NEW DATABASE - 350 MILLION DATASHEETS FROM 8500 MANUFACTURERS
NEW DATABASE - 350 MILLION DATASHEETS FROM 8500 MANUFACTURERS
RC-1009B EIA481A TE1204 TE1208 QON16-P-0404-0 QON24-P-0505-0 8VEA26A 8VEA27A - Datasheet Archive
[ 4 ] Embossed Tape Specifications for Flat-Package Bipolar ICs 1. Scope Specifications for embossed-tape packing for
[ 4 ] Embossed Tape Specifications for Flat-Package Bipolar ICs [ 4 ] Embossed Tape Specifications for Flat-Package Bipolar ICs 1. Scope Specifications for embossed-tape packing for flat-package bipolar ICs and related issues (such as ordering) are usually in accordance with the relevant JEITA and JEDEC standards (RC-1009B RC-1009B and EIA481A EIA481A respectively). 2. Physical Specifications a-1) Tape shape 1.5 T + 0.1 -0 (unit: mm) 1.75 ± 0.1 K 4.0 ± 0.1 2.0 ± 0.05 A0 D1 B0 Sealing tape 12.0 ± 0.3 5.5 ± 0.05 Tape configuration example Embossed carrier tape Feedhole Device slot T2 Tape feed direction P1 TE1204 TE1204 and TE1208 TE1208 embossed taping a-2) List of relevant packages (unit: mm) Package Name A0 B0 P1 T K T2 QON16-P-0404-0 QON16-P-0404-0.65 4.95 4.95 8.0 ± 0.1 0.3 ± 0.1 1.6 ± 0.3 1.9 max 1.5 QON24-P-0505-0 QON24-P-0505-0.50 5.25 5.25 8.0 ± 0.1 0.3 ± 0.1 1.6 ± 0.3 1.9 max 1.5 Maximum Number of Packed Products Tape + 0.1 -0 2000 products/reel 8VG4A7A + 0.1 -0 2000 products/reel 8VG4A8A D1 Note 1: The dimension T2 equals the dimension K plus the thickness of the sealing tape. In the table above, the T2 dimension is equal to the maximum possible K dimension value (assuming that the thickness of the sealing tape does not exceed the tolerance for the dimension K). 53 [ 4 ] Embossed Tape Specifications for Flat-Package Bipolar ICs 1.5 T 4.0 ± 0.1 + 0.1 -0 2.0 ± 0.1 B0 T2 Tape configuration example Sealing tape 7.5 ± 0.1 A0 (unit: mm) 16 ± 0.3 K 1.75 ± 0.1 b-1) Tape shape Embossed carrier tape Feedhole D1 P1 Device slot Tape feed direction TE1204 TE1204 and TE1208 TE1208 embossed taping b-2) List of relevant packages (unit: mm) A0 B0 P1 T K T2 D1 Maximum Number of Packed Products Tape SOP8-P-225-1.27 6.9 5.7 8.0 ± 0.1 0.3 ± 0.1 2.5 ± 0.3 2.8 max 1.65 + 0.1 2000 products/reel 8VEA26A 8VEA26A SOP14-P-225-1.27 6.9 10.7 8.0 ± 0.1 0.3 ± 0.1 2.5 ± 0.3 2.8 max 1.65 + 0.1 2000 products/reel 8VEA27A 8VEA27A SOP14-P-300-1.27 8.5 10.8 12.0 ± 0.1 0.3 ± 0.1 2.4 ± 0.3 2.7 max 1.65 + 0.1 2000 products/reel 8VEC43A 8VEC43A SOP16-P-225-1.27 6.9 10.7 8.0 ± 0.1 0.3 ± 0.1 2.5 ± 0.3 2.8 max 1.65 + 0.1 2000 products/reel 8VEA27A 8VEA27A SOP16-P-300-1.27 8.5 10.8 12.0 ± 0.1 0.3 ± 0.1 2.4 ± 0.3 2.7 max 1.65 + 0.1 2000 products/reel 8VEC43A 8VEC43A SSOP10-P-0 SSOP10-P-0.65 5.5 4.1 8.0 ± 0.1 0.3 ± 0.1 2.1 ± 0.3 2.4 max 1.65 + 0.1 2000 products/reel 8VGA69A 8VGA69A SSOP10-P-225-1 SSOP10-P-225-1.00 6.9 6.0 8.0 ± 0.1 0.3 ± 0.1 2.5 ± 0.3 2.8 max 1.65 + 0.1 2000 products/reel 8VEA24A 8VEA24A SSOP16-P-225-1 SSOP16-P-225-1.00A 6.9 8.9 8.0 ± 0.1 0.3 ± 0.1 2.4 ± 0.3 2.7 max 1.65 + 0.1 2000 products/reel 8VEA09A 8VEA09A SSOP16-P-225-0 SSOP16-P-225-0.65B 6.8 5.5 8.0 ± 0.1 0.3 ± 0.1 2.15 ± 0.3 2.45 max 1.65 + 0.1 2000 products/reel 8VEA21A 8VEA21A SSOP18-P-225-0 SSOP18-P-225-0.65 6.8 7.0 8.0 ± 0.1 0.3 ± 0.1 2.15 ± 0.3 2.45 max 1.65 + 0.1 2000 products/reel SSOP20-P-225-0 SSOP20-P-225-0.65A 6.8 7.0 8.0 ± 0.1 0.3 ± 0.1 2.15 ± 0.3 2.45 max 1.65 + 0.1 2000 products/reel Package Name SSOP24-P-300-0 SSOP24-P-300-0.65A 8.0 8.3 12.0 ± 0.1 0.3 ± 0.1 2.15 ± 0.3 2.45 max 1.65 + 0.1 2000 products/reel 8VEA31A 8VEA31A SSOP30-P-300-0 SSOP30-P-300-0.65 8.0 10.2 12.0 ± 0.1 0.3 ± 0.1 2.15 ± 0.3 2.45 max 1.65 + 0.1 2000 products/reel 8VEA32B 8VEA32B QON48-P-0707-0 QON48-P-0707-0.50 7.55 7.55 12.0 ± 0.1 0.3 ± 0.1 1.6 ± 0.3 1.9 max 1.5 + 0.1 -0 2000 products/reel 8VG4A9A Note 1: The dimension T2 equals the dimension K plus the thickness of the sealing tape. In the table above, the T2 dimension is equal to the maximum possible K dimension value (assuming that the thickness of the sealing tape does not exceed the tolerance for the dimension K). 54 [ 4 ] Embossed Tape Specifications for Flat-Package Bipolar ICs + 0.1 1.5 - 0 T 4.0 ± 0.1 2.0 ± 0.1 Tape configuration example B0 11.5 ± 0.1 A0 (unit: mm) T2 Sealing tape 24 ± 0.3 K 1.75 ± 0.1 c-1) Tape shape Embossed carrier tape Feedhole D1 P1 Device slot Tape feed direction TE2412 TE2412, TE2416 TE2416 and TE2420 TE2420 embossed taping c-2) List of relevant packages (unit: mm) Package Name A0 B0 P1 T K T2 D1 Maximum Number of Packed Products 1000 products/reel Tape SOP18-P-375-1.27 10.8 13.2 16.0 ± 0.1 0.3 ± 0.1 2.9 ± 0.3 3.2 max 1.65 + 0.1 SOP20-P-300-1.27 8.3 13.3 12.0 ± 0.1 0.3 ± 0.1 2.5 ± 0.3 2.8 max 2.0 + 0.1 2000 products/reel 8VEC29B 8VEC29B SOP24-P-450-1.27A 12.5 16.5 16.0 ± 0.1 0.3 ± 0.1 3.7 ± 0.3 4.0 max 2.05 + 0.1 1000 products/reel 8VEC96A 8VEC96A SOP24-P-450-1.27B 12.5 16.5 16.0 ± 0.1 0.3 ± 0.1 3.7 ± 0.3 4.0 max 2.05 + 0.1 1000 products/reel 8VEC96A 8VEC96A SOP28-P-450-1.27 12.3 19.1 16.0 ± 0.1 0.3 ± 0.1 3.5 ± 0.3 3.8 max 2.0 + 0.1 1000 products/reel 8VGC45A 8VGC45A SSOP24-P-300-1 SSOP24-P-300-1.00 8.5 13.7 12.0 ± 0.1 0.3 ± 0.1 2.8 ± 0.3 3.1 max 1.65 + 0.1 2000 products/reel 8VEA25A 8VEA25A SSOP24-P-300-1 SSOP24-P-300-1.00B 8.5 13.7 12.0 ± 0.1 0.3 ± 0.1 2.8 ± 0.3 3.1 max 1.65 + 0.1 2000 products/reel 8VEA25A 8VEA25A SSOP30-P-375-1 SSOP30-P-375-1.00 11.2 15.9 16.0 ± 0.1 0.3 ± 0.1 3.3 ± 0.3 3.6 max 1.65 + 0.1 1000 products/reel 8VEA23A 8VEA23A TSOPII26/24-P-3001 TSOPII26/24-P-3001.27E 9.7 17.8 12.0 ± 0.1 0.3 ± 0.1 1.9 ± 0.3 2.2 max 2.0 + 0.1 1000 products/reel 8VG12GA 8VG12GA HSOP16-P-300-1 HSOP16-P-300-1.00 10.2 13.5 12.0 ± 0.1 0.3 ± 0.1 3.25 ± 0.3 3.55 max 1.65 + 0.1 1500 products/reel 8VEA28A 8VEA28A HSOP20-P-450-1 HSOP20-P-450-1.00 12.6 16.5 16.0 ± 0.1 0.3 ± 0.1 3.25 ± 0.3 3.55 max 1.65 + 0.1 1000 products/reel 8VEA30A 8VEA30A SOL20-P-300-1 SOL20-P-300-1.27 10.9 13.3 12.0 ± 0.1 0.3 ± 0.1 3.6 ± 0.3 3.9 max 2.05 + 0.1 1000 products/reel 8VG07CA 8VG07CA SOL20-P-300-1 SOL20-P-300-1.27 11.0 13.4 16.0 ± 0.1 0.3 ± 0.1 3.3 ± 0.3 3.6 max 2.05 + 0.1 1000 products/reel 8VGA44A 8VGA44A SOL20-P-300-1 SOL20-P-300-1.27 10.8 13.4 12.0 ± 0.1 0.3 ± 0.1 3.3 ± 0.3 3.6 max 2.05 + 0.1 1000 products/reel 8VGA44F 8VGA44F SOJ26/20-P-300-1 SOJ26/20-P-300-1.27 8.8 17.7 12.0 ± 0.1 0.3 ± 0.1 4.4 ± 0.3 4.7 max 2.0 + 0.1 1000 products/reel 8VG44CB/G 8VG44CB/G SOJ26/20-P-300-1 SOJ26/20-P-300-1.27A 8.8 17.7 12.0 ± 0.1 0.3 ± 0.1 4.6 ± 0.3 4.9 max 2.0 + 0.1 1000 products/reel 8VG48CC/H 8VG48CC/H SOJ26/20-P-350-1 SOJ26/20-P-350-1.27 10.2 17.8 12.0 ± 0.1 0.3 ± 0.1 4.3 ± 0.3 4.6 max 2.0 + 0.1 1000 products/reel 8VG5C2B SOJ28-P-400-1 SOJ28-P-400-1.27 11.8 19.2 16.0 ± 0.1 0.3 ± 0.1 4.6 ± 0.3 4.9 max 2.0 + 0.1 1000 products/reel 8VG5C1B SOJ28-P-400-1 SOJ28-P-400-1.27 11.6 18.8 16.0 ± 0.1 0.3 ± 0.1 4.45 ± 0.3 4.75 max 2.0 + 0.1 1000 products/reel 8VG5C1F QFJ18-P-R290-1 QFJ18-P-R290-1.27 8.7 13.9 12.0 ± 0.1 0.3 ± 0.1 3.9 ± 0.3 4.2 max 2.0 + 0.1 1000 products/reel 8VG47CA 8VG47CA QFP52-P-1010-0 QFP52-P-1010-0.65 13.7 13.7 24.0 ± 0.1 0.3 ± 0.1 2.95 ± 0.3 3.25 max 2.0 + 0.1 800 products/reel 8VG1A4A Note 1: The dimension T2 equals the dimension K plus the thickness of the sealing tape. In the table above, the T2 dimension is equal to the maximum possible K dimension value (assuming that the thickness of the sealing tape does not exceed the tolerance for the dimension K). 55 [ 4 ] Embossed Tape Specifications for Flat-Package Bipolar ICs 3. Sealing Tape Dimensions 4. The thickness of the sealing tape is determined in accordance with the shape of the IC package. Reel Shape and Dimensions R1.0 21 ± 0.8 T 300 ± 2 13 ± 0.5 2 ± 0.5 80 ± 2 2.5 W t = 3.0 max T Embossed taping reel Note 2: Reel dimensions may vary from device to device. For details for a specific device, please consult a toshiba sales office. The dimension W varies according to the tape shape as follows: Tape Shape W Reel Type TE12 TE16 16.4 + 2.0 -0 R33 TE24 5. 12.4 + 2.0 -0 24.4 + 2.0 -0 R53 IC Orientation 5-1) SOP type (standard orientation) Pin 1 Pin 1 Tape feed direction Tape feed direction Type L (EL) Type R (ER) IC orientations on embossed tape Two orientations, type L and type R, are available. The standard orientation, type L (EL), is recommended. 56 [ 4 ] Embossed Tape Specifications for Flat-Package Bipolar ICs 5-2) QFP and QON types (EL) 1 pin 1 pin Reel end Reel end 1 pin (EB) 1 pin Tape feed end (EF) Tape feed end (ER) Note 3: (EL) and (EF) indicate that pin 1 is closest to the tape feed end of the tape. (ER) and (EB) indicate that pin 1 is closest to the end of the tape which is opposite to the tape feed end of the tape. 6. Minimum Tape Bending Radius The strength of the sealing tape will not change when the tape is bent to a radius of 40 mm or more. Bending to this radius should not cause the taping or the IC to be damaged. Peeling strength of sealing tape 300 mm/minute 165 to 180° The peeling strength of the sealing tape should be 0.1 N to 0.7 N (10 gf to 70 gf) when the tape is pulled at a speed of 300 mm per minute and at an angle of 165° to 180° to the carrier tape. The sealing tape should not be damaged when pulled in this way. 7. Ordering Method When an order is placed for ICs packed in embossed tape, the part no., tape type, orientation and quality must be designated in the following manner: Example: Order for 10,000 TA7291F TA7291F ICs sealed on an embossed tape with type L orientation: TA7291F TA7291F (E L) 10000 Quantity (see Note 4.) Orientation (L or R) Tape type IC type Note 4: The quantity specified should be an exact multiple of 2000 (the number of ICs on each reel). 57 [ 4 ] Embossed Tape Specifications for Flat-Package Bipolar ICs 8. Transportation and Storage When transporting tapes, be careful not to subject them to excessive vibration. When transporting or storing tapes, store them at an ambient temperature of no more than 45°C and in a place where they will not be exposed to direct sunlight. This will prevent changes to the peeling strength over time and deformation of the sealing tape. 58