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DC327A Linear Technology 3.3V Micropower EIA/TIA-562 Transceiver visit Linear Technology - Now Part of Analog Devices
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LTC1385CSW#PBF Linear Technology LTC1385 - 3.3V Low Power EIA/TIA-562 Transceiver; Package: SO; Pins: 18; Temperature Range: 0°C to 70°C visit Linear Technology - Now Part of Analog Devices Buy
LTC1386IS#TRPBF Linear Technology LTC1386 - 3.3V Low Power EIA/TIA562 Transceiver; Package: SO; Pins: 16; Temperature Range: -40°C to 85°C visit Linear Technology - Now Part of Analog Devices Buy

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EIA-364-1000

Catalog Datasheet MFG & Type PDF Document Tags

EIA-540-BOAE

Abstract: EIA364-1000 requirements from EIA-364-1000, EIA-540BOAE and industry requirement input to best represent the socket , ](V.1).DOC PRODUCT SPECIFICATION 3.2 INDUSTRY DOCUMENTS EIA-364-1000 EIA-540-BOAE Electrical
Molex
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EIA364-1000 Land Grid Array EIA chip tray PS-74988-001 EIA-364-65 EIA364-91

EIA-364-37

Abstract: EIA-364-1000 Reliability Test Sequences (per EIA-364-1000 Test Groups 1,2,and 3): Sample Preparation Test Group 1
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UCP2005-0918 EIA-364-37 EIA-364-28, VII EIA-364-1000 TEST GROUP 3 edge connector power mate EIA-364-29 E29179 TS-45719-001 PS-45719-001

EIA364-1000

Abstract: EIA-364-1000 requirements Note: The preconditioning cycles for the Environmental testing will be 50 cycles per EIA-364-1000
Molex
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ES-40000-7001 UCP-2003-0681 PS-74854-001 PS74854 MIL-C-45662

SD-45984-XXX

Abstract: EIA-364-1000 stubbing or damage · Two isolated power contacts per housing bay (top and bottom) · Tested per EIA-364-1000.01
Molex
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SD-45984-XXX LR19980 USA/KC/2009

EIA-364-70

Abstract: EIA-364-37 Mating Sequence 8.0 TEST SEQUENCE PER EIA-364-1000.01 REVISION: D1 ECR/ECN INFORMATION , . 20 for detail test sequence of EIA364-1000.01, Group I. 4.4 DURABILITY 200 cycles* * - Based on EIA-364-1000.01 Test Method C Sect. 7 5.0 QUALIFICATION Laboratory condition and sample selection are in accordance with EIA-364-1000.01. See pg. 20 for detail test sequence of EIA-364-1000.01 , 6.3 ENVIRONMENTAL PERFORMANCE* ITEM TEST CONDITION REQUIREMENT VIBRATION (EIA-364-1000.01
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UCP2011-1141 PS-46436-100 EIA-364-70 JEDEC J-STD-020d.1 TS-46436-100 Molex UL-1977 EIA-364-10 46437-XXXX PS75431 UCP20

EIA-364-09

Abstract: EIA-364-65 ENVIRONMENTAL TEST 7.0 NOTE 4. APPLICATION DOCUMENTS 4.1 Standards and Specifications 4.1.1 EIA-364-1000.01 , IIA; EIA-364-1000.01, 7 days, for 2 piece connectors, option 2 No evidence of physical damage
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EIA-364-09 EIA-364-21 EIA-364-28 EIA-364-31 EIA-364-32 GS-12-301 E-3005 V20603 GS-01-001 T04-0426

EIA364-1000

Abstract: ExpressCard APPROVALS AND CERTIFICATIONS Per EIA-364-1000.001 with the test groups derived from the following
FCI
Original
10038774-22ALF 10053827-00ALF 10030584-1112LF ExpressCard expresscard 54 GS-14-924 GS-14-925 10056265-122ABTLF 10047129-118ABTLF 10047130-18ALF

plastic raw material

Abstract: GS-12-259 /socket test procedures include environmental classification. EIA-364-1000.01, Environmental test
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GS-12-259 BUS-03-601 plastic raw material DG04 GS12-2 DG0400 GES-01-001 T04-0176 T04-0280 DG04-0063

SMES-152

Abstract: HCS connector performed in accordance with EIA-364-1000.01 Test Group 1 (10) Tin; (10) Gold Test Group 2 (10) Tin
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UCP2009-0064 PS-45750-001 SMES-152 HCS connector 24 pin 2 row female pcb header connector header hrs EIA-364-20

ExpressCard

Abstract: ExpressCard-34 CERTIFICATIONS Per EIA-364-1000.001 with the test groups derived from the following requirements: Durability
FCI
Original
GS-14-926 10030573-200LF ExpressCard-34 EIA-364 EC100028 GS-14-927 GS-12-285 GS-12-292 10030570-2113LF

GS-12-584

Abstract: least 5 minutes. Perform 10 such cycles. Per EIA364-1000.01 STATUS:Released Printed: Mar 12, 2012
FCI
Original
GS-12-584 E-3334 GS-14-858 GS-14-974 DG08-0268 T09-1040

pdm 5001

Abstract: EIA-364-638 DOCUMENTS 4.1 Standards and Specifications 4.1.1 EIA-364-1000.01, Electrical / Socket Test Procedures
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pdm 5001 EIA-364-638 FCI Electronics fci connector 64 pins EIA364-09 t0404 UL94V-0

PCI express PCB footprint

Abstract: PCI Express edge card connector footprint PERFORMANCE EIA-364-1000.01.The test groups/sequences and durations are derived from the following
FCI
Original
GS-12-233 PCI express PCB footprint PCI Express edge card connector footprint PCI Express Straddle-Mount Card Edge Connector 10061913 PCI x16 footprint fingers GS-12-319 GS-12-288 GS-12-390 CDC-PCIEXCE-04/07-E

UL 1569

Abstract: 22 GA TIN COPPER WIRE Damage 6.0 TEST SEQUENCES Testing sequences to be performed in accordance with EIA-364-1000.01 IP67
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UCP2009-2061 UL 1569 22 GA TIN COPPER WIRE mini-fit Water Meter Molex IP67 USCAR-21 pull test PS-46064-001

EIA364-1000

Abstract: SD-75555-XXXX power contacts per housing bay (top and bottom) n Tested per EIA-364-1000.01 n Last-mate/first-break
Molex
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SD-75555-XXXX 876-3300 876-3100 USA/2K/KC/KC/2009

PCI express PCB footprint

Abstract: PCI Express edge card connector footprint minimum). Humidity Appearance: No Damage not controlled. Perform 10 such cycles. Per EIA-364-1000.01
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EIA-364-27 EIA-364-13 S2008-0711 PS-78028-001

EIA-364-23

Abstract: EIA-364-9 . EIA-364-1000.01, Test Group 4, Option 2. Subject specimens to the following: 1) LLCR per EIA
Tyco Electronics
Original
EIA-364-23 EIA-364-9 EIA36423 EIA-364-23 connector EIA-364-17 36423 EIA/TIA-568-B

EIA-364-53

Abstract: DDR 240 connector Mate connectors; expose to: 120 hours at 105 ± 3°C Per EIA-364-1000.01 Contact Resistance: R 20 m
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Original
EIA-364-53 DDR 240 connector S2008-0218 PS-87966-001

edge CONNECTORS

Abstract: 100426 Locks: Copper alloy Board Locks Finish: Tin over nickel or tin-lead over nickel ENVIRONMENTAL EIA-364-1000.01.The
FCI
Original
edge CONNECTORS 100426 Straddle-Mount CDC-PCIEXCE-08/06-E

SD-92903-001

Abstract: EIA-364-28 -364-101: EIA-364-103: EIA-364-107: EIA-364-108: EIA-3641000.01: 4.0 English Thermal Shock Test , step. Note 2 (Test Group 4): ì Option #2 per EIA-364-1000.01 Test Group 4: (a) expose all plugs and
Molex
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SD-92903-001 7 band equalizer 3 band Equalizer EIA-364-52 TBD CABLE EIA-364-101 E2003-0989 PS-91525-001 ES-40000-3996 95/MAR/10 U5-0926 DCBRD03
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