiconductor & Integrated Circuits Hitachi, Ltd. Introduction Thank you for using Hitachi's semiconductor devices. The growing market for electronic equipment requires mounting semiconductor devices with higher functional capacity and higher density and developing packages for housing them. As we deal with the contradictory aims of enlarging chip sizes and making packages smaller, the concerted efforts of the e ... Original
datasheet

498 pages,
11967.64 Kb

fuji semiconductors manual FPQ Package EDR7315 Hitachi DSAUTAZ006 texas instruments data guide manual siemens POWER SUPPLY KS 630 S infineon catalog rfpak ADE-410-001J ADE-410-001J abstract
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