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ESD test plan

Catalog Datasheet MFG & Type PDF Document Tags

HIOKI 3119

Abstract: CSL-Z7302 packing configurations References 1. 2. 3. 4. 5. 6. 14 Oscar Trevino, ESD Test Plan for TI , testing. All devices passed the postexposure testing. Test elements and materials were: · Test Plan , test point was exposed in the same manner. Electrostatic Discharge (ESD) Protective Semiconductor , Electrostatic-Field Meter Adhesive Side Figure 11. Typical Unrolling Test Electrostatic Discharge (ESD , Application Report SZZA027A - April 2002 Electrostatic Discharge (ESD) Protective
Texas Instruments
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HIOKI 3119 CSL-Z7302 EIA-383 JESD625-a ESD test plan JESD625

ESD test plan

Abstract: TB-3046 the technical requirements of the ESD Control Program Plan. Process monitoring (measurements) shall be , Verification Plan shall document the test methods and equipment used for process monitoring and measurements , measurements defined in the Compliance Verification Plan." (ANSI/ESD S20.20-2007 section 7.3) The Analog , ) 19786 Analog Surface Resistance Meter 19785 Shielded Test Leads 50003 Electrodes, 5 lbs. ESD , Packaging control plan. Approved ESD materials (see product qualification table at ANSI/ESD S20
Desco Industries
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TB-3046 TR2020
Abstract: ESD Control Program Plan. Process monitoring (measurements) shall be conducted in accordance with a , , then there must be a tailoring statement that is documented as part of the ESD Control Program Plan , Resistance Meter 19785 Shielded Test Leads 50003 5 Pound Electrodes 50005 Concentric Ring Probe ESD , control plan. Approved ESD materials (see product Packaging qualification table at ANSI/ESD S20.20-2007 Table 3 19784 Analog Surface Resistance Test Kit EPA ESD control items) 1 Analog Surface Desco Industries
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Abstract: incorporated into the ESD program plan.â' 6.1.3.2. Compliance Verification Plan Guidance â'In addition to , â'' TECHNICAL BULLETIN TB-3064â'' ESD Survey Kit Operation and Maintenance Made in the United States of America Description The Desco ESD Survey Kit is used for measuring, verifying, and qualifing products for used in the ESD Protected Area. The kit includes the following instruments: â'¢ â'¢ â'¢ â'¢ Figure 1. Desco 50568 ESD Survey Kit, North America, 120VAC â'¢ â Desco Industries
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220VAC

ESD test plan

Abstract: TB-3037 user's ESD control plan. Approved ESD materials (see product qualification table at ANSI/ESD S20 , of the technical requirements of the ESD Control Program Plan. Process monitoring (measurements , . The Compliance Verification Plan shall document the test methods and equipment used for process , the test · ESD sensitive devices should also be removed · Place the Surface Resistance Checker on the , per ANSI/ESD STM 2.1. The point-to-point and sleeve-to-sleeve resistance test should be made." (see
Desco Industries
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TB-3037

ASTM-F-150

Abstract: fashion garment to be used to make measurements in accordance with the test methods in: · Worksurfaces - ANSI/ESD S4 , items should be tested: A. Prior to installation to qualify for listing in user's ESD control plan , part of ESD control plan compliance verification plan "A Compliance Verification Plan shall be , frequency at which those verifications shall occur. The Compliance Verification Plan shall document the test , statement that is documented as part of the ESD Control Program Plan. Compliance verification records shall
Desco Industries
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ESD-ADV53 ASTM-F-150 fashion garment ASTMF-150 3014 LED 1X10E12 3014 LEDs TB-3014 STM12 STM97

AEC-Q101-001

Abstract: AEC-Q101-REV-C .2 . Qualification Test Plan , Qualification Test Plan The product qualification test plan is outlined in Table 1. This plan is based on the , Product Qualification Test Plan (Tc = case temperature, Tj = junction temperature, Vbr= breakdown voltage , Per spec 6 12 0 Table 4: ESD Test Results at 25ºC, 60% RH Product ESD CLASSIFICATION , Diode Product Qualification Plan. Please refer to Table 1 for specific test conditions. Parametric
Cree
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C2D05120A C2D20120D AEC-Q101-001 AEC-Q101-REV-C jesd22-a105-c JESD22-A105C AEC-Q101-002 C2D10120A C2D10120D

ASTM-F-150

Abstract: : A. Prior to installation to qualify for listing in userâ'™s ESD control plan approved ESD control , ensure the Organizationâ'™s fulfillment of the technical requirements of the ESD Control Program Plan , at which those verifications shall occur. The Compliance Verification Plan shall document the test , statement that is documented as part of the ESD Control Program Plan. Compliance verification records , shielded (identified by insulated tip and barrel black lead) - see Rtg test procedure: Per ANSI/ESD S4
Desco Industries
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KMC-184

Abstract: N00186 qualification plan Reliability Test High Temperature Bias Test T = 125°C Duration = 1000H Nb rejects , according to qualification plan Nb rejects Package High Temperature Bias Test T = 125°C Duration = , ) Reliability tests were performed according to qualification plan Nb rejects Reliability Test Package , datasheet specification. b) ESD measurement was performed according to MILSTD883C ESD resistance is , latch-up was observed. d) Reliability tests were performed according to qualification plan
STMicroelectronics
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Q092XS1 TS921 TS924 TS925 TS922 HC10-2 KMC-184 N00186 hf2c 76 HC10 TS92X

10E7

Abstract: ESD test plan at which those verifications shall occur. The Compliance Verification Plan shall document the test , be capable of making the measurements defined in the Compliance Verification Plan." Per ANSI/ESD S1 , Requirements of the Plan." The Combo Tester X3 incorporates a test circuit design that allows operators to test , for footwear. The Combo Tester X3 can be tailored to other ESD Control Plan requirements with DIP , Parts 30 Volt Test Signal Relay For Use With Automatic Doors Or Other Locking Systems Per ANSI/ESD
Desco Industries
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10E7 TB-3034

maxim 77

Abstract: required 7.2.1.2. Test condition and test duration 7.2.1.3. Sampling plan 7.2.1.4. Qualification , PACKAGES STRESS TEST NAME Life Test, Dynamic preferable CONDITION SAMPLING PLAN SS / Acc or , QUALIFICATION REQUIREMENTS FOR IC'S IN HERMETIC PACKAGES STRESS TEST NAME CONDITION SAMPLING PLAN SS , CONDITION PLAN TEST CONDITION SAMPLING PLAN TEST CONDITION SAMPLING PLAN 135oC/192 hrs , / 85 Test *1 Pressure Pot *1 ESD YES Latch-up 45 / 0 YES Bondwire Pull
Maxim Integrated Products
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maxim 77 C/1000 C/192

ASTM-F-150

Abstract: fashion garment plan approved ESD protective materials (see ANSI/ESD S20.20 paragraph 6.1.1.2) B. During initial installation C. For periodic checks of installed products as part of ESD control plan compliance verification plan Per ANSI/ESD S20.20, test equipment is required to enact Compliance Verification Plan Requirement , requirements that are incorporated into the ESD program plan." The Surface Resistance Test Kit is NIST , Product - Display same as Periodic Check above Figure 1. Item 19780 Surface Resistance Test Kit ESD
Desco Industries
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EIA-625 esd 20.20 MIL-HDBK-263A
Abstract: ] damage, the ESD program shall include a plan for the handling of process-required insulators. If the , 6.1.1.2. ESD Control Program Plan Guidance states: â'The Plan should include a listing of the specific , incorporated into the ESD program plan.â' And paragraph 6.1.3.2. Compliance Verification Plan Guidance states , by a standard test published by the ESD Association Standard ANSI/ESD S3.1. The typical discharge , test kit (ANSI/ESDâ'SP33). ANSI/ ESD S20.20 specifies that the compliance verification of ionizers Desco Industries
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TB-3006

HC10-2

Abstract: TS95X qualification plan Reliability Test Nb rejects Package High Temperature Bias Test T = 125 , according to qualification plan Reliability Test Nb rejects Package High Temperature Bias Test T , conform to datasheet specification. b) ESD measurement was performed according to MILSTD883C ESD , °0018695) No latch-up was observed. d) Reliability tests were performed according to qualification plan Reliability Test High Temp Bias Test T° = 125°C Duration = 168h 2000h Temp Humidity Bias Test T ° = 85
STMicroelectronics
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TS95X TS951 TS952 TS954 MP8000 sot23-5 amplifier pF-36 so8 Wire bond 5.6 SOT23-5 Q095XS1 MG46FC-AM

stv9302a

Abstract: stv9302a equivalent Humidity Bias Test ESD: Electrostatic Discharge LU: Latch-up DESCRIPTION The device is stressed , goods label Description of qualification program See Attached Qualification Plan Product Line(s , Please sign and return to STMicroelectronics Sales Office Qualification Plan Denied Name: Qualification Plan Approved Title: Company: Change Denied Date: Change Approved Signature , : Date: Page 1 of 7 1 - CONTENT 1 - CONTENT 2 - GENERAL 3 - DEVICE INFORMATION 4 - ESD and
STMicroelectronics
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E-STV9302A stv9302a stv9302a equivalent STV9302 STV9302A datasheet stv9302a fault ecopack CMG-DTV/04/679 STV9302A

A434 RF MODULE

Abstract: JESD31 requirements": The manufacturer shall follow the test method requirements per MIL-PRF-38535 or TM 5004 / TM , 5004/5005 of MIL-STD-883 and MIL-PRF-38535 test method. To ensure follow TM5004/5005 of MIL-STD-883 or to follow MIL-PRF-38535 test method, but not both just pick and chose DSCC 14 3.15 and , add footnote 1/ "Group B test shall be performed on each inspection lot, for each qualified package type and lead finish" For clarification DSCC 19 Table IV To add Group C test for "Die
DEPARTMENT OF DEFENSE
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A434 RF MODULE JESD31 TRANSISTOR SMD MARKING CODE A45 NCSL Z540.3 MIL-I-46058 part marking b36 smd diode MIL-PRF-38535J RD-650

ESD test plan

Abstract: J-STD-020B Date Qualification Plan # 1972A-1-10-2006-472 1/10/2006 Group Definition 1 New , 2 Unmarked 3 4 5 6 Life Test Qual Num Lot Condition 2006-RM-32 2006 , -RM-33 E545004AJ 545005AJ -40C to +100C -40C to +100C Temperature Cycle Hrs/Cycles Plan Actual 1000hrs 1000hrs 1000 1000 Hrs/Cycles Plan Actual 100 cycles 100 cycles 100 100 Hrs/Cycles Plan Actual Start End S/S 2/22/2006 2/22/2006 4/28/2006 4/7/2006 50 50
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NT600H-10000 J-STD-020B nt600 100C JESD78 J-STD-020-B S1972A BD1972A BI1972 2006-RM-33 JSTD-020B
Abstract: Applications" and as defined in the HP-FCO Qualification Plan QP034. All the test requirements have been satisfied with the exception of ESD which is discussed in the section on Non Conformances. HP (FCO). The , . qualification test program is shown in Appendix A. Although, at the beginning and end of each leg, the devices , the facilities to test in house do not exist for the tests detailed below, the work was sub contracted as shown: Mechanical Shock, Vibration, Thermal Shock, Flammability C-MAC Microcircuits Ltd. Test -
OCR Scan
LST062X-SC-A LST062 TA-NWT000983 SL498630 SL498633 SN339613

GT 1081

Abstract: transistor GT 1081 Qualification Plan QP034. All the test requirements have been satisfied with the exception of ESD which is , . Test House South Denes Gt Yarmouth. ESD BTL Research Laboratories Martlesham Heath Ipswich , Where the facilities to test in house do not exist for the tests detailed below, the work was , requirements defined in HP-FCO Qualification Plan QP034. A full set of results summarizing the changes in , qualification test program is shown in Appendix A. Although, at the beginning and end of each leg, the
Hewlett-Packard
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IEC825-1 GT 1081 transistor GT 1081 58993 74469 sl447 iec 90092 SN339633 SN339634 SN339639 SN339642 SL400531

ESD test plan

Abstract: CGA-0116 reliable operation by passing all qualification testing in our product qualification test plan. The CGA , based on JEDEC test methods common to the semiconductor industry. A FMEA approach is used to determine the test methods to be included in the qualification plan. The manufacturing test specifications are , manufacturing test specification. The ESD class quoted indicates that the device passed exposure to a certain , qualification) uses three or more wafers completing the entire qualification plan for that product. A
Sirenza Microdevices
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CGA-0116 RQR-103796 1500C 0116 led JESD22-A103 1100C
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