NEW DATABASE - 350 MILLION DATASHEETS FROM 8500 MANUFACTURERS
NEW DATABASE - 350 MILLION DATASHEETS FROM 8500 MANUFACTURERS
| Catalog Datasheet Results | Type | Document Tags |
| Abstract: Reliability and Qualification Report EPISIL 5um CMOS Process (SP3485 SP3485 Product) Prepared by: G. West Manager, Quality Assurance Date: 7/14/06 EPISIL 5um CMOS Process Qualification , Mask Sets: 1567AZ 1567AZ Process: 5um CMOS Wafer Manufacturer: Assembly Location: Episil , As part of the Episil process characterization and qualification program, the Engineering group had , rates at 25°, 55°, and 70°C operation at both 60% and 90% confidence levels for 5um Episil process were ... | Original |
5 pages, |
SP483 SP481 SP3485 SP3481 Episil process ESD test plan SP3485 abstract |
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| Abstract: Reliability and Qualification Report EPISIL 2um CMOS Process (SP232CE SP232CE and SP3223EEA SP3223EEA Products) Prepared by: G. West Manager, Quality Assurance Date: 6/9/06 EPISIL 2um CMOS Process Qualification , Type: EPISIL 2um CMOS Process Qualification SP232CE SP232CE: 16L NSOIC SP3223EEA SP3223EEA: 20L TSSOP Page 2 , 0 0 0 0 0 0 0 0 0 Life Test Results As part of the Episil process characterization and , levels for 2um Episil process were calculated and listed below. FIT Rate: 2um CMOS Episil Process ... | Original |
6 pages, |
SP3223EEA SP232CE B5C1 SP232c Episil process SP232CE abstract |
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| Abstract: 5.5V. Wafer Fab: Episil Fab Location: Taiwan Process: Episil - 1x - SC2- mah - a MS: 1087 Assembly , room25oC Episil Episil Process Date Tested 2umCmos 21-FEB2006 21-FEB2006 2umCmos 21-FEB2006 21-FEB2006 2umCmos , hot85oC MS1087DZ MS1087DZ SP232CE SP232CE _ room25oC Episil Episil Process Date Tested 2umCmos , room25oC Episil Episil Process Date Tested 2umCmos 21-FEB2006 21-FEB2006 2umCmos 21-FEB2006 21-FEB2006 2umCmos , SP232CE SP232CE _ room25oC Episil Episil Process Date Tested 2umCmos 21-FEB2006 21-FEB2006 2umCmos ... | Original |
283 pages, |
649 592E 971e SP202E SP232A SP232ACN SP232ACP-L SP232c SP232CE SP232E SP232ECP SP232 1233 7694 SP232EEN SP232 abstract |
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| Abstract: : Episil Fab Location: Taiwan Process: Episil - 1x - SC2- mah - a MS: 1105 Assembly location: Carsem , Operation Foundry Process C30P44 C30P44: 3 MS1105G MS1105G SP3243E SP3243E _ Z B 85oC3Vch Episil ar Date Tested Tester , Process C30P44 C30P44: 3 MS1105G MS1105G SP3243E SP3243E _ Z B 85oC3Vch Episil ar Date Tested Tester 2umcmos , Process C30P44 C30P44: 3 MS1105G MS1105G SP3243E SP3243E _ Z B 85oC3Vch Episil ar Date Tested Tester 2umcmos , Device Rev Operation Foundry Process C30P44 C30P44: 3 MS1105G MS1105G SP3243E SP3243E _ Z B 85oC3Vch Episil ar Date ... | Original |
939 pages, |
TESTER 8048 09 06 232 6843 649 592E MAR 618 transistor MS1324 PM 8443 RX3 0633 SP3243 0709 817 B data sheet 455e SP3243 abstract |
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| Abstract: Episil distributions for a given parameter are adjacent. A distribution for a given parameter shows different temperature data which are at -40ºC, 25ºC, and 85ºC. Wafer Fab: Episil Fab Location: Taiwan Process: Episil -1x-sc0-mah-a MS: 901BY 901BY Assembly location: Carsem Characterization Procedure: Episil , Fab in Milpitas, CA, to a contract foundry, Episil, in Taiwan. This characterization report , Distribution Variance Hillview Fab Cpk (across temp) Episil Fab Distribution Mean Episil Fab ... | Original |
7 pages, |
SP483CN SP483 CARSEM ca 3056 9934 6502 SP483ES-L SP483eep-L SP483E SP483C SP483 abstract |
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| Abstract: Fab: Episil Fab Location: Taiwan Process: 5u CMOS MS: 668 Assembly location: CEI (Thailand) Characterization Procedure: Episil Lot number(s): 563CH 563CH Temperatures: Ambient (25C), 85C, -40C Tester: LTX Test , foundry, Episil, in Taiwan. This characterization report summarizes data for key SP485R SP485R product family , 0.40466 >4.0000 nS 13.19733 0.530349 Episil Fab Distribution Mean Episil Fab Distribution Variance Episil Fab Cpk (across temp) 256.570 5.485 >4.0000 1.804 115.150E-03 150E-03 ... | Original |
59 pages, |
SP485RCP-L SP485RCP SP485RCN-L SP485RCN SP485R A12V 592E 853e SP485R abstract |
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| Abstract: PRODUCT ATTRIBUTE AFFECTED: [ ] [ ] [X] Material Change Design Change Process Change , from Hillview wafer fabrication facility to wafer foundry Episil. See attached Product List no. 08. , site. FABRICATION PROCESS QUALIFICATION COMPLETED (DATE): 5/1/06 PRODUCT CHARACTERIZATION COMPLETED , production shipment. Product Designator: DC suffix of "E" for Episil [ ] STANDARD DISTRIBUTION [X ... | Original |
3 pages, |
sp491een SP1485ECN SP1485ECN-L SP1485ECP SP1485EEN SP1485EEN-L SP1485EEP SP1485EMN SP1485EMN-L sp491ecn MS1326 SP485EEP-L MS1326 abstract |
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| Abstract: PRODUCT ATTRIBUTE AFFECTED: [ ] [ ] [X] Material Change Design Change Process Change , from Hillview wafer fabrication facility to wafer foundry Episil. See attached Product List no. 09. , site. FABRICATION PROCESS QUALIFICATION COMPLETED (DATE): 5/1/06 PRODUCT CHARACTERIZATION COMPLETED , production shipment. Product Designator: DC suffix of "E" for Episil [ ] STANDARD DISTRIBUTION [X ... | Original |
3 pages, |
SP238ACS SP208CA SP208CA-L SP208CP-L SP208CT SP208EA SP208EA-L SP208ECA SP204EP-L SP208CP MS1341 MS1341 abstract |
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| Abstract: PRODUCT ATTRIBUTE AFFECTED: [ ] [ ] [X] Material Change Design Change Process Change , from Hillview wafer fabrication facility to wafer foundry Episil. See attached Product List no. 07. , site. FABRICATION PROCESS QUALIFICATION COMPLETED (DATE): 5/1/06 PRODUCT CHARACTERIZATION COMPLETED , production shipment. Product Designator: DC suffix of "E" for Episil [ ] STANDARD DISTRIBUTION [X ... | Original |
3 pages, |
SP3243BCY-L SP3243BCY SP3243BCT-L SP3243BCT SP3243BCR-L SP3243BCR SP3243BCA-L SP3243BCA MS1324 MS1324 abstract |
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| Abstract: 2010 171.62 KB Process Qualification Report EPISIL 5um CMOS Process Qualification Report Version 1.0.0 July 2006 1.45 MB Transfer Characterization Report SP3485 SP3485 Family Episil Characterization Report ... | Original |
1 pages, |
sn75180 SP3491 RS-485 SP3491 abstract |
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