2002/95/EC DRA3123E DRC3123E ZJH00430AED - Datasheet Archive

 

DRA3123E Silicon PNP epitaxial planar type For digital circuits Complementary to DRC3123E Features Package Packaging Code

 

This product complies with the RoHS Directive (EU 2002/95/EC 2002/95/EC). DRA3123E DRA3123E Silicon PNP epitaxial planar type For digital circuits Complementary to DRC3123E DRC3123E Features Package Packaging Code SSSMini3-F2-B Name Pin 1: Base 2: Emitter 3: Collector Contributes to miniaturization of sets, reduction of component count. Eco-friendly Halogen-free package Embossed type (Thermo-compression sealing): 10000 pcs / reel (standard) Absolute Maximum Ratings Ta = 25°C Symbol Rating Unit Marking Symbol: L2 Collector-base voltage (Emitter open) VCBO ­50 V Internal Connection Collector-emitter voltage (Base open) VCEO ­50 V Parameter Collector current IC ­100 mA Total power dissipation PT 100 Tj 150 °C Storage temperature Tstg ­55 to +150 °C C R1 mW Junction temperature B R2 Resistance value E R1 R2 2.2 2.2 k k Electrical Characteristics Ta = 25°C±3°C Parameter Symbol Conditions Min Typ Max Unit Collector-base voltage (Emitter open) VCBO IC = ­10 µA, IE = 0 ­50 V Collector-emitter voltage (Base open) VCEO IC = ­2 mA, IB = 0 ­50 V Collector-base cutoff current (Emitter open) ICBO VCB = ­50 V, IE = 0 ­ 0.1 µA Collector-emitter cutoff current (Base open) ICEO VCE = ­50 V, IB = 0 ­ 0.5 µA Emitter-base cutoff current (Collector open) IEBO VEB = ­6 V, IC = 0 ­2.0 mA Forward current transfer ratio hFE VCE = ­10 V, IC = ­5 mA 20 ­ 0.30 V Collector-emitter saturation voltage VCE(sat) IC = ­10 mA, IB = ­ 0.5 mA Input voltage (ON) VI(on) VCE = ­ 0.2 V, IC = ­5 mA Input voltage (OFF) VI(off) 6 VCE = ­5 V, IC = ­100 µA ­1.8 V ­ 0.8 V Input resistance R1 ­30% 2.2 +30% k Resistance ratio R1 / R2 0.8 1.0 1.2 Note) Measuring methods are based on JAPANESE INDUSTRIAL STANDARD JIS C 7030 measuring methods for transistors. Publication date: January 2010 ZJH00430AED ZJH00430AED 1 This product complies with the RoHS Directive (EU 2002/95/EC 2002/95/EC). DRA3123E DRA3123E DRA3123E DRA3123E_IC-VCE DRA3123E DRA3123E_PT-Ta PT Ta DRA3123E DRA3123E_hFE-IC IC VCE 150 hFE IC -120 140 VCE = -10 V -100 100 75 50 25 IB = -800 µA -700 µA -60 -600 µA -40 -500 µA -20 0 40 80 120 160 0 200 -400 µA -300 µA 0 Ambient temperature Ta (°C) -2 -4 -10 25°C -30°C -10 Output current IO (mA) Collector-emitter saturation voltage VCE(sat) (V) 25°C 40 -30°C 20 0 - 0.1 -12 -1 -10 -100 VIN IO -100 VO = -5 V VO = - 0.2 V Ta = 85°C -1 25°C -30°C -10-2 -10-3 -100 DRA3123E DRA3123E_VIN-IO -10-1 Ta = 85°C Collector current IC (mA) 2 Ta = 85°C 60 IO VIN IC / IB = 20 -1 80 DRA3123E DRA3123E_IO-VIN -1 - 0.01 - 0.1 -10 100 Collector current IC (mA) VCE(sat) IC - 0.1 -8 120 Collector-emitter voltage VCE (V) DRA3123E DRA3123E_VCEsat-IC -10 -6 Input voltage VIN (V) 0 -80 Forward current transfer ratio hFE 125 Collector current IC (mA) Total power dissipation PT (mW) Ta = 25°C 0 - 0.5 -1.0 -1.5 Input voltage VIN (V) ZJH00430AED ZJH00430AED -2.0 -10 25°C -1 - 0.1 - 0.1 Ta = -30°C 85°C -1 -10 Output current IO (mA) -100 This product complies with the RoHS Directive (EU 2002/95/EC 2002/95/EC). DRA3123E DRA3123E SSSMini3-F2-B Unit: mm 0.20 ±0.05 1.20 ±0.05 +0.05 0.30 -0.02 (5°) 0.80 ±0.05 1.20 ±0.05 3 2 1 +0.05 0.20 -0.02 (0.4) +0.05 0.13 -0.02 (0.4) (0.27) 0.80 ±0.05 0 to 0.05 0.52 ±0.03 (5°) ZJH00430AED ZJH00430AED 3 Request for your special attention and precautions in using the technical information and semiconductors described in this book (1) If any of the products or technical information described in this book is to be exported or provided to non-residents, the laws and regulations of the exporting country, especially, those with regard to security export control, must be observed. (2) The technical information described in this book is intended only to show the main characteristics and application circuit examples of the products. No license is granted in and to any intellectual property right or other right owned by Panasonic Corporation or any other company. Therefore, no responsibility is assumed by our company as to the infringement upon any such right owned by any other company which may arise as a result of the use of technical information described in this book. (3) The products described in this book are intended to be used for standard applications or general electronic equipment (such as office equipment, communications equipment, measuring instruments and household appliances). Consult our sales staff in advance for information on the following applications: ­ Special applications (such as for airplanes, aerospace, automobiles, traffic control equipment, combustion equipment, life support systems and safety devices) in which exceptional quality and reliability are required, or if the failure or malfunction of the products may directly jeopardize life or harm the human body. ­ Any applications other than the standard applications intended. (4) The products and product specifications described in this book are subject to change without notice for modification and/or improvement. At the final stage of your design, purchasing, or use of the products, therefore, ask for the most up-to-date Product Standards in advance to make sure that the latest specifications satisfy your requirements. (5) When designing your equipment, comply with the range of absolute maximum rating and the guaranteed operating conditions (operating power supply voltage and operating environment etc.). Especially, please be careful not to exceed the range of absolute maximum rating on the transient state, such as power-on, power-off and mode-switching. Otherwise, we will not be liable for any defect which may arise later in your equipment. Even when the products are used within the guaranteed values, take into the consideration of incidence of break down and failure mode, possible to occur to semiconductor products. Measures on the systems such as redundant design, arresting the spread of fire or preventing glitch are recommended in order to prevent physical injury, fire, social damages, for example, by using the products. (6) Comply with the instructions for use in order to prevent breakdown and characteristics change due to external factors (ESD, EOS, thermal stress and mechanical stress) at the time of handling, mounting or at customer's process. When using products for which damp-proof packing is required, satisfy the conditions, such as shelf life and the elapsed time since first opening the packages. (7) This book may be not reprinted or reproduced whether wholly or partially, without the prior written permission of our company. 20080805