2002/95/EC DSA3001 DSC3001 ZJC00435BED

DSA3001 Silicon PNP epitaxial planar type For general amplification Complementary to DSC3001 Features Package High forward

This product complies with the RoHS Directive (EU 2002/95/EC 2002/95/EC). DSA3001 DSA3001 Silicon PNP epitaxial planar type For general amplification Complementary to DSC3001 DSC3001 Features Package High forward current transfer ratio hFE with excellent linearity Eco-friendly Halogen-free package Code SSSMini3-F2-B Name Pin 1. Base 2. Emitter 3. Collector Packaging Embossed type (Thermo-compression sealing): 10000 pcs / reel (standard) Absolute Maximum Ratings Ta = 25°C Parameter Symbol Rating Unit Collector-base voltage (Emitter open) VCBO 60 V Collector-emitter voltage (Base open) VCEO 50 V Emitter-base voltage (Collector open) VEBO 7 V Collector current IC 100 mA Peak collector current ICP 200 mA Collector power dissipation PC 100 mW Junction temperature Tj 150 °C Storage temperature Tstg 55 to +150 Marking Symbol: A1 °C Electrical Characteristics Ta = 25°C±3°C Parameter Symbol Conditions Min Typ Max Unit Collector-base voltage (Emitter open) VCBO IC = 10 mA, IE = 0 60 V Collector-emitter voltage (Base open) VCEO IC = 2 mA, IB = 0 50 V Emitter-base voltage (Collector open) VEBO IE = 10 mA, IC = 0 7 V Collector-base cutoff current (Emitter open) ICBO VCB = 20 V, IE = 0 0.1 mA Collector-emitter cutoff current (Base open) ICEO VCE = 10 V, IB = 0 100 mA Forward current transfer ratio hFE VCE = 10 V, IC = 2 mA 460 0.5 V Collector-emitter saturation voltage Transition frequency Collector output capacitance (Common base, input open circuited) Note) VCE(sat) fT Cob 210 IC = 100 mA, IB = 10 mA 0.2 VCE = 10 V, IC = 2 mA 150 MHz 2 pF VCB = 10 V, IE = 0, f = 1 MHz Measuring methods are based on JAPANESE INDUSTRIAL STANDARD JIS C 7030 measuring methods for transistors. Publication date: November 2009 ZJC00435BED ZJC00435BED 1 This product complies with the RoHS Directive (EU 2002/95/EC 2002/95/EC). DSA3001 DSA3001 DSA3001 DSA3001_IC-VCE DSA3001 DSA3001_PC-Ta PC Ta IB = -600 µA 100 75 50 25 -500 µA -80 -400 µA -60 -300 µA -40 -200 µA -20 40 80 120 160 0 200 0 -2 -4 -1 Ta = 85°C -30°C VCE = -10 V -30°C -60 -40 -100 -1 -10 -100 Collector current IC (mA) IE = 0 f = 1 MHz Ta = 25°C 3.0 1.0 0 0 - 0.2 - 0.4 - 0.6 - 0.8 -1.0 -1.2 Base-emitter voltage VBE (V) fT IC VCE = -10 V Ta = 25°C 150 100 50 -10 0 - 0.1 2.0 250 -1 100 4.0 25°C Ta = 85°C -80 DSA3001 DSA3001_fT-IC 0 - 0.1 -30°C Cob VCB -20 Collector current IC (mA) 200 200 DSA3001 DSA3001_Cob-VCB 25°C -10 25°C -12 -120 Collector current IC (mA) Collector-emitter saturation voltage VCE(sat) (V) IC / IB = 10 -1 300 IC VBE -100 - 0.01 - 0.1 Transition frequency fT (MHz) -10 Ta = 85°C DSA3001 DSA3001_IC-VBE VCE(sat) IC - 0.1 -8 400 Collector-emitter voltage VCE (V) DSA3001 DSA3001_VCEsat-IC -10 -6 500 Collector output capacitance (Common base, input open circuited) Cob (pF) 0 -100 µA VCE = -10 V Forward current transfer ratio hFE Ta = 25°C Collector current IC (mA) Collector power dissipation PC (mW) 600 -100 Ambient temperature Ta (°C) -100 Collector current IC (mA) 2 hFE IC -120 125 0 DSA3001 DSA3001_hFE-IC IC VCE ZJC00435BED ZJC00435BED 0 -1 -10 -100 Collector-base voltage VCB (V) This product complies with the RoHS Directive (EU 2002/95/EC 2002/95/EC). DSA3001 DSA3001 SSSMini3-F2-B Unit: mm 0.20 ±0.05 1.20 ±0.05 +0.05 0.30 -0.02 (5°) 1.20 ±0.05 0.80 ±0.05 3 2 1 +0.05 0.20 -0.02 (0.4) +0.05 0.13 -0.02 (0.4) (0.27) 0.80 ±0.05 0 to 0.05 0.52 ±0.03 (5°) ZJC00435BED ZJC00435BED 3 Request for your special attention and precautions in using the technical information and semiconductors described in this book (1) If any of the products or technical information described in this book is to be exported or provided to non-residents, the laws and regulations of the exporting country, especially, those with regard to security export control, must be observed. (2) The technical information described in this book is intended only to show the main characteristics and application circuit examples of the products. No license is granted in and to any intellectual property right or other right owned by Panasonic Corporation or any other company. Therefore, no responsibility is assumed by our company as to the infringement upon any such right owned by any other company which may arise as a result of the use of technical information described in this book. (3) The products described in this book are intended to be used for standard applications or general electronic equipment (such as office equipment, communications equipment, measuring instruments and household appliances). Consult our sales staff in advance for information on the following applications: Special applications (such as for airplanes, aerospace, automobiles, traffic control equipment, combustion equipment, life support systems and safety devices) in which exceptional quality and reliability are required, or if the failure or malfunction of the products may directly jeopardize life or harm the human body. Any applications other than the standard applications intended. (4) The products and product specifications described in this book are subject to change without notice for modification and/or improvement. At the final stage of your design, purchasing, or use of the products, therefore, ask for the most up-to-date Product Standards in advance to make sure that the latest specifications satisfy your requirements. (5) When designing your equipment, comply with the range of absolute maximum rating and the guaranteed operating conditions (operating power supply voltage and operating environment etc.). Especially, please be careful not to exceed the range of absolute maximum rating on the transient state, such as power-on, power-off and mode-switching. Otherwise, we will not be liable for any defect which may arise later in your equipment. Even when the products are used within the guaranteed values, take into the consideration of incidence of break down and failure mode, possible to occur to semiconductor products. Measures on the systems such as redundant design, arresting the spread of fire or preventing glitch are recommended in order to prevent physical injury, fire, social damages, for example, by using the products. (6) Comply with the instructions for use in order to prevent breakdown and characteristics change due to external factors (ESD, EOS, thermal stress and mechanical stress) at the time of handling, mounting or at customer's process. When using products for which damp-proof packing is required, satisfy the conditions, such as shelf life and the elapsed time since first opening the packages. (7) This book may be not reprinted or reproduced whether wholly or partially, without the prior written permission of our company. 20080805