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TS3DDR4000ZBAR Texas Instruments 12-Bits 1:2 High Speed DDR2/DDR3/DDR4 Switch/Multiplexer 48-NFBGA -40 to 85 visit Texas Instruments Buy
LM95235DIMM/NOPB Texas Instruments ±2°C Remote and Local Temperature Sensor with TruTherm Technology and SMBus Interface 8-VSSOP -40 to 90 visit Texas Instruments Buy
LM95235DIMM Texas Instruments Precision Remote Diode Temperature Sensor with SMBus Interface and TruTherm? Technology 8-VSSOP -40 to 90 visit Texas Instruments
LM89-1DIMMX/NOPB Texas Instruments ±0.75°C Remote and Local Temperature Sensor with SMBus Interface 8-VSSOP 0 to 125 visit Texas Instruments
LM95235DIMMX/NOPB Texas Instruments ±2°C Remote and Local Temperature Sensor with TruTherm Technology and SMBus Interface 8-VSSOP -40 to 90 visit Texas Instruments
LM89-1DIMM/NOPB Texas Instruments ±0.75°C Remote and Local Temperature Sensor with SMBus Interface 8-VSSOP 0 to 125 visit Texas Instruments Buy

DIMM DDR400 PC3200

Catalog Datasheet MFG & Type PDF Document Tags

M2U25664DS88C3G-6K

Abstract: M2U51264DS8HC3G-5T / M2Y25664DS88C3G 512MB and 256MB PC3200 and PC2700 Unbuffered DDR DIMM 184 pin Unbuffered DDR DIMM Based on DDR400/333 256M bit C Die device Features · 184 Dual In-Line Memory Module (DIMM) · Unbuffered DDR DIMM based on 256M bit die C device, organized as either 32Mx8 or 16Mx16 · Performance: PC3200 PC2700 , / M2Y25664DS88C3G 512MB and 256MB PC3200 and PC2700 Unbuffered DDR DIMM Ordering Information Lead Part Number , Power DDR400 Devices PC3200 3-3-3 200MHz (5ns @ CL = 3) 2.6V DDR333 Devices PC2700
Nanya Technology
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M2U25664DS88C3G-6K M2U51264DS8HC3G-5T M2U25664DS88C3G-5T 256MB 32Mx64 CL2 M2U51264DS8HC1G-6K pc2700 SPD JEDEC M2U51264DS8HC1G M2U51264DS8HC3G M2Y51264DS8HC3G M2U25664DS88C1G M2U25664DS88C3G DDR400/333

512m pc133 SDRAM DIMM

Abstract: TSOP 66 Package . Technology and Trends DDR400 Components and DIMMs (PC3200) As a leading memory products 2 GB DDR2 Unbuffered DIMM supplier, Infineon continues to 4 GB DDR2 Registered DIMM expand its portfolio with , DDR400 TSOP-66 (400 mil) DDR266 DDR333 32 M x 8 2-3-3 DDR266A TSOP-66 (400 mil , Now XX DDR333 2.5-3-3 HYB25D256800CEL- 6 Q67100 Q1753 Now XX DDR400 , 2.5-3-3 DDR400 3-3-3 DDR333 2.5-3-3 DDR400 3-3-3 256 Mb DDR266A 2-3-3 FBGA
Infineon Technologies
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512m pc133 SDRAM DIMM TSOP 66 Package TSOP 54 Package DIMM DDR400 PC3200 1 gb ddr2 ram DDR400 infineon B166-H8399-X-X-7600

M2U25664DSH4B1G

Abstract: M2U1G64DS8HB1G-5T / M2Y25664DSH4B1G (Green) 1GB, 512MB and 256MB PC3200 and PC2700 Unbuffered DDR DIMM 184 pin Unbuffered DDR DIMM Based on DDR400/333 512M bit Die B device Features · 184 Dual In-Line Memory Module (DIMM) · , / M2Y51264DS88B1G / M2Y25664DSH4B1G (Green) 1GB, 512MB and 256MB PC3200 and PC2700 Unbuffered DDR DIMM Input/Output , , 512MB and 256MB PC3200 and PC2700 Unbuffered DDR DIMM Functional Block Diagram 2 Ranks, 16 devices , PC3200 and PC2700 Unbuffered DDR DIMM Functional Block Diagram 1 Rank, 8 devices, 64Mx8 DDR SDRAMs
Nanya Technology
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M2U25664DSH4B1G M2U1G64DS8HB1G-5T M2Y1G64DS8HB1G-5T 7F7F7F0B00000000 SDRAM DEVICE WIDTH Elixir M2U1G64DS8HB1G M2U51264DS88B1G M2Y1G64DS8HB1G 200-P M2U51264DS88B1G-

q1257

Abstract: Q1129 "Green*", more environmentally friendly Components and Modules As a leading memory products DDR400 Components and DIMMs (PC3200) supplier, Infineon continues to 4 GB DDR Registered DIMM expand its , -66 (400mil) 2.5-3-3 DDR400 3-3-3 DDR333 2.5-3-3 DDR400 32Mx8 2-3-3 DDR333 3-3-3 , - 3-3-3 DDR400 TSOP-66 (400mil) DDR400 DDR333 16Mx16 2.5-3-3 HYB25D128400AT- 2-3-3 , HYB25D512800BE- DDR400 5 7 Q67100 Q4411 2.5-3-3 6 Q67100 Q4416 HYB25D512160AT- SDR
Infineon Technologies
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q1257 Q1129 Q4331 TSOP66 DRAM spectrum infineon tsop ddr2 ram 2002791-D-RAM B112-H6731-G10-X-7600

fujitsu siemens D1688

Abstract: siemens phoenix bios Memory 4 DIMM Sockets (2.5 V), 128 MB - 4 GB, 184 Pin Single or Dual Channel, DDR400/333 SDRAM (PC3200 , Password / USB Security Internal Connectors DIMM Sockets (DDR400 SDRAM, PC3200) AGP Pro 50 Slot (2/4/8x , Data Sheet Mainboard D1688 / D1683 Issue March 2004 Mainboard D1688 / D1683 Intel 875P Chipset for DDR400 SDRAM (PC3200) Memory and Intel Pentium 4 Processors (800 MHz FSB) Product picture (ATX-version) similar to product Chipset: Memory: ® Intel 875P DDR400 SDRAM (PC3200) DDR333
Fujitsu Siemens Computers
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fujitsu siemens D1688 siemens phoenix bios Fujitsu Siemens D1683-A Phoenix NuBIOS intel 875p PC3200/2700 DMA/100 RJ-45 IEEE1394 480MB/

pc3200

Abstract: DDR-pc3200 on the circuit board for each DDR400 SDRAM. This PC3200 DIMM is intended for mounting into 184 pin , 256MB DDR PC3200 SYNCHRONOUS DRAM DIMM WITH ECC VI4CU327228DTNL1 General Description The Viking , PC3200 SYNCHRONOUS DRAM DIMM WITH ECC VI4CU327228DTNL1 PIN FUNCTION DESCRIPTION SIGNAL FUNCTION , By: Sandra Lutsch Page 2 of 8 256MB DDR PC3200 SYNCHRONOUS DRAM DIMM WITH ECC VI4CU327228DTNL1 , 256MB DDR PC3200 SYNCHRONOUS DRAM DIMM WITH ECC VI4CU327228DTNL1 FUNCTIONAL BLOCK DIAGRAM CLK1 #CLK1
Viking InterWorks
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DDR-pc3200 459-2884W PS4CU327228DTNL1

DIMM DDR400 PC3200

Abstract: DDR200 memory modules, or DIMM's, to be used in high-performance servers and routers for the networking market , . Memory Technology Trend DRAM Voltage System DIMM Clock Frequency Data Rate SDR , PC133 PC1600 PC2100 PC2700 PC3200 PC3200 PC4300 N/A N/A 100MHz 133MHz 100MHz 133MHz , 4.3 GB/s DDR200 DDR266 DDR333 DDR400 DDR400 DDR533 Note: * = Proposed, but not yet approved , also critical in order to latch the address and command signals. A typical Registered DIMM application
Pericom Semiconductor
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PI74SSTVF16857 PC100/PC133 PC100 100MH 133MH 166MH

DDR400

Abstract: PC3200 Memory Module Data Sheet L3264D47 256MB 32M x 64-bit DDR400 (PC3200) SPECIFICATIONS; · 256MB (32M x 64-bit) Unbuffered DDR400 DIMM · TSOP-II 32M x 8 (8M x 8 bit x 4 Bank/200Mhz) x Eight DRAM · 184-pin Dual in-line memory module with Gold Plated Contacts · Dimm Dimensions 133.35 x 31.75 x 3.18 (mm) · Programmable CAS Latency Supported - CL 3, 2.5, 2 · Row Cycle Time (tRC) - 55ns · Auto Refresh Cycle Time (tRFC)- 70ns (min.) · Row Active Time (tRAS) - 40ns · Clock Cycle Time (tCK) - 5ns
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256MB 32M x 64-Bit DDR400

DDR400

Abstract: PC3200 Memory Module Data Sheet T1264D47 1GB 128M x 64-bit DDR400 (PC3200) SPECIFICATIONS; · 1GB (128M x 64-bit) Unbuffered DDR400 DIMM · TSOP-II 64M x 8 (16M x 8 bit x 4 Bank/200Mhz) x Sixteen DRAM · 184-pin Dual in-line memory module with Gold Plated Contacts · Dimm Dimensions 133.35 x 31.75 x 4 (mm) · Programmable CAS Latency Supported - CL 3, 2.5, 2 · Row Cycle Time (tRC) - 55ns · Auto Refresh Cycle Time (tRFC)- 70ns · Row Active Time (tRAS) - 40ns · Clock Cycle Time (tCK) - 5ns · Device
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datasheet DIMM DDR400 PC3200

Abstract: L1272DC7 Memory Module Data Sheet L1272DC7 1GB 128M x 72-bit ECC DDR400 (PC3200) SPECIFICATIONS; · 1GB (128M x 72-bit) Unbuffered DDR400 DIMM · Error Check Correction (ECC) Capability · TSOP-II 64M x 8 (16M x 8 bit x 4 Bank/200Mhz) x Eighteen DRAM · 184-pin Dual in-line memory module with Gold Plated Contacts · Dimm Dimensions 133.35 x 31.75 x 4 (mm) · Programmable CAS Latency Supported - CL 3, 2.5, 2 · Row Cycle Time (tRC) - 55ns · Auto Refresh Cycle Time (tRFC)- 70ns · Row Active Time (tRAS) - 40ns
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datasheet DIMM DDR400 PC3200

DDR400

Abstract: PC3200 Memory Module Data Sheet L1272D37 1GB 64M x 72-bit ECC DDR400 (PC3200) SPECIFICATIONS; · 1GB (64M x 72-bit) Unbuffered DDR400 DIMM · Error Check Correction (ECC) Capability · TSOP-II 64M x 8 (16M x 8 bit x 4 Bank/200Mhz) x Eighteen DRAM · 184-pin Dual in-line memory module with Gold Plated Contacts · Dimm Dimensions 133.35 x 31.75 x 4 (mm) · Programmable CAS Latency Supported - CL 3, 2.5, 2 · Row Cycle Time (tRC) - 55ns · Auto Refresh Cycle Time (tRFC)- 70ns · Row Active Time (tRAS) - 40ns
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PC3200

Abstract: DDR400 Memory Module Data Sheet L1272YC7 1GB 128M x 72-bit ECC Registered DDR400 (PC3200) SPECIFICATIONS; · 1GB (128M x 72-bit) Registered DDR400 DIMM · Error Check Correction (ECC) Capability · BGA 64M x 8 (16M x 8 bit x 4 Bank/200Mhz) x Eighteen DRAM · 184-pin Dual in-line memory module with Gold Plated Contacts · Dimm Dimensions 133.35 x 28.575 x 3.99 (mm) · Programmable CAS Latency Supported - CL 3, 2.5, 2 · Row Cycle Time (tRC) - 55ns · Auto Refresh Cycle Time (tRFC)- 70ns (min.) · Row
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DDR400

Abstract: PC3200 Memory Module Data Sheet L6472YC7 512MB 64M x 72-bit ECC Registered DDR400 (PC3200) SPECIFICATIONS; · 512MB (64M x 72-bit) Registered DDR400 DIMM · Error Check Correction (ECC) Capability · BGA 32M x 8 (8M x 8 bit x 4 Bank/200Mhz) x Eighteen DRAM · 184-pin Dual in-line memory module with Gold Plated Contacts · Dimm Dimensions 133.35 x 28.575 x 3.99 (mm) · Programmable CAS Latency Supported - CL 3, 2.5, 2 · Row Cycle Time (tRC) - 55ns · Auto Refresh Cycle Time (tRFC)- 70ns (min.) · Row
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DDR400

Abstract: PC3200 Memory Module Data Sheet L6472DC7 512MB 64M x 72-bit ECC DDR400 (PC3200) SPECIFICATIONS; · 512MB (64M x 72-bit) Unbuffered DDR400 DIMM · Error Check Correction (ECC) Capability · TSOP-II 32M x 8 (8M x 8 bit x 4 Bank/200Mhz) x Eighteen DRAM · 184-pin Dual in-line memory module with Gold Plated Contacts · Dimm Dimensions 133.35 x 31.75 x 4 (mm) · Programmable CAS Latency Supported - CL 3, 2.5, 2 · Row Cycle Time (tRC) - 55ns · Auto Refresh Cycle Time (tRFC)- 70ns · Row Active Time (tRAS
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DIMM DDR400 PC3200

Abstract: DDR400 Memory Module Data Sheet L6472Y37 512MB 64M x 72-bit ECC Registered DDR400 (PC3200) SPECIFICATIONS; · 512MB (64M x 72-bit) Registered DDR400 DIMM · Error Check Correction (ECC) Capability · BGA 32M x 8 (8M x 8 bit x 4 Bank/200Mhz) x Eighteen DRAM · 184-pin Dual in-line memory module with Gold Plated Contacts · Dimm Dimensions 133.35 x 28.575 x 3.99 (mm) · Programmable CAS Latency Supported - CL 3, 2.5, 2 · Row Cycle Time (tRC) - 55ns · Auto Refresh Cycle Time (tRFC)- 70ns (min.) · Row
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DDR400

Abstract: PC3200 Memory Module Data Sheet H3264D47 256MB 32M x 64-bit DDR400 (PC3200) SPECIFICATIONS; · 256MB (32M x 64-bit) Unbuffered DDR400 DIMM · TSOP-II 32M x 8 (8M x 8 bit x 4 Bank/200Mhz) x Eight DRAM · 184-pin Dual in-line memory module with Gold Plated Contacts · Dimm Dimensions 133.35 x 31.75 x 4 (mm) · Programmable CAS Latency Supported - CL 3, 2.5, 2 · Row Cycle Time (tRC) - 60ns · Auto Refresh Cycle Time (tRFC)- 70ns (min.) · Row Active Time (tRAS) - 40ns · Clock Cycle Time (tCK) - 5ns (max) ·
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DDR400

Abstract: PC3200 Memory Module Data Sheet L3272Y37 256MB 32M x 72-bit ECC Registered DDR400 (PC3200) SPECIFICATIONS; · 256MB (32M x 72-bit) Registered DDR400 DIMM · Error Check Correction (ECC) Capability · BGA 32M x 8 (8M x 8 bit x 4 Bank/200Mhz) x Nine DRAM · 184-pin Dual in-line memory module with Gold Plated Contacts · Dimm Dimensions 133.35 x 28.57 x 2.99 (mm) · Programmable CAS Latency Supported - CL 3, 2.5, 2 · Row Cycle Time (tRC) - 55ns · Auto Refresh Cycle Time (tRFC)- 70ns (min.) · Row
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DIMM DDR400 PC3200

Abstract: DDR400 Memory Module Data Sheet L3264D37 256MB 32M x 64-bit DDR400 (PC3200) SPECIFICATIONS; · 256MB (32M x 64-bit) Unbuffered DDR400 DIMM · TSOP-II 32M x 8 (8M x 8 bit x 4 Bank/200Mhz) x Eight DRAM · 184-pin Dual in-line memory module with Gold Plated Contacts · Dimm Dimensions 133.35 x 31.75 x 3.18 (mm) · Programmable CAS Latency Supported - CL 3, 2.5, 2 · Row Cycle Time (tRC) - 55ns · Auto Refresh Cycle Time (tRFC)- 70ns (min.) · Row Active Time (tRAS) - 40ns · Clock Cycle Time (tCK) - 5ns
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DIMM DDR400 PC3200

Abstract: memory module Memory Module Data Sheet L1264D37 1GB 128M x 64-bit DDR400 (PC3200) SPECIFICATIONS; · 1GB (128M x 64-bit) Unbuffered DDR400 DIMM · TSOP-II 64M x 8 (16M x 8 bit x 4 Bank/200Mhz) x Sixteen DRAM · 184-pin Dual in-line memory module with Gold Plated Contacts · Dimm Dimensions 133.35 x 31.75 x 4 (mm) · Programmable CAS Latency Supported - CL 3, 2.5, 2 · Row Cycle Time (tRC) - 55ns · Auto Refresh Cycle Time (tRFC)- 70ns · Row Active Time (tRAS) - 40ns · Clock Cycle Time (tCK) - 5ns · Device
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memory module

T3264D47

Abstract: 32mx8 Memory Module Data Sheet T3264D47 256MB 32M x 64-bit DDR400 (PC3200) SPECIFICATIONS; · 256MB (32M x 64-bit) Unbuffered DDR400 DIMM · TSOP-II 32M x 8 (8M x 8 bit x 4 Bank/200Mhz) x Eight DRAM · 184-pin Dual in-line memory module with Gold Plated Contacts · Dimm Dimensions 133.35 x 31.75 x 4 (mm) · Programmable CAS Latency Supported - CL 3, 2.5, 2 · Row Cycle Time (tRC) - 60ns · Auto Refresh Cycle Time (tRFC)- 70ns (min.) · Row Active Time (tRAS) - 40ns · Clock Cycle Time (tCK) - 5ns (max) ·
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32mx8
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