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SN74ALVC7804-25DL
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Texas Instruments
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512 x 18 3.3-V asynchronous FIFO memory 56-SSOP |
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77317-804-26LF
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Amphenol Communications Solutions
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BergStik®, Board to Board connector, Unshrouded Right angle Header, Through Hole, Double Row, 26 Positions ,2.54mm (0.100in) Pitch, |
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77317-804-20LF
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Amphenol Communications Solutions
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BergStik®, Board to Board connector, Unshrouded Right angle Header, Through Hole, Double Row, 20 Positions ,2.54mm (0.100in) Pitch, |
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77317-804-22LF
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Amphenol Communications Solutions
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BergStik®, Board to Board connector, Unshrouded Right angle Header, Through Hole, Double Row, 22 Positions ,2.54mm (0.100in) Pitch, |
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77317-804-28LF
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Amphenol Communications Solutions
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BergStik®, Board to Board connector, Unshrouded Right angle Header, Through Hole, Double Row, 28 Positions ,2.54mm (0.100in) Pitch, |
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77317-804-24LF
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Amphenol Communications Solutions
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BergStik®, Board to Board connector, Unshrouded Right angle Header, Through Hole, Double Row, 24 Positions ,2.54mm (0.100in) Pitch, |
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