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Part : FDM606P Supplier : Fairchild Semiconductor Manufacturer : Rochester Electronics Stock : 9,587 Best Price : $0.80 Price Each : $0.80
Part : AMDM-60 Supplier : Rhombus Industries Manufacturer : Bristol Electronics Stock : 160 Best Price : $1.9412 Price Each : $4.48
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DM6030HK

Catalog Datasheet MFG & Type PDF Document Tags

DM6030HK

Abstract: mmic AMPLIFIER x-band 10w silver loaded epoxy. Two epoxies are recommended for this purpose, Diemat (www.diemat.com) PNs DM6030HK , in attaching these IC assemblies. DM6030HK is recommended for use when the coefficient of thermal
M/A-COM
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MAAP-008509-PED000 MAAP-008509-SMB004 MAAP-008509-MCH000 mmic AMPLIFIER x-band 10w DM4030LD MA08509D

DM6030HK

Abstract: diemat epoxy type DM6030HK or equivalent. Wire Bonding 1) Thermocompression wedge bond 0.7 or 1 mil diameter
Aeroflex / Metelics
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C601A MMA701A diemat MMA601A A17022

diemat

Abstract: MMA60 epoxy type DM6030HK or equivalent. Wire Bonding 1) Thermocompression wedge bond 0.7 or 1 mil diameter
Aeroflex / Metelics
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MMA60
Abstract: may also be mounted with DieMat DM6030HK conductive epoxy or an equivalent high thermal conductivity TriQuint Semiconductor
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TGA4905-CP TGA4905

XP1055-BD

Abstract: tanaka TS3332LD epoxy , recommended epoxies are Tanaka TS3332LD, Die Mat DM6030HK or DM6030HK-Pt cured in a nitrogen atmosphere per
Mimix Broadband
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XP1055-BD tanaka TS3332LD epoxy P1055-BD MIL-STD-883 XP1055-BD-000V XP1055-BD-EV1

diemat

Abstract: DM6030HK TGA4513-CP may also be mounted with DieMat DM6030HK conductive epoxy. 3. The DC and RF interconnects may be
TriQuint Semiconductor
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TGA4513 SN63 ka-band amplifier

XP1071-BD-000V

Abstract: XP1071-BD-EV1 , recommended epoxies are Tanaka TS3332LD, Die Mat DM6030HK or DM6030HK-Pt cured in a nitrogen atmosphere per
Mimix Broadband
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XP1071-BD-000V XP1071-BD-EV1 XP1071 ts333 tanaka au wire tanaka gold wire P1071-BD XP1071-BD
Abstract: DM6030HK conductive epoxy. 3. The DC and RF interconnects may be gold bondwires or gold ribbons. The RF TriQuint Semiconductor
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XP1072-BD

Abstract: XP1072-BD-000V performance requirements. MMIC, 4mil Alumina Substrate Diemat DM6030HK Epoxy, ~1mil AuSn Eutectic , DM6030HK or an epoxy with >52 W/m ºK thermal conductivity cured in a nitrogen atmosphere per manufacturer
Mimix Broadband
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XP1072-BD XP1072-BD-000V ID232 VD55 152.01 P1072-BD XP1072-BD-EV1-P

XP1071-BD-EV1

Abstract: Diemat DM6030HK Epoxy, ~1mil AuSn Eutectic Solder MOLY Rib, 5mil, Au plated MOLY Carrier, 25mil Au , DM6030HK or an epoxy with >52 W/m ºK thermal conductivity cured in a nitrogen atmosphere per manufacturer
Mimix Broadband
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DM6030HK

Abstract: DM4030LD recommended for this purpose, Diemat (www.diemat.com) PNs DM6030HK and DM4030LD with bulk thermal , recommended for use in attaching these IC assemblies. DM6030HK is recommended for use when the coefficient of
M/A-COM
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MAAP-000077-PED000 MAAP-000077-PKG001 MAAP-000077-SMB001 MAAPGM0077-DIE MAAP-000077-SMB004 AN3016 MAAPGM0077-PED000

BD 879

Abstract: CMM0016 availability and end application performance requirements. MMIC, 3mil Alumina Substrate Diemat DM6030HK , using conductive epoxy, recommended epoxy is Die Mat DM6030HK or an epoxy with >52 W/m ºK thermal
Mimix Broadband
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CMM0016-BD CMM0016-BD-000V PB-CMM0016-BD-0000 BD 879 CMM0016
Abstract: for this purpose, Diemat (www.diemat.com) PNs DM6030HK and DM4030LD with bulk thermal conductivities , recommended for use in attaching these IC assemblies. DM6030HK is recommended for use when the coefficient of M/A-COM
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MAAP-000079-PED000 MAAP-000079-PKG001 MAAP-000079-SMB00

transistor d 13009

Abstract: DM6030HK requirements. MMIC, 4mil Alumina Substrate Diemat DM6030HK Epoxy, ~1mil AuSn Eutectic Solder MOLY , using conductive epoxy, recommended epoxy is Die Mat DM6030HK or an epoxy with >52 W/m ºK thermal
Mimix Broadband
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XP1015-BD XP1015-BD-000V XP1015-BD-EV1 XP1015 transistor d 13009 P1015-BD
Abstract: performance requirements. MMIC, 3mil Alumina Substrate Diemat DM6030HK Epoxy, ~1mil AuSn Eutectic , . If using conductive epoxy, recommended epoxy is Die Mat DM6030HK or an epoxy with >52 W/m ºK Mimix Broadband
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P1059-BD XP1059-BD-000V XP1059-BD-EV1 XP1059-BD
Abstract: availability and end application performance requirements. MMIC, 3mil Alumina Substrate Diemat DM6030HK , . If using conductive epoxy, recommended epoxy is Die Mat DM6030HK or an epoxy with >52 W/m ºK Mimix Broadband
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TGA4915-CP

Abstract: 50W-Pout other Tin/Lead solder. The TGA4915-CP may also be mounted with DieMat DM6030HK conductive epoxy or
TriQuint Semiconductor
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50W-Pout IDQ42
Abstract: other Tin/Lead solder. The TGA4513-CP may also be mounted with DieMat DM6030HK conductive epoxy. 3. The TriQuint Semiconductor
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tanaka gold wire

Abstract: tanaka au wire and flat. If using conductive epoxy, recommended epoxies are Tanaka TS3332LD, Die Mat DM6030HK or DM6030HK-Pt cured in a nitrogen atmosphere per manufacturer's cure schedule. Apply epoxy sparingly to avoid
Mimix Broadband
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tanaka TS3332LD P1070-BD XP1070-BD-000V XP1070-BD-EV1 XP1070-BD
Abstract: mounted with DieMat DM6030HK conductive epoxy or similar thermally and electrically conductive epoxy. 3 TriQuint Semiconductor
Original
Abstract: performance requirements. MMIC, 4mil Alumina Substrate Diemat DM6030HK Epoxy, ~1mil AuSn Eutectic , clean and flat. If using conductive epoxy, recommended epoxy is Die Mat DM6030HK or an epoxy with >52 W Mimix Broadband
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Abstract: epoxies are recommended for this purpose, Diemat (www.diemat.com) PNs DM6030HK and DM4030LD with bulk , /m-ºC are not recommended for use in attaching these IC assemblies. DM6030HK is recommended for use when M/A-COM
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MAAP-000076-PED000 MAAPGM0076-PED000 MAAP-000076-PKG001

XP1056-BD

Abstract: XP1056-BD-EV1 performance requirements. MMIC, 4mil Alumina Substrate Diemat DM6030HK Epoxy, ~1mil AuSn Eutectic , using conductive epoxy, recommended epoxy is Die Mat DM6030HK or an epoxy with >52 W/m ºK thermal
Mimix Broadband
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XP1056-BD XP1056-BD-EV1 P1056-BD XP1056-BD-000V
Abstract: silver loaded epoxy. Two epoxies are recommended for this purpose, Diemat (www.diemat.com) PNs DM6030HK , with conductivities < 10 W/m-ºC are not recommended for use in attaching these IC assemblies. DM6030HK M/A-COM
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MAAP-000074-PED000 MAAPGM0074-DIE

DM6030HK

Abstract: XP1072-BD and end application performance requirements. MMIC, 4mil Diemat DM6030HK Epoxy, ~1mil MOLY Rib, 5mil , , recommended epoxy is Die Mat DM6030HK or an epoxy with >52 W/m ºK thermal conductivity cured in a nitrogen
Mimix Broadband
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XP1072-BD-EV1

P1016

Abstract: DM6030HK Diemat DM6030HK Epoxy, ~1mil AuSn Eutectic Solder MOLY Rib, 5mil, Au plated MOLY Carrier, 25mil , clean and flat. If using conductive epoxy, recommended epoxy is Die Mat DM6030HK or an epoxy with >52 W
Mimix Broadband
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XP1016-BD XP1016-BD-000V XP1016-BD-EV1 XP1016 P1016 AuSn eutectic P1016-BD
Abstract: Diemat DM6030HK Epoxy, ~1mil AuSn Eutectic Solder MOLY Rib, 5mil, Au plated MOLY Carrier, 25mil Au , TS3332LD, Die Mat DM6030HK or DM6030HK-Pt cured in a nitrogen atmosphere per manufacturer's cure schedule Mimix Broadband
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DM6030HK

Abstract: , Diemat (www.diemat.com) PNs DM6030HK and DM4030LD with bulk thermal conductivities of 60 and 15 W/m-ºC , these IC assemblies. DM6030HK is recommended for use when the coefficient of thermal expansion (CTE) of
M/A-COM
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DM6030HK

Abstract: AN3016 recommended for this purpose, Diemat (www.diemat.com) PNs DM6030HK and DM4030LD with bulk thermal , recommended for use in attaching these IC assemblies. DM6030HK is recommended for use when the coefficient of
M/A-COM
Original
MAAP-000076-SMB001 MAAP-000076-SMB004 MAAPGM0076-DIE
Abstract: performance requirements. MMIC, 4mil Alumina Substrate Diemat DM6030HK Epoxy, ~1mil AuSn Eutectic , epoxy is Die Mat DM6030HK or an epoxy with >52 W/m ºK thermal conductivity cured in a nitrogen Mimix Broadband
Original

DM6030HK

Abstract: AN3016 DM6030HK and DM4030LD with bulk thermal conductivities of 60 and 15 W/m-ºC, respectively. Silver-filled , . DM6030HK is recommended for use when the coefficient of thermal expansion (CTE) of the material to which
M/A-COM
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MAAP-000074-PKG001 MAAP-000074-SMB001 MAAP-000074-SMB004 MAAPGM00
Abstract: Alumina Substrate Diemat DM6030HK Epoxy, ~1mil AuSn Eutectic Solder MOLY Rib, 5mil, Au plated , . If using conductive epoxy, recommended epoxy is Die Mat DM6030HK or an epoxy with >52 W/m ºK thermal Mimix Broadband
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