NEW DATABASE - 350 MILLION DATASHEETS FROM 8500 MANUFACTURERS
NEW DATABASE - 350 MILLION DATASHEETS FROM 8500 MANUFACTURERS
| Catalog Datasheet Results | Type | Document Tags |
| Abstract: packing configurations References 1. 2. 3. 4. 5. 6. 14 Oscar Trevino, ESD Test Plan for TI , testing. All devices passed the postexposure testing. Test elements and materials were: · Test Plan , test point was exposed in the same manner. Electrostatic Discharge (ESD) Protective Semiconductor , Electrostatic-Field Meter Adhesive Side Figure 11. Typical Unrolling Test Electrostatic Discharge (ESD , Application Report SZZA027A SZZA027A - April 2002 Electrostatic Discharge (ESD) Protective ... | Original |
16 pages, |
EIA-541 014001 CZE1000R K6911 jedec JESD625-a so20w JESD625 ESD test plan EIA-383 CSL-Z7302 HIOKI 3119 JESD625-a SZZA027A SZZA027A abstract |
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| Abstract: the technical requirements of the ESD Control Program Plan. Process monitoring (measurements) shall be , Verification Plan shall document the test methods and equipment used for process monitoring and measurements. , measurements defined in the Compliance Verification Plan." (ANSI/ESD S20.20-2007 section 7.3) The Analog , ) 19786 Analog Surface Resistance Meter 19785 Shielded Test Leads 50003 Electrodes, 5 lbs. ESD , Packaging control plan. Approved ESD materials (see product qualification table at ANSI/ESD S20.20-2007 ... | Original |
4 pages, |
TR2020 TB-3046 TB-3046 abstract |
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| Abstract: user's ESD control plan. Approved ESD materials (see product qualification table at ANSI/ESD , of the technical requirements of the ESD Control Program Plan. Process monitoring (measurements , The Compliance Verification Plan shall document the test methods and equipment used for process , the test · ESD sensitive devices should also be removed · Place the Surface Resistance Checker on the , /ESD STM 2.1. The point-to-point and sleeve-to-sleeve resistance test should be made." (see ESD TR20.20 ... | Original |
4 pages, |
TB-3037 ANSI/ESDS20 TB-3037 abstract |
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| Abstract: qualification plan Reliability Test High Temperature Bias Test T = 125°C Duration = 1000H 1000H Nb rejects , according to qualification plan Nb rejects Package High Temperature Bias Test T = 125°C Duration = , ) Reliability tests were performed according to qualification plan Nb rejects Reliability Test Package , datasheet specification. b) ESD measurement was performed according to MILSTD883C MILSTD883C ESD resistance is , latch-up was observed. d) Reliability tests were performed according to qualification plan ... | Original |
6 pages, |
TS925 epoxy qualification ESD test plan HC10-2 hf2c PF40 TS921 TS922 TS924 76 HC10 Q092XS1 Q092XS1 abstract |
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| Abstract: Date Qualification Plan # 1972A-1-10-2006-472 1/10/2006 Group Definition 1 New , 2 Unmarked 3 4 5 6 Life Test Qual Num Lot Condition 2006-RM-32 2006-RM-32 , 2006-RM-33 2006-RM-33 E545004AJ E545004AJ 545005AJ 545005AJ -40C to +100C -40C to +100C Temperature Cycle Hrs/Cycles Plan Actual 1000hrs 1000hrs 1000 1000 Hrs/Cycles Plan Actual 100 cycles 100 cycles 100 100 Hrs/Cycles Plan Actual Start End S/S 2/22/2006 2/22/2006 4/28/2006 4/7/2006 50 ... | Original |
2 pages, |
NT600H-10000 JESD78 J-STD-020-B ESD test plan 100C nt600 BI1972 NT600H-10000 abstract |
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| Abstract: Table 1 listsESD test results for the test devices. Table 2 lists the remaining reliability test to be , Devices in the Sherman Wafer Fabrication Site TABLE 1: Reliability Test Results Required SS / # Fails ESD Capacitive Discharge Model SOIC PKG, �5 KV ESD Human Body Model 100 pF, 1.5K �5 KV ESD Machine Model 200 pF, 0 , �0 Volts ESD Human Body Model 100 pF, 1.5K �KV ESD Machine Model 200 pF, 0 , /0 3/0 3/0 3/0 3/0 TABLE 2: Reliability Qualification Plan Reqd. SS / # Fails ... | Original |
2 pages, |
SN74ALS233B SN74ALS232B SN74ALS229B ESD test plan HFAB ALS232B/233B/229B ALS232B/233B/229B abstract |
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| Abstract: reliable operation by passing all qualification testing in our product qualification test plan. The , qualification testing is based on JEDEC test methods common to the semiconductor industry. A FMEA approach is used to determine the test methods to be included in the qualification plan. The manufacturing test , the manufacturing test specification. The ESD class quoted indicates that the device passed exposure , just qualification) uses three or more wafers completing the entire qualification plan for that ... | Original |
8 pages, |
JESD22-A114 JESD22-A103 1100C 0116 led CGA-0116 ESD test plan CGA-0116 abstract |
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| Abstract: Humidity Bias Test ESD: Electrostatic Discharge LU: Latch-up DESCRIPTION The device is stressed , goods label Description of qualification program See Attached Qualification Plan Product Line(s , Please sign and return to STMicroelectronics Sales Office Qualification Plan Denied Name: Qualification Plan Approved Title: Company: Change Denied Date: Change Approved Signature , : Date: Page 1 of 7 1 - CONTENT 1 - CONTENT 2 - GENERAL 3 - DEVICE INFORMATION 4 - ESD and ... | Original |
10 pages, |
ESD test plan ecopack E-STV9302A 1000C stv9302a fault STV9302 STV9302A datasheet stv9302a equivalent stv9302a CMG-DTV/04/679 STV9302A CMG-DTV/04/679 abstract |
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| Abstract: Volts 3/0 *Static Life Test *Temperature Cycle ESD Charged Device Model Latch-up 5/0 , AHC1G/AHCT1G products. The redesign is to improve ESD performance and reduce the overall chip size of , detailed qualification plan. Conversion Schedule Qualification testing is scheduled for completion in the , Process: EPIC-1S Pin: 5 TABLE 2: Reliability Qualification Plan DESCRIPTION CONDITIONS SAMPLE/ACCEPT +150 °C, 300 hours 116 / 0 -65 to 150° C, 1000 cycles 77 / 0 ESD Human Body ... | Original |
2 pages, |
SN74AHC1G14 datasheet abstract |
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| Abstract: : Reliability Qualification Plan DESCRIPTION *Static Life Test CONDITIONS +150 °C, 300 hours SAMPLE/ACCEPT 116/0 *Temperature Cycle (1) -65 to 150° C, 1000 cycles 77/0 ESD Human Body Model 100 pF, 1.5K ±2 KV 3/0 ESD Machine Model 200 pF, 0 , ±200 Volts 3/0 0 , ±1000 Volts 3/0 Per data sheet 50 Dev ESD Charged Device Model Electrical Characterization Latch-up , qualification plan. Conversion Schedule Qualification testing is scheduled for completion in the 1Q99 ... | Original |
2 pages, |
UA9636ACP SN74F04N MC3403N SN74LS04N datasheet abstract |
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| Abstract | Saved from | Date Saved | File Size | Type | Download |
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| Discharge Sensitivity (ESD) Program 3.4.3.1.P 2.16 Certification Test Plan 3.4.3.1.Q 2.17 Qualification Test Plan 3.4.3.1.Q 2.18 Corrective Action Plan 3.4.3.D 2.19 Third Party Activities 3 QML Quality Management Plan Harris Corporation's Home Page ¤ Semiconductor's Home Page ¤ Harris Quality ¤ QML Quality Management Plan Table of Contents Harris Quality Management Plan Test Flows 3.4.3.1.B.5 2.2.6 QML Listing Coverage 3.4.3.1.B.6 2.2.7 Sec, TCV, & Process www.datasheetarchive.com/files/harris/quality/toc.htm |
Harris | 15/08/1997 | 4.49 Kb | HTM | toc.htm |
| stress test driven qualification requirements and references test conditions for qualification of 2. CDF - AEC - Q101 - 001 ESD ( Human Body Model - HBM ) To establish a reliable and repeatable procedure for determining the HBM ESD sensitivity for discrete components. 3. CDF - AEC - Q101 - 002 ESD ( Machine model - MM ) To establish a reliable and repetitive procedure for determining the MM ESD sensitivity for discrete components. 4. CDF- AEC - Q101 - 003 www.datasheetarchive.com/files/international-rectifier/docs/wcd00001/wcd001f8.htm |
International Rectifier | 06/10/1998 | 9.49 Kb | HTM | wcd001f8.htm |
| latch-up was observed. d) Reliability tests were performed according to qualification plan e according to qualification plan "WARNING" : Tests results and information contained in this document are PACCARD QA Manager Phone : 00 33 4 76 58 58 07 Q UALIFICATION REPOR T SHORT FORM "WARNING" : Tests datasheet specification. b) ESD measurement was performed according to MILSTD883C MILSTD883C MILSTD883C MILSTD883C ESD resistance is : Detailed results are available upon request. Q UALIFICATION REPOR T SHORT FORM Reliability Test Nb www.datasheetarchive.com/files/stmicroelectronics/stonline/books/ascii/docs/7556.htm |
STMicroelectronics | 31/01/2001 | 8.37 Kb | HTM | 7556.htm |
| ) Latch- up immunity. d) Reliability tests were performed according to qualification plan e qualification plan "WARNING" : Tests results and information contained in this document are for information . d) Reliability tests were performed according to qualification plan Reliability Test Nb rejects UALIFICATION REPOR T SHORT FORM "WARNING" : Tests results and information contained in this document are = -405C -405C -405C -405C / 255C / 1255C 1255C 1255C 1255C : results conform to datasheet specification. b) ESD measurement was performed www.datasheetarchive.com/files/stmicroelectronics/stonline/books/ascii/docs/7553.htm |
STMicroelectronics | 31/01/2001 | 9.9 Kb | HTM | 7553.htm |
| Qualification Plan The following qualification plan has been defined to qualify the product/process transfer from MOS8 to TSC6: Stress Test Life Test 125C, 6V 3 ESD (Human Body Model) 3 . Reliability data will be available from the factory upon completion of the qualification stress test www.datasheetarchive.com/files/motorola/68300/pcn4926.html |
Motorola | 13/06/2002 | 13.15 Kb | HTML | pcn4926.html |
| . 5. ESD Description: All the I/O pins passed 2000V test. Vdd environment for 100 msec programming time. Plan: It will be fixed in the future sec/word, the device can be operated down to 3.3V. Plan: It will be fixed events. Workaround: None. Plan: It will be fixed in . Workaround: Revision 1.1 of the SX Key provides the trimming capability. Plan www.datasheetarchive.com/files/scenix/htdocs/controllers/infosheet2.html |
Scenix | 09/06/2000 | 13.65 Kb | HTML | infosheet2.html |
| . 5. ESD Description: All the I/O pins passed 2000V test. Vdd environment for 100 msec programming time. Plan: It will be fixed in the future sec/word, the device can be operated down to 3.3V. Plan: It will be fixed events. Workaround: None. Plan: It will be fixed in . Workaround: Revision 1.1 of the SX Key provides the trimming capability. Plan www.datasheetarchive.com/files/scenix/htdocs/support/errata/errata2.html |
Scenix | 14/06/2000 | 14.45 Kb | HTML | errata2.html |
| . Plan: It will be fixed in the future revision of the silicon extended to 1 sec/word, the device can be operated down to 3.3V. Plan . Workaround: None. Plan: It will be fixed in Key provides the trimming capability. Plan in the future. 5. ESD www.datasheetarchive.com/files/ubicom/htdocs/hardware/infosheet2.html |
UBICOM | 12/02/2001 | 13.96 Kb | HTML | infosheet2.html |
| continued UnitrodeÂ's laboratory suitability by certifying that our test methods are performed in who prepares and completes a formal qualification plan per QP 2515. Key require-ments for major with full SPICE models; completed process control plan with identified critical, significant and significant and critical characteristics; documented out of control action plans (OCAPs); completed reliability tests that are performed for new major processes www.datasheetarchive.com/files/unitrode/catalog/products/quality.htm |
Unitrode | 30/06/1998 | 24.6 Kb | HTM | quality.htm |
| Revenues Unionization Subcontracting Business / technical plan Quality Organization Inspection Result Maintenance Testing of Physical or Chemical Properties Drawing and Test Use of Statistical Process Control Electrostatic Discharge Control (pg 3) ESD Training and Certification Static-safe Area Identification ESD Sensitive Product Packaging ESD Checks Equipment Calibration (pg 3) Calibration Procedures Calibration Records www.datasheetarchive.com/files/national/htm/nsc03862.htm |
National | 16/08/2002 | 14.3 Kb | HTM | nsc03862.htm |