EM4200 EM4100 EM4102 EM4005 EM4105 EM4205 EM4305 RF/16 RF/32 RF/64 - Datasheet Archive

 

EM4200 Product Presentation Backward compatibility with EM410x read only chips November. 2008 EM4200 ­ EM410x Compatibility 1

 

A COMPANY OF THE EM4200 EM4200 Product Presentation Backward compatibility with EM410x read only chips November. 2008 EM4200 EM4200 ­ EM410x Compatibility 1 EM4200 EM4200 ­ Main Features Latest generation of low frequency read only chip Direct successor of existing EM4100 EM4100, EM4102 EM4102, EM4005 EM4005 and EM4105 EM4105 ICs Improved reading range performances, robust solution Backward compliant with existing installed bases (all communication protocols supported) 128 bit ROM factory programmed, 2 * 64 bit or 1 * 128 bit serial number format Advanced serial number data base management to ensure uniqueness over EM4x0x chip generations November. 2008 EM4200 EM4200 ­ EM410x Compatibility 2 EM4200 EM4200 ­ Main Features Mega bumps version available for flip chip process assembly Several options for the resonant capacitor 75pF, 210pF and 250pF Compatibility with other EM Marin LF chips (EM4205 EM4205 and EM4305 EM4305) November. 2008 EM4200 EM4200 ­ EM410x Compatibility 3 EM4200 EM4200 ­ One single chip replacing 4 existing ones EM4200 EM4200 EM4100 EM4100 64 bit Read Only Manchester, PSK RF/16 RF/16, RF/32 RF/32, RF/64 RF/64 Cres of 74pF Standard pads Applications Access Control Industrial and Logistics November. 2008 EM4005 EM4005 EM4102 EM4102 64 bit Read Only Manchester, PSK RF/16 RF/16, RF/32 RF/32, RF/64 RF/64 Cres of 78pF Mega pads 128 bit Read Only ISO11784/11785 ISO11784/11785 Biphase RF/32 RF/32 Cres of 75pF Standard pads EM4105 EM4105 128 bit Read Only ISO11784/11785 ISO11784/11785 Biphase RF/32 RF/32 Cres of 75pF Standard pads Applications Live stock and Pets BDE and Waste Management EM4200 EM4200 ­ EM410x Compatibility 4 EM4200 EM4200 - Compatibility Data Structure 2 * 64 bits EM4100/EM4102 EM4100/EM4102 data telegram composed by: 9 bits header ­ Start bit "0" 8 bit customer code 32 bit data field Column and Row Parity bit 1 * 128 bit of EM4005/EM4105 EM4005/EM4105 ISO11784/11785 ISO11784/11785 BDE telegram structure Data encodings: Manchester, Biphase, PSK Data Rates: RF/16 RF/16, RF/32 RF/32, RF/64 RF/64 Resonant Capacitor: 75pF November. 2008 EM4200 EM4200 ­ EM410x Compatibility 5 EM4200 EM4200 ­ Added Key features Higher resonant capacitor versions (210pF and 250pF) for tag miniaturization and process optimization Improved reading range on sensitive readers (~10% more). Transparent behavior on other readers and installed bases FSK2 data encoding supported Small die size, around 70k parts per 8 inch wafer Minimum ordering quantity of 2 wafers (~140k parts) New thin plastic package designed for manual or thermo compression soldering processes: EMDFN02 EMDFN02 November. 2008 EM4200 EM4200 ­ EM410x Compatibility 6 EM4200 EM4200 ­ Electrical Parameters Comparison Parameters Operating temperature range Storage temperature range EM4100 EM4100 EM4102 EM4102 EM4005 EM4005 EM4105 EM4105 ICOIL -30 to +30mA -30 to +30mA -30 to +30mA -30 to +30mA -30 to +30mA TOP -40 to +85°C -40 to +85°C -40 to +85°C -40 to +85°C -40 to +85°C TSTORE -55 to +200°C -55 to +200°C -55 to +200°C -55 to +200°C -55 to +200°C VESD 2000V 1000V 2000V 1000V 1000V ICOIL1 +/- 10mA +/- 10mA +/- 10mA +/- 10mA +/- 10mA 100kHz 100kHz 100kHz 100kHz ­ ­ ­ ­ ­ 150kHz COIL1/COIL2 EM4200 EM4200 100kHz Input current on Symbol 150kHz 150kHz 150kHz 150kHz Electrostatic discharge to MIL-STD-883 MIL-STD-883 method 3015 Between Coil1 and Coil2 Maximum coil current Frequency on coil pads FCOIL1 Limiter Voltage VLIM 8.2V Typ 7V Typ 7V Typ 7V Typ 7V Typ Resonant Capacitors CR 75pF +/-10% 74pF +/-15% 78pF +/-15% 75pF +/-15% 75pF +/-15% Modulation index range in ASK mode Mr 41 - 73% 40 - 64% 35 - 62% 36 - 56% 36 - 56% November. 2008 EM4200 EM4200 ­ EM410x Compatibility 7 EM4200 EM4200 ­ Wafer form versions EM4200 EM4200 A 6 WS 7 - %%% Circuit Nb: Customer Version: EM4200 EM4200 %%% = only for custom specific version Bit coding: A = Manchester B = Bi-Phase C = PSK E = FSK Cycle/bit n: Thickness: N = 3,4,5,. (e.g.64=26 -> n=6) X = other 6 = 6 mils (152um) 7 = 7 mils (178um) 11 = 11 mils (280um) Die form: 27 = 27 mils (686um) WW = Wafer WS = Sawn Wafer/Frame November. 2008 EM4200 EM4200 ­ EM410x Compatibility 8 EM4200 EM4200 ­ Package versions EM4200 EM4200 A 6 DF2 C - %%% Circuit Nb: Customer Version: EM4200 EM4200 Bit coding: A = Manchester B = Bi-Phase C = PSK E = FSK Cycle/bit n: Delivery form: C=Bulk (vrac) H=Wafer frame N = 3,4,5,. (e.g.64 = 26 -> n = 6) X = other Package: DF2 = EMDFN02 EMDFN02 Package mechanical dimensions: A D E B l1 l2 Size 0.76 2.20 1.78 1.07 0.71 1.08 Tolerance 0.10 0. 15 0.15 0.05 0.05 0.05 November. 2008 EM4200 EM4200 ­ EM410x Compatibility 9 Thank you for your confidence November 2008 EM4200 EM4200 ­ EM410x Compatibility 10