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EB capacitor

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Abstract: : "M" suffix 2 Terminal SMT EB series Aluminum Electrolytic Capacitor The "M" suffix 2 terminal SMT EB series aluminum electrolytic capacitor is the recommended replacement for the "N" suffix 4 terminal SMT EB series aluminum electrolytic capacitor The "M" suffix 2 terminal capacitor is not an exact , Type:Surface Mount Type Aluminum Electrolytic Capacitor Series:Large Can size EB series Change to , Aluminum Electrolytic Capacitor. Replaced by "M" suffix 2 terminal Effective per below. BULLETIN # ... Original
datasheet

2 pages,
141.08 Kb

capacitor EEVEB2D101M EB SERIES "Aluminum Electrolytic Capacitor" datasheet abstract
datasheet frame
Abstract: capacitor that incorporates a unique and flexible termination system. Integrated with KEMET's standard , DE DE DE DG DG EB EB EB EB EB EB EB EB EB EB EB EB EB EB EB EB EB EB EB EB EB EB EB EB EB EC EC EC EC EB EB EB EC ED EE EF EE ED EF EF EG EN ED EL EM EH EH EH EH EB EB EB EB EB EB EB EB EB EB EB EB EB EB EB EB EB EB EB EB EB EB EB EB EB EC EC EC EC EB EB EB EC ED EE EF EE ED EF EF EG EN ED EL EM EH ... Original
datasheet

3 pages,
107.28 Kb

F3102 C1210 C1206 C0805 472 EM datasheet abstract
datasheet frame
Abstract: Outline Drawing W L T B S The "Flexible Termination (FT-CAP)" capacitor is a surface mount multi-layer ceramic capacitor that incorporates a unique, flexible termination system that is integrated with , ) 0.60 (.024) ± 0.35 (.014) N/A See "Capacitance Range" tables next page for capacitor chip thickness code specification. Capacitor chip thickness dimensions are detailed in the "Thickness Code , CB CB CB CB DC DC DC DC DC DC DC EB EB EB EB EB EB ... Original
datasheet

4 pages,
102.15 Kb

KEMET C0603 C0805 C1206 C1210 C1808 C1812 C1825 C2220 capacitor code GC EM FB F3102 fd 223 106 DG F3281 JC EB datasheet abstract
datasheet frame
Abstract: / Flexible Terminations W T The "Flexible Termination (FT-CAP)" capacitor is a surface mount multi-layer ceramic capacitor that incorporates a unique, flexible termination system that is integrated with , tables next page for capacitor chip thickness code specification. Capacitor chip thickness dimensions are , 200V 6.3V 10V 16V 25V 50V 100V 200V C0805 C0805 C1206 C1206 C1210 C1210 CD DG EB EB EB EB EB EB EB EB EB EB EB EB EB EB EB EB EB EB EB EB EB EB EB EB EB EC EC EC EC EB EB EB EC ED EE EF EF ED EF EF EG EN ED EF EF ... Original
datasheet

4 pages,
102.01 Kb

datasheet abstract
datasheet frame
Abstract: to the capacitor, shifting flex stress away from the ceramic body and into the termination area. , "Capacitance Range" tables next page for capacitor chip thickness code specification. Capacitor chip thickness , Product Availability and Chip Thickness Codes - See Page 78 for Chip Thickness Dimensions EB EB EB EB EB EB EB EB EB EB EB EB EB EB EB EB EB EB EB EB EB EB EB EB EB EC EB EB EB EB EB EB EB EB EB EB EB EB EB EB EB EB EB EB EB EB EB EB EB EB EB EC EB ... Original
datasheet

4 pages,
131.16 Kb

marking code gb F3102 eb 102 datasheet abstract
datasheet frame
Abstract: capacitor is used to block -48 to -52 Volt DC of line voltage and pass a 16-25 Hz AC signal pulse of 70 , ) N/A Note: For thickness dimensions, see Table 2. F-9033C F-9033C 03/07 Capacitor Ordering , DC DC DC DC DC DC DC DC DC DC DC DC DC DC DC DC DC DC DC DC DC 1206 EB EB EB EB EB EB EB EB EB EB EB EB EB EB EB EB EB EB EB EB ED ED ED ED EM 1210 , Thickness Code (mm) & Reeling Quantities Thickness Code Series DC EB ED EM FB FC FF FG FH ... Original
datasheet

3 pages,
94.77 Kb

marking GG marking CODE GG ke marking transistor F3102 F-9033C datasheet abstract
datasheet frame
Abstract: capacitor is used to block -48 to -52 Volt DC of line voltage and pass a 16-25 Hz AC signal pulse of 70 , ) N/A Note: For thickness dimensions, see Table 2. F-9033D F-9033D 11/07 Capacitor Ordering , EB EB EB EB EB EB EB EB EB EB EB EB EB EB EB EB EB EB EB EB ED ED ED ED EM , Reeling Quantities Thickness Code Series DC EB ED EM FB FC FF FG FH GB GE GF GG GJ ... Original
datasheet

3 pages,
95.64 Kb

MLCC 0805 X7R high capacitance 1812 footprint dimension EIA 2220 F3102 ke marking transistor marking code capacitors marking code gb marking GG 1812 footprint markING CODE KE marking CODE GG datasheet abstract
datasheet frame
Abstract: packaging (0402, 0603, 0805 only) per IEC60286-6 IEC60286-6 and EIAJ 7201. CAPACITOR OUTLINE DRAWINGS W T S , Reflow Solder Reflow CAPACITOR ORDERING INFORMATION (Standard Chips - For C 0805 C 103 K 5 R A C , DC DC DC DC DD DD DD DD 100V 200V 10V DC DC DC DC DC DC EB DC DC EB DC DC EB DC DC EB DC DC EB DC DC EB DC DC EB DC DC EB DC DC EB DC DC EB DC DC EB DC DC EB DC DC EB DC DC EB DC DC EB DC DC EB DC DC EB DC DC EB DC DC EB DC DC EB DC DC EB DC DC EB DC EB DC DC EB DC DC EB DC DC DC EB DC EB DC DC EB DC DC ... Original
datasheet

4 pages,
40.67 Kb

EB 202 D datasheet abstract
datasheet frame
Abstract: Metallization Silver Epoxy The FT-CAP is a surface mount multi-layer ceramic capacitor that incorporates a , DC DC DC DC DC DC DC DC DC DC DC DC DC DC DC DC DC DC DE DE DE DG DG EB EB EB EB EB EB EB EB EB EB EB EB EB EB EB EB EB EB EB EB EB EB EB EB EB EC EC EC EC EB EB EB EC ED EE EF EE ED EF EF EG EN ED EL EM EH EH EH EH EB EB EB EB EB EB EB EB EB EB EB EB EB EB EB EB EB EB EB EB EB EB EB EB EB EC EC EC ... Original
datasheet

4 pages,
109.96 Kb

F3102 diode EB C1210 C1206 C0805 datasheet abstract
datasheet frame
Abstract: diameter by 3 V * inch length computergrade capacitor. Compared to strapping the computergrade to a board , with rubber ring seals. The rubber limits the capacitor life because it permits drying out; electrolyte , years of service in our Type 350 capacitor. Based on accelerated life tests the MLP and MLS can operate , 970 530 390 Ripple Amps 85АC Case Temp Case 120 Hz 20 kHz Code 4.2 4.5 : EK 9.1 9.8 EB 4.2 4.5 EK EB 9.0 9.6 4.1 4.4 EK EB 9.0 9.6 4.4 EK 4.0 8.7 9.6 EB 3.9 4.4 . EK EB 8.6 9.6 4.4 . : 3:4 v:;'. EK 8.4 ... OCR Scan
datasheet

5 pages,
570.43 Kb

datasheet abstract
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market demand. Product name Chip-type aluminum electrolytic capacitor Series name FC series (low-voltage 6.3V ~100V) EB series (medium-high voltage 160V~ 450V and increased capacitance value range. And Matsushita has also newly released the EB series of
www.datasheetarchive.com/files/panasonic/html/maco/topics/99034e.html
Panasonic 06/04/2000 3.19 Kb HTML 99034e.html
(Fig. 2) decreases treble by shunting the 47k feedback resistor with a .002µF capacitor, decreasing Zfb capacitor, decreasing Z1 at high frequencies. When set for flat, the highly nonlinear PAS-3 treble control modification. The PAS bass control decreases bass with a .0075µF capacitor in series with the load, increasing Z2 at low frequencies. It increases bass with a second .0075µF capacitor in series with the feedback properties is in order. Amplification factor (mu or µ) is the change in plate voltage Eb per change of grid
www.datasheetarchive.com/files/spicemodels/misc/spice_model_cd/mixed part list/tubes/spice/norman%20koren/pas94.txt
Spice Models 29/07/2012 27.35 Kb TXT pas94.txt
Operating Ambient Temperature Range (for AC and EC SERIES ) (for AB SERIES ) (for EB SERIES Symbol Name and Function 1 SWC Switch Collector 2 SWE Switch Emitter 3 TC Timing Capacitor 4 GND C (AB and EB series). 3) If Darlington configuration is not used, care must be taken to avoid deep Saturation Voltage vs Emitter Current Output Switch ON-OFF Time vs Oscillator Timing Capacitor capacitor value will and t o be increased due to its equivalent series resistance and board layout. The
www.datasheetarchive.com/files/stmicroelectronics/stonline/books/ascii/docs/5257-v3.htm
STMicroelectronics 23/01/2001 12.92 Kb HTM 5257-v3.htm
ceramic capacitor be used on every device between V CC and V SS . This should be a high frequency capacitor of low inherent inductance and should be placed as close to the device as possible. In addition, a 4.7 m F bulk electrolytic capacitor should be used between V CC and V SS for every eight devices. The bulk capacitor should be located near the power supply connection point. The purpose of the bulk capacitor is to overcome the voltage drop caused by the inductive effects of PCB traces. Mode E G P A9 V PP
www.datasheetarchive.com/files/stmicroelectronics/stonline/books/ascii/docs/2388-v2.htm
STMicroelectronics 14/06/1999 18.17 Kb HTM 2388-v2.htm
No abstract text available
www.datasheetarchive.com/download/93419158-509707ZC/m5rev7.ppt
National 25/03/1998 299 Kb PPT m5rev7.ppt
and by properly selected decoupling ca - pacitors. It is recommended that a 0.1 m F ceramic capacitor be used on every device between V CC and V SS . This should be a high frequency capacitor of low electrolytic capacitor should be used between Vcc and V SS for every eight devices. The bulk capacitor should be located near the power supply connection point. The purpose of the bulk capacitor is to overcome 1 C a eA D2 j eB A2 Symb mm inches Typ Min Max Typ Min Max A 5.72 0.225 A1 0.51 1.40 0.020 0.055 A2
www.datasheetarchive.com/files/stmicroelectronics/stonline/books/ascii/docs/2381-v2.htm
STMicroelectronics 14/06/1999 21.35 Kb HTM 2381-v2.htm
It is recommended that a 0.1 m F ceramic capacitor be used on every device between V CC and V SS . This should be a high frequency capacitor of low inherent inductance and should be placed as close to the device as possible. In addition, a 4.7 m F bulk electrolytic capacitor should be used between V CC and V SS for every eight devices. The bulk capacitor should be located near the power supplyconnection point.The purpose of the bulk capacitor is to overcome the voltage drop caused by the inductive
www.datasheetarchive.com/files/stmicroelectronics/stonline/books/ascii/docs/2387-v1.htm
STMicroelectronics 02/04/1999 22.26 Kb HTM 2387-v1.htm
and by properly selected decoupling ca - pacitors. It is recommended that a 0.1 m F ceramic capacitor be used on every device between V CC and V SS . This should be a high frequency capacitor of low electrolytic capacitor should be used between Vcc and V SS for every eight devices. The bulk capacitor should be located near the power supply connection point. The purpose of the bulk capacitor is to overcome 1 C a eA D2 j eB A2 Symb mm inches Typ Min Max Typ Min Max A 5.72 0.225 A1 0.51 1.40 0.020 0.055 A2
www.datasheetarchive.com/files/stmicroelectronics/stonline/books/ascii/docs/2381-v1.htm
STMicroelectronics 02/04/1999 21.39 Kb HTM 2381-v1.htm
ceramic capacitor be used on every device between V CC and V SS . This should be a high frequency capacitor of low inherent inductance and should be placed as close to the device as possible. In addition, a 4.7 m F bulk electrolytic capacitor should be used between V CC and V SS for every eight devices. The bulk capacitor should be located near the power supply connection point. The purpose of the bulk capacitor is to overcome the voltage drop caused by the inductive effects of PCB traces. 4/16 M27C1001 M27C1001 M27C1001 M27C1001
www.datasheetarchive.com/files/stmicroelectronics/stonline/books/ascii/docs/2380-v2.htm
STMicroelectronics 14/06/1999 21.67 Kb HTM 2380-v2.htm
recommended that a 0.1 m F ceramic capacitor be used on every device between V CC and V SS . This should be a high frequency capacitor of low inherent inductance and should be placed as close to the device as possible. In addition, a 4.7 m F bulk electrolytic capacitor should be used between V CC and V SS for every eight devices. The bulk capacitor should be located near the power supply connection point.The purpose of the bulk capacitor is to overcome the voltage drop caused by the inductive effects of PCB traces.
www.datasheetarchive.com/files/stmicroelectronics/stonline/books/ascii/docs/4377-v1.htm
STMicroelectronics 02/04/1999 21.77 Kb HTM 4377-v1.htm