NEW DATABASE - 350 MILLION DATASHEETS FROM 8500 MANUFACTURERS
NEW DATABASE - 350 MILLION DATASHEETS FROM 8500 MANUFACTURERS
| Catalog Datasheet Results | Type | Document Tags |
| Abstract: solder heat .Per EIA-364-56, Procedure 3, Test Cond. B Solderability , solder heat .Per EIA-364-56, Procedure 4 & 5, Level 3 Solderability , EIA-364-56, Procedure 4 & 5, Level 3 Solderability .Per EIA RS�6� Seal ... | Original |
3 pages, |
EIA364-56 EIA-364-56 UL94V-0 UL94V-0 abstract |
|
|||
| Abstract: Resistance .FSMSM IR Soldering EIA-364-56, Procedure 5 Level 1, 215° C FSMJM IR Soldering per ... | Original |
1 pages, |
FSMJ EIA364-56 EIA-364-56 datasheet abstract |
|
|||
| Abstract: Resistance .IR Soldering EIA-364-56 Procedure 5 Level 3, 260° C 6 x 6 mm FSMJSMA ... | Original |
1 pages, |
EIA-364-56 FSMJSMA datasheet abstract |
|
|||
| Abstract: Heat Resistance .IR Soldering EIA-364-56 Procedure 5 Level 2, 464癋 (240癈) .028 (0.71 , EIA-364-56, Procedure 4 & 5, Level 3 Solderability .Per EIA RS�6� Seal , solder heat .Per EIA-364-56, Procedure 4 & 5, Level 3 Solderability , heat .Per EIA-364-56, Procedure 3, Test Cond. B Solderability , heat .Per EIA-364-56, Procedure 3, Test Cond. B Solderability ... | Original |
11 pages, |
FSM104 FSM103 FSM102 FSM101 1571217-2 1571217-1 EIA-364-56 datasheet abstract |
|
|||
| Abstract: to +176°F (-40°C to + 80°C) Solder Heat Resistance . FSMSM IR Soldering EIA-364-56 ... | Original |
1 pages, |
FSMJ EIA-364-56 datasheet abstract |
|
|||
| Abstract: Temperature.-22°F to +185°F (-30°C to +85°C) Solder Heat Resistance .IR Soldering EIA-364-56 Procedure 5 ... | Original |
1 pages, |
FSM4JSMATR 4-1437565-2 alcoswitch 4-1437565-1 FSMJSMA 5-1437565-0 datasheet abstract |
|
|||
| Abstract: with EIA-364-56 Procedure 1. Connectors with printed circuit board terminations shall withstand immersion in a solder bath for 9-11 seconds at 260° C. when tested in accordance with EIA-364-56 Procedure ... | Original |
4 pages, |
A-A-59551 C9-4215 eia 364-35 EIA-364-28 EIA-364-37 GLENAIR mwd Glenair MWDM M83513 Hysol C9-4215 EIA-364-29 EIA-364-26 EIA-364-06 vectra EIA-364-35 MIL-DTL-83513F EIA-364 MIL-DTL-83513F abstract |
|
|||
| Abstract: Resistance .FSMSM IR Soldering EIA-364-56, Procedure 5 Level 1, 215° C FSMJM IR Soldering per , Soldering EIA-364-56 Procedure 5 Level 3, 500°F (260°C) 6 x 6 mm .142 (3.60) .138 (3.5) DIA. E , ) Resistance to solder heat .Per EIA-364-56A, Procedure 4 & 5, Level 3 Solderability , to solder heat .Per EIA-364-56A, Procedure 4 & 5, Level 3 Solderability , to solder heat .Per EIA-364-56A, Procedure 4 & 5, Level 3 Solderability ... | Original |
30 pages, |
1-1437565-3 1j e7 4 pin tactile push button switch 8-1437565-1 FSM101 FSM102 FSM103 FSM104 FSM10JA FSM16JA FSMJSMA FSMJ 4-1437565-0 FSM6JRT 4-1437565-8 datasheet abstract |
|
|||
| Abstract: to +185°F (-40°C to +85°C) Solder Heat Resistance .FSMSM IR Soldering EIA-364-56 , Soldering EIA-364-56 Procedure 5 Level 3, 500°F (260°C) 6 x 6 mm .142 (3.60) .138 (3.5) DIA. E , ) Resistance to solder heat .Per EIA-364-56A, Procedure 4 & 5, Level 3 Solderability , to solder heat .Per EIA-364-56A, Procedure 4 & 5, Level 3 Solderability , to solder heat .Per EIA-364-56A, Procedure 4 & 5, Level 3 Solderability ... | Original |
30 pages, |
tactile push button switch pin 1571386-7 4 pin tactile push button switch EIA-364-52 FSM101 FSM102 FSM103 FSM104 160 e7 FSM6JART 147873-1 datasheet abstract |
|
|||
| Abstract: waterproof sealing requirements. EIA-364-56 IEC-60512-12-5 IEC-60512-12-5 Test 12e 360° C, 5 seconds (solder cups ... | Original |
3 pages, |
EIA-364-20 EIA-364-06 MIL-STD-810F shock IEC-60512-2 IEC-60512-11-9 IEC-60512-12-1 IEC, cyclic moisture resistance test IEC-60512-12-2 IEC-60512-4-1 IEC-60512-11-12 IEC-60512-3-1 IEC-60512-9 EIA-364-26 datasheet abstract |
|
|||
| Abstract: MRD Series Rotary DIP Switches, Low Profile, Process Sealed, 7MM, Through Hole and Surface Mount · 40% PCB area space savings over standard rotary dips A ENVIRONMENTAL SPECIFICATIONS: Operating Temperature.-10°C to +85°C Storage Temperature.-45°C to +100°C Solder Heat Resistance .MIL-STD 202F, Method 210 IR Process Capability .EIA-364-56 Level II (250°C peak) · 50% Lower in profile than standard rotary dips · Hexadecimal or binary code ... | Original |
2 pages, |
rotary dip switches PC 729 EIA-364-56 202F datasheet abstract |
|
|||
| Abstract: TERMINALS AVAILABLE ON SPECIAL REQUEST. 3. SOLDER HEAT RESISTANCE: PER EIA-364-56 FOR WAVE SOLDERING: TEST ... | OCR Scan |
2 pages, |
alco adp04 ADP09SB ADP04 ADP02 EIA-364-56 ADP10 adp-10sb ADP10SB datasheet abstract |
|
|||