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EME-6300H

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EME-6300H

Abstract: sumitomo epoxy Name/Manufacturer: Lead Frame material: Sumitomo EME-6300H(R) Copper Lead Finish, composition , : Sumitomo EME-6300H(R) Copper Lead Finish, composition: Solder Dipped, 63%Sn, 37%Pb Die Attach
Cypress Semiconductor
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CY7C408A CY7C409A sumitomo epoxy eme 6300h cypress fifo cy7c408A 6300H CY7C408A/CY7C409A 7C408/7C409 7C408WT-PC 7C408WT-VC

PAL16L8

Abstract: Epoxy Sumitomo 1085 material: Sumitomo EME-6300H(R) Copper (Olin 194) Lead Finish, composition: Solder Plated, 85 , : Sumitomo EME-6300H(R) Copper (Olin 194) Lead Finish, composition: Solder Plated, 85%Sn, 15
Cypress Semiconductor
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CY7B145 PAL20 PAL16L8 CY7B185-VC Epoxy Sumitomo 1085 cy7b185 CY7B145/CY7B185/PAL16L8 CY7B185 7B145A

EME-6300H

Abstract: 6300H mils per side Mold Compound Name/Manufacturer: Lead Frame material: Sumitomo EME-6300H(R , : Lead Frame material: Sumitomo EME-6300H(R) Copper Lead Finish, composition: Die Attach Area
Cypress Semiconductor
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CY7C199 CY7C1399 CY7C197 mos die 7C199C 2KA/10KA/150A 3/R28 7C199 CY7C199-VC
Abstract: DCS/PCN-1134 PRODUCT CHANGE NOTICE Initial Final Contact Date: Implementation Date: Alert Category: Alert Type: PCN #: April 30, 2009 May 30, 2009 Material Change Mold compound/die attach change PCN #: 1134 TITLE Conversion of Sumitomo mold compound EME-6300H (being discontinued by manufacturer) to Sumitomo equivalent mold compound EME6600CSP and additional die attach , replace EME-6300H. In addition, and to assure continuity of supply to our customers, Diodes, Inc is also Diodes
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84-1LMISR4 EME-6300CSP EME-63000H EME-6600CSP 841LMISR4 263-3L

EME-6300H

Abstract: 86171 Mold Compound Name/Manufacturer: Lead Frame material: Sumitomo EME-6300H(R) Copper Lead Finish , Mold Compound Name/Manufacturer: Lead Frame material: Sumitomo EME-6300H(R) Copper Lead Finish
Cypress Semiconductor
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CY7C150 86171 CY7C123 UL-94V0 EME6300H 94v-0 dynamic RAM 7C150A

EME-6300

Abstract: eme 6300h side Mold Compound Name/Manufacturer: Lead Frame material: Sumitomo EME-6300H(R) Copper Lead , side Mold Compound Name/Manufacturer: Lead Frame material: Sumitomo EME-6300H(R) Copper Lead
Cypress Semiconductor
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CY7C191 CY7C192 CY7C194 CY7C195 CY7C196 CY7C198 EME-6300

EME-6300H

Abstract: 7c42x /Manufacturer: Lead Frame material: Sumitomo EME-6300H(R) Copper Lead Finish, composition: Solder , Frame material: Sumitomo EME-6300H(R) Copper Lead Finish, composition: Solder Plate, 85%Sn, 15
Cypress Semiconductor
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CY7C419 CY7C425 7c42x sumitomo EME-6300H sumitomo 6300h mold compound CY7C420/CY7C421 CY7C424/CY7C425 7C425 7C425D

EME-6300H

Abstract: sumitomo epoxy 6300h : 148 mils per side Mold Compound Name/Manufacturer: Lead Frame material: Sumitomo EME-6300H , material: Sumitomo EME-6300H Copper Lead Finish, composition: Solder Plated, 85%Sn, 15%Pb Die
Cypress Semiconductor
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sumitomo epoxy 6300h J28S D284 yc 504 CY10E484/CY10E484L CY100E484/CY100E484L CY101E484/CY101E484L CY10E484 CY10E484L 10E484A/10EL484A

CY7B185

Abstract: CY7B922 Compound Name/Manufacturer: Lead Frame material: Sumitomo EME-6300H(R) Copper Lead Finish , BiCMOS Process Loc: Round Rock, TX Sumitomo EME-6300H(R) Lead Frame: Copper Omedata
Cypress Semiconductor
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CY7B991 CY7B992 SM23B CY7B922 clock buffer FITS CY7B991-LMB 7B991A/7B992A 6A166 JEDEC22

EME-6300H

Abstract: 28-pin SOJ SRAM Compound Name/Manufacturer: Lead Frame material: Sumitomo EME-6300H(R) Copper Lead Finish , : Sumitomo EME-6300H(R) Copper Lead Finish, composition: Die Attach Area Plating: Solder Plated, 85
Cypress Semiconductor
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28-pin SOJ SRAM Omedata CY7C199-PC JESD22-A112

sumitomo silver epoxy

Abstract: EME-6300H mils per side Mold Compound Name/Manufacturer: Lead Frame material: Sumitomo EME-6300H(R , /Manufacturer: Lead Frame material: Sumitomo EME-6300H(R) Copper Lead Finish, composition: Die Attach
Cypress Semiconductor
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CY7C460 CY7C462 CY7C464 CY7C470 CY7C472 CY7C474 sumitomo silver epoxy mold compound P2868 CY7C46X/47X

sumitomo epoxy 6300h

Abstract: sumitomo epoxy eme6300h : Lead Frame material: Sumitomo EME-6300H(R) Copper Lead Finish, composition: Solder Dipped, 63 , clearance: 30 mils per side Mold Compound Name/Manufacturer: Lead Frame material: Sumitomo EME-6300H
Cypress Semiconductor
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sumitomo epoxy eme6300h prime p27 Sumitomo 1000 7C258 7C259 CY7C258/259 7C258/9A PLD20DJ

sumitomo epoxy 6300h

Abstract: sumitomo epoxy : Sumitomo EME-6300H(R) Copper Lead Finish, composition: Solder Dipped, 85%Sn, 15%Pb Die Attach , per side Mold Compound Name/Manufacturer: Lead Frame material: Sumitomo EME-6300H(R) Copper
Cypress Semiconductor
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CY74FCT16244T wafer LTO hysol 7C7144A CT16244TPVC CY74FCT16244TPAC CY74FCT16244TPVC

solder paste 63sn alpha metal

Abstract: EME-6300H material: Sumitomo EME-6300H(R) Copper Lead Finish, composition: Solder Dipped, 63%Sn, 37 , Frame material: Sumitomo EME-6300H(R) Copper Lead Finish, composition: Solder Dipped, 63
Cypress Semiconductor
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CY7C245A CY7C291A CY7C293A solder paste 63sn alpha metal 7C245E 7C291E CY7C245A/CY7C291A/CY7C293A

CY7C371

Abstract: EME-6300H : Lead Frame material: Sumitomo EME-6300H(R) Copper Die coating(s), if used: none Lead
Cypress Semiconductor
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CY7C371 JESD22 tunel 7C371A FLASH24/28 30C/60 CY7C371-JC 85C/85

Ablestik

Abstract: EME-6300H Cypress Semiconductor Qualification Report QTP# 96225 VERSION 1.0 August, 1997 52 Pins PLCC Omedata Assembly Cypress Semiconductor Assembly: Omedata, Inodnesia Package: 52 pins PLCC QTP# 96225, V. 1.0 Page 2 of 4 August, 1997 PLASTIC PACKAGE/ASSEMBLY DESCRIPTION Package Outline, Type, or Name: 52 Pins PLCC Mold Compound Name/Manufacturer: Lead Frame material: Sumitomo EME-6300H Copper Lead Finish, composition: Solder Plated, 85%Sn, 15%Pb Die Attach Area Plating: Silver
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Ablestik 140C MIL-STD-883C CY7C131-JC

cmos SRAM 35ns 8k X 8 dip

Abstract: 7C166 side (600-mil) Mold Compound Name/Manufacturer: Lead Frame material: Sumitomo EME-6300H(R , : Sumitomo EME-6300H(R) Copper Lead Finish, composition: Solder Plate, 80%Sn, 20%Pb Die Attach Area
Cypress Semiconductor
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CY7C161 CY7C162 CY7C164 CY7C166 CY7C185 CY7C186 cmos SRAM 35ns 8k X 8 dip 7C166

sumitomo 6300h mold compound

Abstract: 93191 Mold Compound Name/Manufacturer: Lead Frame material: Sumitomo EME-6300H(R) Copper Lead Finish , material: Sumitomo EME-6300H(R) Copper Lead Finish, composition: Solder Plated, 85%Sn, 15
Cypress Semiconductor
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93191 7C199A 500AT PLTO/15 CY7C199-DC CY7C199-DMB CY7C191/192/194/195/196/197/198/199

CY101E383

Abstract: EME-6300H : Lead Frame material: Sumitomo EME-6300H(R) Copper Lead Finish, composition: Solder Plated, 85
Cypress Semiconductor
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CY101E383 9434 CY10E383 100E383A CY101E383-JC

AL3000A

Abstract: EME-6300H 24-pin Square PLCC Mold Compound Name/Manufacturer: Lead Frame material: Sumitomo EME-6300H(R
Cypress Semiconductor
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PALCE20V8 AL3000A 7C320B 7C320A FLASH22D CE20V8-PC PALCE20V8-PC
Abstract: Name/Manufacturer: Lead Frame material: Sumitomo EME-6300H(R) Copper Lead Finish, composition , : Sumitomo EME-6300H(R) Copper Lead Finish, composition: Solder Dipped, 63%Sn, 37%Pb Die Attach Melexis
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MLX90222

MLX90222

Abstract: : 148 mils per side Mold Compound Name/Manufacturer: Lead Frame material: Sumitomo EME-6300H , material: Sumitomo EME-6300H Copper Lead Finish, composition: Solder Plated, 85%Sn, 15%Pb Die
Melexis
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PCN0702

Abstract: SUMITOMO G700 material: Sumitomo EME-6300H(R) Copper (Olin 194) Lead Finish, composition: Solder Plated, 85 , : Sumitomo EME-6300H(R) Copper (Olin 194) Lead Finish, composition: Solder Plated, 85%Sn, 15
Altera
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PCN0702 G700M 2000HG SUMITOMO G700 SUMITOMO G600 SUMITOMO EME G700 SUMITOMO EME G600 EME G600 6300HJ MP8000CH4 DMC-2000HG

eftec

Abstract: Eftec 64t : Sumitomo EME-6300H(R) Copper Lead Finish, composition: Solder Dipped, 85%Sn, 15%Pb Die Attach , per side Mold Compound Name/Manufacturer: Lead Frame material: Sumitomo EME-6300H(R) Copper
Melexis
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eftec Eftec 64t

MLX90222

Abstract: Temperature controller schematic : Lead Frame material: Sumitomo EME-6300H(R) Copper Lead Finish, composition: Solder Dipped, 63 , clearance: 30 mils per side Mold Compound Name/Manufacturer: Lead Frame material: Sumitomo EME-6300H
Melexis
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Temperature controller schematic

UGN3075

Abstract: ss41 hall effect sensor Compound Name/Manufacturer: Lead Frame material: Sumitomo EME-6300H(R) Copper Lead Finish , BiCMOS Process Loc: Round Rock, TX Sumitomo EME-6300H(R) Lead Frame: Copper Omedata
Melexis
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US3881 UGN3075 ss41 hall effect sensor HALL SOT-23 U38 HALL marking 866 MLX3881
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