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MSP430F2111TDGVR Texas Instruments 16-bit Ultra-Low-Power Microcontroller, 2kB Flash, 128B RAM, Comparator 20-TVSOP -40 to 105 visit Texas Instruments Buy
MSP430F2111IDW Texas Instruments 16-bit Ultra-Low-Power Microcontroller, 2kB Flash, 128B RAM, Comparator 20-SOIC -40 to 85 visit Texas Instruments
MSP430F2111TPW Texas Instruments 16-bit Ultra-Low-Power Microcontroller, 2kB Flash, 128B RAM, Comparator 20-TSSOP -40 to 105 visit Texas Instruments
MSP430F2111IDWR Texas Instruments 16-bit Ultra-Low-Power Microcontroller, 2kB Flash, 128B RAM, Comparator 20-SOIC -40 to 85 visit Texas Instruments Buy
MSP430F2111TPWR Texas Instruments 16-bit Ultra-Low-Power Microcontroller, 2kB Flash, 128B RAM, Comparator 20-TSSOP -40 to 105 visit Texas Instruments Buy
MSP430F2111IDGV Texas Instruments 16-bit Ultra-Low-Power Microcontroller, 2kB Flash, 128B RAM, Comparator 20-TVSOP -40 to 85 visit Texas Instruments Buy

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F-2111

Catalog Datasheet MFG & Type PDF Document Tags

EZ 542

Abstract: MPAS-068-ZSGT-11 F-211-1 SUPPLEMENT (2,54mm) .100" MPAS SERIES MPAS­068­ZSGT­11 MPAS­144­ZSGT­13 PIN GRID ARRAY SOCKETS Mates with: MPAT, MVAT, MHAT, MSAT SPECIFICATIONS For complete specifications see www.samtec.com?MPAS Insulator Material: Black G.F. Polyester Contact: BeCu Shell: Brass except Style K Phosphor Bronze Operating Temp Range: -55°C to +105°C with Tin -55°C to +125°C with Gold Plating , F-211-1 SUPPLEMENT MPAS­068­ZWTT­11 MPAS­168­ZSGG­17 MORE STANDARD PIN-OUTS AVAILABLE. CALL
Samtec
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EZ 542 MPAS-068-ZSGT-11 F2111 MPAS-068

SO-1524-03-01-01-L

Abstract: F-211-1 SO­2515­02­01­01­L SO­1890­03­01­01­L SO­0715­01­01­01 SO­1524­03­01­01­L SO SERIES PRECISION BOARD STACKING STANDOFF Ideal for use with all Samtec SI connectors SPECIFICATIONS For complete specifi fications cations and recommended PCB layouts see www.samtec.com?SO om?SO Material: Aluminum Locking Compound: nd: Nylon APPLICATIONS TM Precisio Precision machined , . WWW.SAMTEC.COM F-211-1 SO­1215­02­01­01­L SO­0515­01­01­01 SO­2015­02­01­01­L SO SERIES STACKING
Samtec
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SO-1524-03-01-01-L PCI/104-E SO-1524-03-01-02-L SO-0515-01-01-01 SO-0715-01-01-01 SO-0815-01-01-01 SO-0865-01-01-01

EZ 542

Abstract: 47 6p1 F-211-1 SUPPLEMENT SC­8P1­GG EZ­2P3­GT SC, EZ SERIES STANDARD, LOW PROFILE & SMT SOCKETS Specifications: SC, EZ Contact: BeCu Shell: Brass -GG Plating: 30µ" (0,76µm) Au over 50µ" (1,27µm) Ni on contact; 10µ" (0,25µm) Au over 50µ" (1,27µm) Ni on shell -GT Plating: 30µ" (0,76µm) Au over 50µ" (1,27µm) Ni on contact; Sn over 50µ" (1,27µm) Ni on shell -TT Plating: Sn over 50µ" (1,27µm) Ni on contact; Sn over 50µ , ,38mm to 0,51mm) Plating Available = GG, GT, TT WWW.SAMTEC.COM F-211-1 SUPPLEMENT SC
Samtec
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47 6p1 st ez
Abstract: F-211-1 MMCX7â'"Jâ'"Pâ'"HFâ'"STâ'"SM1 MMCX7â'"Jâ'"Pâ'"HFâ'"STâ'"SM1 MMCX7â'"Jâ'"Pâ'"HFâ'"STâ'"SM1 MMCX7 SERIES 75Ω OPTIMIZED MMCX JACKS SPECIFICATIONS Mates with: RF30S For complete specifications and recommended PCB layouts see www.samtec.com?MMCX7-SM Shell Material: Brass Contact Material: BeCu Insulator Material: PTFE Operating Temp Range: -65°C to +125°C Impedance: 75Ω ±3Ω Frequency Range: 0~6 GHz * V.S.W.R: 1.3 max (with optimized launch design) Working Voltage: 170 Vrms Samtec
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Abstract: F-211-1 MPT­08­6.30­01­L­V TM STRIP (5,00mm) .197" MPT SERIES 25 MPT­04­6.30­01­L­V 25A DUAL BLADE HEADER SPECIFICATIONS For complete specifications see www.samtec.com?MPT Insulator Material: Black LCP Terminal Material: Copper Alloy Plating: Sn or Au over 50µ" (1,27µm) Ni Operating Temp Range: -55°C to +105°C with Tin; -55°C to +125°C with Gold Voltage Rating: 600 VAC/848 VDC RoHS Compliant: Yes Lead­Free Solderable: Yes Mates with: MPS, MPSS Dual leaf blade contacts 5mm pitch Samtec
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Abstract: F-211-1 SIB­120­02­F­S SIB­110­02­F­S (2,54mm) .100" SIB SERIES ONE PIECE INTERFACE SPECIFICATIONS For complete specifications and recommended PCB layouts see www.samtec.com?SIB Insulator Material: Black Liquid Crystal Polymer Contact Material: Phosphor Bronze Plating: Au or Sn over 50µ" (1,27µm) Ni Current Rating: 2.2A @ 80°C ambient Operating Temp Range: -55°C to +125°C Normal Force: 111 grams (1,09N) per contact RoHS Compliant: Yes (3,81mm) .150" Processing: Lead-Free Solderable: Yes SMT Lead Samtec
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Abstract: F-211-1 ® DCA (0,80mm) .0315" RCH SERIES RCHâ'"019â'"1000 I/O SYSTEM RUGGED SEALED HIGH SPEED SYSTEM SPECIFICATIONS Mates with: ERI8, RPBH Rubber gasket for dust and water sealing For complete specifications see www.samtec.com?RCH Cable: 32 AWG Low Skew Pair/ 28 AWG Power Bend Radius: (25,40mm) 1.00" Signal Routing: 100Ω Differential Pinout Map: 1:1 Map Standard (See web address above for additional information) RoHS Compliant: Yes Positive latching â Samtec
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Abstract: F-211-1 SUPPLEMENT (0,75mm) .030" MTCA SERIES MICRO TCA CONNECTOR SPECIFICATIONS For complete specifications see www.samtec.com?MTCA Insulator Material: LCP Terminal Material: Brass Alloy Plating: Au or Sn over 50µ" (1,27µm) Ni Current Rating: 2.3A @ 80°C ambient (See website for details) Operating Temp Range: -55°C to +125°C Contacts on (0,75mm) .030" pitch Mates with: (1,60 mm) .062" thick cards Supports hot plugging Samtec
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Abstract: F-211-1 SUPPLEMENT TM SCP1 SERIES IP68 SEALED POWER PLUG SPECIFICATIONS Mates with: SCR1 Meets IP68 requirements for dust and waterproof sealing For complete specifications see www.samtec.com?SCP1 Insulator Material: PBT Terminal Material: Brass Alloy Contact Material: Phosphor Bronze Wire: 22 AWG Sealed Overmold: PA66 RoHS Compliant: Yes CURRENT RATING AMBIENT SCP1-10/ TEMP SCR1-10 20°C 9.2A 40°C 8.0A 60°C 6.6A Samtec
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DCA-10-02 DCA-17-02
Abstract: F-211-1 TM RCEâ'"01â'"Gâ'"02.00â'"BC RCE, RCEF SERIES IP68 SEALED ETHERNET PLUG SPECIFICATIONS Mates with: RPBE-01, RPCE 24 AWG Meets IP68 requirements for dust and waterproof sealing when mated or with dust cap For complete specifications see www.samtec.com?RCE Insulator Material: Black Liquid Crystal Polymer Contact: Phosphor Bronze Latch: BeCu Wire: 24 AWG APPLICATION Audible click positive latching 50µ" (1,27µm) Gold on contacts RCE CABLE STYLE Samtec
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RCEF-G-01 RCEF-G-02 DCA-RCE-01-01
Abstract: F-211-1 TM STRIP (5,00mm) .197" MPS SERIES 25 MPS­02­7.70­01­L­V MPS­06­7.70­01­L­V 25A DUAL LEAF SOCKET SPECIFICATIONS For complete specifications see www.samtec.com?MPS Insulator Material: Black LCP Terminal Material: Copper Alloy Plating: Sn or Au over 50µ" (1,27µm) Ni Operating Temp Range: -55°C to +105°C with Tin; -55°C to +125°C with Gold Voltage Rating: 600 VAC/848 VDC RoHS Compliant: Yes Lead­Free Solderable: Yes Mates with: MPT Dual leaf blade contacts 5mm pitch 14mm Samtec
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Abstract: F-211-1 QSFPOâ'"001.0â'"01 QSFPO SERIES QSFP+ ACTIVE OPTICAL CABLE Lightweight SPECIFICATIONS Mates with: QSFP8 For complete specifications see www.samtec.com?QSFPO Insulator Material: Black LCP Contact Material: Phosphor Bronze Ground Plane: Phosphor Bronze Terminal Material: Phosphor Bronze Shield: Phosphor Bronze Virtually zero crosstalk 4 channels (8 pair) transmitting up to 10.5 Gbps per lane; aggregate bandwidth 42 Gbps Compliant to QSFP APPLICATION QSFPC Samtec
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Abstract: F-211-1 UUSB3â'"ABâ'"Sâ'"Sâ'"SMâ'"TR UUSB3â'"ABâ'"Sâ'"Fâ'"SMâ'"TR UUSB3 SERIES MICRO USB 3.0 INTERFACES SPECIFICATIONS USB 3.0 portâ'" works parallel with USB 2.0 port For complete specifications and recommended PCB layouts see www.samtec.com?UUSB3 Insulator Material: Nylon 9T Black Contact Material: Phosphor Copper Plating: Au or Sn over 50µ" (1,27µm) Ni Shield Plating: 50µ" (1,27µm) Ni Operating Temp Range: -50°C to +85°C Current Rating: 1.8 A ground and VBUS, 0.25A per Samtec
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Abstract: F-211-1 SUPPLEMENT MHDMR SERIES MINI HIGH SPEED I/O RECEPTACLES SPECIFICATIONS Mates with: HPSTP-M, HPSTP-ML Surface Mount signal leads It's mini! For complete specifications and recommended PCB layouts see www.samtec.com?MHDMR Insulator Material: Black Glass Filled Thermoplastic Contact Material: Phosphor Bronze Shell Material: Brass Plating: Au over Ni on contacts, Ni on shell Operating Temp Range: -25 °C to +85 °C Samtec
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Abstract: F-211-1 SUPPLEMENT VHDCRâ'"36â'"01â'"Mâ'"RA (0,80mm) .0315" VHDCPâ'"68â'"01â'"Mâ'"EM VHDCR, VHDCP SERIES VHDCI CONNECTORS Right Angle or Edge Mount SPECIFICATIONS For complete specifications and recommended PCB layouts see www.samtec.com?VHDCR or www.samtec.com?VHDCP RoHS Compliant: Yes Leadâ'"Free Solderable: No VHDCR Mates with: VHDCP and Industry Standard VHDCI Cable Assemblies VHDCP Mates with: VHDCR Through-hole or Edge Mount APPLICATION VHDCR VHDCP 36, 50 Samtec
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Abstract: F-211-1 SUPPLEMENT SPEâ'"01â'"01â'"E TM SPE SERIES IP68 SEALED ETHERNET SOCKET SPECIFICATIONS Meets CAT3, CAT5 and CAT5e specifications Mates with: RCE Meets IP68 requirements for dust & water sealing For complete specifications see www.samtec.com?SPE Insulator Material: Black Liquid Crystal Polymer Contact: Phosphor Bronze Seal: Silicone Screw: Stainless Steel Nut: Stainless Steel Sealing Washer: Rubber ALSO AVAILABLE Audible click positive latching Dust Cap Samtec
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DCRE-01-P-01
Abstract: F-211-1 MEC6­120­02­L­D­RA1 (0,635mm) .025" MEC6-RA SERIES MEC6­130­02­L­D­RA1 MEC6­150­02­L­D­RA1 RIGHT ANGLE MICRO EDGE CARD SOCKET SPECIFICATIONS For complete specifications and recommended PCB layouts see www.samtec.com?MEC6-RA Insulator Material: Black LCP Contact Material: Phosphor Bronze Plating: Au or Sn over 50µ" (1,27µm) Ni Operating Temp Range: -55°C to +125°C Insertion Depth: (4,22mm) .166" to (5,66mm) .223" Current Rating: Testing Now! Voltage Rating: Testing Now! RoHS Compliant: Yes Samtec
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Abstract: F-211-1 TM RPBEâ'"01â'"01â'"E RPCEâ'"01â'"Eâ'"00.25â'"Dâ'"C5E RPBE, RPCE SERIES IP68 SEALED ETHERNET SOCKET Mates with: RCE NO. OF PORTS RPBE LEAD STYLE PLATING SPECIFICATIONS For complete specifications see www.samtec.com?RPBE Insulator Material: Black Liquid Crystal Polymer Contact: Phosphor Bronze Seal: Rubber Screw: Stainless Steel Nut: Stainless Steel Sealing Washer: Rubber â'"01 â'"E = 50µ" (1,27µm) Gold on contact, Flash Gold on tail A NO. OF Samtec
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DCA-RPBE-01-01-P
Abstract: F-211-1 TM SYSTEM (0,50mm) .0197" LSHM-DH, LSHM-RH SERIES HIGH SPEED HERMAPHRODITIC STRIP SPECIFICATIONS Mates with: LSHM Optional shielding For complete specifications and recommended PCB layouts see www.samtec.com?LSHM-DH or www.samtec.com?LSHM-RH Insulator Material: Black Liquid Crystal Polymer Contact Material Samtec
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Abstract: F-211-1 ® (0,50mm) .0197" QSH-RA SERIES RIGHT ANGLE GROUND PLANE SOCKET SPECIFICATIONS Board Mates: QTH For complete specifications and recommended PCB layouts see www.samtec.com?QSH-RA Insulator Material: Black Liquid Crystal Polymer Terminal Material: Phosphor Bronze Weld Tab: Phosphor Bronze Ground Plane: Phosphor Bronze Plating: Au or Sn over 50µ" (1,27µm) Ni Current Samtec
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Dh41

Abstract: F-211-1 TM RCEâ'"01â'"Gâ'"02.00â'"BC RCE, RCEF SERIES IP68 SEALED ETHERNET PLUG SPECIFICATIONS Mates with: RPBE-01, RPCE 24 AWG Meets IP68 requirements for dust and waterproof sealing when mated or with dust cap For complete specifications see www.samtec.com?RCE Insulator Material: Black Liquid Crystal Polymer Contact: Phosphor Bronze Latch: BeCu Wire: 24 AWG APPLICATION Audible click positive latching 50µ" (1,27µm) Gold on contacts RCE CABLE STYLE
New Japan Radio
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Dh41 DE51F 33BA1 71DE51F 137C41 E655150 10197A31
Abstract: F-211-1 SIB­120­02­F­S SIB­110­02­F­S (2,54mm) .100" SIB SERIES ONE PIECE INTERFACE SPECIFICATIONS For complete specifications and recommended PCB layouts see www.samtec.com?SIB Insulator Material: Black Liquid Crystal Polymer Contact Material: Phosphor Bronze Plating: Au or Sn over 50µ" (1,27µm) Ni Current Rating: 2.2A @ 80°C ambient Operating Temp Range: -55°C to +125°C Normal Force: 111 grams (1,09N) per contact RoHS Compliant: Yes (3,81mm) .150" Processing: Lead-Free Solderable: Yes SMT Lead Samtec
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Abstract: F-211-1 T1Mâ'"20â'"GFâ'"Sâ'"V (1,00mm) .03937" S1SSâ'"20â'"28â'"GFâ'"03.00â'"DR S1SS, T1M SERIES DISCRETE WIRE CABLE & HEADER Mates with: T1M S1SS NO. OF POSITIONS WIRE GAUGE PLATING OPTION ASSEMBLED LENGTH â'"â'XX.XXâ' â'"S = Assembled Length in Inches (76,2mm) 03.00" min. = Single Ended END OPTION SPECIFICATIONS For complete specifications see www.samtec.com?S1SS Insulator Material: Nylon Contact Material: Phosphor Bronze Plating: Au or Sn over 50µ" (1 Samtec
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Abstract: F-211-1 TM (0,635mm) .025" QMSâ'"052â'"01â'"SLâ'"Dâ'"EM2 QMS-EM SERIES EDGE MOUNT GROUND PLANE HEADER SPECIFICATIONS Board Mates: QFS For complete specifications and recommended PCB layouts see www.samtec.com?QMS-EM Insulator Material: Liquid Crystal Polymer Terminal & Ground Plane Material: Phosphor Bronze Plating: Au over 50µ" (1,27µm) Ni (Tin on Ground Plane Tail) Current Rating: Signal Contact: 1.8A @ 80°C Power Contact: 4.1A @ 80 Samtec
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Abstract: F-211-1 ® EPLSPâ'"019â'"1000 (0,80mm) .0315" EPLSP SERIES I/O SYSTEM RUGGED LATCHING HIGH SPEED SYSTEM â"¢ Low profile latching FEATURES â'¢ â'¢ â'¢ â'¢ Rugged external cable Small form factor Low profile latching Metal-to-metal two-piece contact system â'¢ High mating cycles â'¢ High cable ï¬'ex life (500 cycles 180° bend) â'¢ Small bend radius 32 AWG Low Skew Pair APPLICATION cols roto rted P o Supp ERI8â'"019â'"Sâ'"Dâ'"RA ERCâ Samtec
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Abstract: F-211-1 SUPPLEMENT (0,80mm) .0315" DSEC SERIES DUAL STACK EDGE CARD SOCKET SPECIFICATIONS Mates with: 1,60mm (.062") thick cards Insulator Material: Black Liquid Crystal Polymer Contact: Copper Alloy Plating: Au or Sn over 50µ" (1,27µm) Ni Current Rating: 0.5A @ 95°C Operating Temp: -55°C to +125°C Card Insertion Depth: (5,94mm) .234" nominal RoHS Compliant: Yes Leadâ'"Free Solderable: Yes APPLICATION Accepts Samtec
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Abstract: F-211-1 IPM1Kâ'"04â'"D (2,54mm) .100" DMTD, IPM1K SERIES SPLASH PROOF DISCRETE WIRE CABLE Mates with: DMSD, IPS1 TYPE POSITIONS PER ROW WIRE GAUGE DMTD â'"03, â'"04, â'"05 â'"20 â'"22 â'"24 â'"24C SPECIFICATIONS For complete specifications see www.samtec.com?DMTD or www.samtec.com?IPM1K Insulator Material: Black Nylon 66 Contact Material: Phosphor Bronze Plating: Au over 50µ" (1,27µm) Ni Operating Temp Range: Testing Now Samtec
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Abstract: F-211-1 UUSB3â'"ABâ'"Sâ'"Sâ'"SMâ'"TR UUSB3â'"ABâ'"Sâ'"Fâ'"SMâ'"TR UUSB3 SERIES MICRO USB 3.0 INTERFACES SPECIFICATIONS USB 3.0 portâ'" works parallel with USB 2.0 port For complete specifications and recommended PCB layouts see www.samtec.com?UUSB3 Insulator Material: Nylon 9T Black Contact Material: Phosphor Copper Plating: Au or Sn over 50µ" (1,27µm) Ni Shield Plating: 50µ" (1,27µm) Ni Operating Temp Range: -50°C to +85°C Current Rating: 1.8 A ground and VBUS, 0.25A per Samtec
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T1M74-L T1M74-R
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