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934066615115 Nexperia 8.2A, 12V, 0.019ohm, P-CHANNEL, Si, POWER, MOSFET, 2 X 2 MM, 0.65 MM HEIGHT, LEADLESS, ULTRA THIN, PLASTIC, DFN2020MD-6, 6 PIN visit Digikey Buy
934066615184 Nexperia 8.2A, 12V, 0.019ohm, P-CHANNEL, Si, POWER, MOSFET, 2 X 2 MM, 0.65 MM HEIGHT, LEADLESS, ULTRA THIN, PLASTIC, DFN2020MD-6, 6 PIN visit Digikey Buy
934066626184 Nexperia 7.2A, 30V, 0.0245ohm, N-CHANNEL, Si, POWER, MOSFET, 2 X 2 MM, 0.65 MM HEIGHT, ULTRA SMALL, LEADLESS, PLASTIC, DFN2020MD-6, 6 PIN visit Digikey Buy
934066869115 Nexperia 4.3A, 30V, 0.047ohm, N-CHANNEL, Si, POWER, MOSFET, 2 X 2 MM, 0.65 MM HEIGHT, ULTRA SMALL, LEADLESS, PLASTIC, DFN2020MD-6, 6 PIN visit Digikey Buy

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DFN2020MD-6 Datasheet

Part Manufacturer Description PDF Type
DFN2020MD-6 NXP Semiconductors AN11304 - MOSFET load switch PCB with thermal measurement Original

DFN2020MD-6

Catalog Datasheet MFG & Type PDF Document Tags
Abstract: 0' #16;#25; SOT1220 ') 1 #21;#19; #21;#19; DFN2020MD-6; reel pack; standard product orientation; 12NC ending 115 Rev. 2 â'" 19 February 2013 Packing information 1. Packing method Printed plano box , Semiconductors DFN2020MD-6; reel pack; standard product orientation; 12NC ending 115 2. Product orientation , DFN2020MD-6; reel pack; standard product orientation; 12NC ending 115 4. Reel dimensions A Z W2 , © NXP B.V. 2013. All rights reserved. 3 of 4 SOT1220 NXP Semiconductors DFN2020MD-6; reel NXP Semiconductors
Original
Abstract: 0' #16;#25; SOT1220 ') 1 #21;#19; #21;#19; DFN2020MD-6; Tape reel SMD; reversed product orientation 12NC ending 125 Rev. 1 â'" 4 February 2013 Packing information 1. Packing method Printed , . SOT1220 NXP Semiconductors DFN2020MD-6; Tape reel SMD; reversed product orientation; 12NC ending 125 , reserved. 2 of 4 SOT1220 NXP Semiconductors DFN2020MD-6; Tape reel SMD; reversed product , 4 SOT1220 NXP Semiconductors DFN2020MD-6; Tape reel SMD; reversed product orientation; 12NC NXP Semiconductors
Original
Abstract: note Document information Info Content Keywords Load switch, MOSFETs, DFN2020MD-6 (SOT1220 , allow a comparison of the thermal performance of MOSFETs in the three packages DFN2020MD-6 (SOT1220 , ), followed by the DFN3333-8 (SOT873-1) and finally the DFN2020MD-6 stage. The last 4 states (All Off, SO , DFN2020MD-6 (SOT1220) package. Types can be provided with a maximum VDS rating of 30 V, 20 V and 12 V , P-channel MOSFET in DFN2020MD-6 (SOT1220) Type number Drain-source voltage VDS (V) Gate-source NXP Semiconductors
Original
AN11304 DFN2020-6 DFN2020 DFN3333 DFN1006

MOSFET TRANSISTOR SMD MARKING CODE 11

Abstract: MOSFET TRANSISTOR SMD MARKING CODE NA medium power DFN2020MD-6 (SOT1220) Surface-Mounted Device (SMD) plastic package using Trench MOSFET , DFN2020MD-6 (SOT1220) 3. Ordering information Table 3. Ordering information Package Name PMPB15XN Description Version SOT1220 DFN2020MD-6 plastic thermal enhanced ultra thin small outline package; no leads; 6 , 0.25 0.35 0.2 0.3 1.0 1.2 Dimensions in mm 12-04-30 Fig. 18. Package outline DFN2020MD-6 , of DFN2020MD-6 package SOT1220 0.33 (6×) 0.43 (6×) 0.53 (6×) 0.76 0.66 0.56 0.25 0.35 0.45
NXP Semiconductors
Original
MOSFET TRANSISTOR SMD MARKING CODE 11 MOSFET TRANSISTOR SMD MARKING CODE NA NXP SMD mosfet MARKING CODE MOSFET TRANSISTOR SMD MARKING CODE 7 TRANSISTOR SMD MARKING CODE QR MOSFET TRANSISTOR SMD MARKING CODE
Abstract: leadless medium power DFN2020MD-6 (SOT1220) Surface-Mounted Device (SMD) plastic package using Trench , 8 5 G 4 Transparent top view S 017aaa253 DFN2020MD-6 (SOT1220) 6. Ordering , Version DFN2020MD-6 plastic thermal enhanced ultra thin small outline package; no leads; 6 terminals , 1.9 2.1 0.25 0.35 0.65 12-04-30 Fig. 18. Package outline DFN2020MD-6 (SOT1220 , DFN2020MD-6 package 0.33 (6×) SOT1220 0.76 0.43 (6×) 0.66 0.53 (6×) 0.56 0.25 NXP Semiconductors
Original
PMPB200EN
Abstract: a leadless medium power DFN2020MD-6 (SOT1220) Surface-Mounted Device (SMD) plastic package using , DFN2020MD-6 (SOT1220) S 017aaa255 6. Ordering information Table 3. Ordering information Type number Package Name PMPB95ENEA Description Version DFN2020MD-6 DFN2020MD-6: plastic , Fig. 18. Package outline DFN2020MD-6 (SOT1220) PMPB95ENEA Product data sheet All information , 13. Soldering Footprint information for reflow soldering of DFN2020MD-6 package 0.33 (6Ã NXP Semiconductors
Original
AEC-Q101
Abstract: a leadless medium power DFN2020MD-6 (SOT1220) Surface-Mounted Device (SMD) plastic package using , Transparent top view G S 017aaa257 DFN2020MD-6 (SOT1220) 6. Ordering information Table 3. Ordering information Type number Package Name NX2020P1 Description Version DFN2020MD-6 DFN2020MD-6: plastic thermal enhanced ultra thin small outline package; no leads; 6 terminals SOT1220 , Semiconductors 30 V, single P-channel Trench MOSFET 12. Package outline DFN2020MD-6: plastic thermal NXP Semiconductors
Original

MOSFET TRANSISTOR SMD MARKING CODE A1

Abstract: MOSFET TRANSISTOR SMD MARKING CODE 11 medium power DFN2020MD-6 (SOT1220) Surface-Mounted Device (SMD) plastic package using Trench MOSFET , DFN2020MD-6 (SOT1220) 3. Ordering information Table 3. Ordering information Package Name PMPB20UN Description Version SOT1220 DFN2020MD-6 plastic thermal enhanced ultra thin small outline package; no leads; 6 , outline DFN2020MD-6: plastic thermal enhanced ultra thin small outline package; no leads; 6 terminals , European projection sot1220_po Issue date 12-04-23 12-04-30 Fig. 18. Package outline DFN2020MD-6
NXP Semiconductors
Original
MOSFET TRANSISTOR SMD MARKING CODE A1
Abstract: a leadless medium power DFN2020MD-6 (SOT1220) Surface-Mounted Device (SMD) plastic package using , DFN2020MD-6 (SOT1220) S 017aaa255 6. Ordering information Table 3. Ordering information Type number Package Name PMPB85ENEA Description Version DFN2020MD-6 DFN2020MD-6: plastic , Dimensions in mm 0.25 0.35 0.65 12-04-30 Fig. 18. Package outline DFN2020MD-6 (SOT1220 , soldering of DFN2020MD-6 package 0.33 (6×) SOT1220 0.76 0.43 (6×) 0.66 0.53 (6à NXP Semiconductors
Original

PMPB40SNA

Abstract: transistor smd 1E medium power DFN2020MD-6 (SOT1220) Surface-Mounted Device (SMD) plastic package using Trench MOSFET , G S 017aaa253 Graphic symbol D 8 Transparent top view DFN2020MD-6 (SOT1220) 3 , DFN2020MD-6 plastic thermal enhanced ultra thin small outline package; no leads; 6 terminals Type number , Fig. 18. Package outline DFN2020MD-6 (SOT1220) PMPB40SNA All information provided in this , . Soldering Footprint information for reflow soldering of DFN2020MD-6 package SOT1220 0.33 (6×) 0.43 (6
NXP Semiconductors
Original
transistor smd 1E
Abstract: leadless medium power DFN2020MD-6 (SOT1220) Surface-Mounted Device (SMD) plastic package using Trench , symbol D 8 Transparent top view 017aaa257 DFN2020MD-6 (SOT1220) 3. Ordering information Table 3. Ordering information Package Name PMPB15XP Description Version SOT1220 DFN2020MD-6 plastic , 4 5 6 0.65 0.25 0.35 0.2 0.3 1.0 1.2 Dimensions in mm 12-04-30 Fig. 18. DFN2020MD-6 , of DFN2020MD-6 package SOT1220 0.33 (6×) 0.43 (6×) 0.53 (6×) 0.76 0.66 0.56 0.25 0.35 0.45 NXP Semiconductors
Original

smd transistor marking 1p

Abstract: TRANSISTOR SMD MARKING CODE 1P medium power DFN2020MD-6 (SOT1220) Surface-Mounted Device (SMD) plastic package using Trench MOSFET , Transparent top view DFN2020MD-6 (SOT1220) 3. Ordering information Table 3. Ordering information Package Name PMPB33XN Description Version SOT1220 DFN2020MD-6 plastic thermal enhanced ultra thin small , 0.35 0.2 0.3 1.0 1.2 Dimensions in mm 12-04-30 Fig. 18. DFN2020MD-6 (SOT1220) PMPB33XN All , Trench MOSFET 10. Soldering Footprint information for reflow soldering of DFN2020MD-6 package SOT1220
NXP Semiconductors
Original
smd transistor marking 1p TRANSISTOR SMD MARKING CODE 1P smd TRANSISTOR code marking 1P
Abstract: leadless medium power DFN2020MD-6 (SOT1220) Surface-Mounted Device (SMD) plastic package using Trench , Transparent top view 017aaa257 DFN2020MD-6 (SOT1220) 3. Ordering information Table 3. Ordering information Package Name PMPB19XP Description Version SOT1220 DFN2020MD-6 plastic thermal enhanced ultra thin , Fig. 18. Package outline DFN2020MD-6 (SOT1220) PMPB19XP All information provided in this document is , . Soldering Footprint information for reflow soldering of DFN2020MD-6 package SOT1220 0.33 (6×) 0.43 (6 NXP Semiconductors
Original

marking code 1s

Abstract: leadless medium power DFN2020MD-6 (SOT1220) Surface-Mounted Device (SMD) plastic package using Trench , Transparent top view 017aaa257 DFN2020MD-6 (SOT1220) 3. Ordering information Table 3. Ordering information Package Name PMPB33XP Description Version SOT1220 DFN2020MD-6 plastic thermal enhanced ultra thin , DFN2020MD-6 (SOT1220) PMPB33XP All information provided in this document is subject to legal disclaimers , reflow soldering of DFN2020MD-6 package SOT1220 0.33 (6×) 0.43 (6×) 0.53 (6×) 0.76 0.66 0.56
NXP Semiconductors
Original
marking code 1s
Abstract: leadless medium power DFN2020MD-6 (SOT1220) Surface-Mounted Device (SMD) plastic package using Trench , Transparent top view 017aaa257 DFN2020MD-6 (SOT1220) 3. Ordering information Table 3. Ordering information Package Name PMPB48EP Description Version SOT1220 DFN2020MD-6 plastic thermal enhanced ultra thin , . Package outline DFN2020MD-6 (SOT1220) PMPB48EP All information provided in this document is subject to , Footprint information for reflow soldering of DFN2020MD-6 package SOT1220 0.33 (6×) 0.43 (6×) 0.53 (6 NXP Semiconductors
Original
Abstract: leadless medium power DFN2020MD-6 (SOT1220) Surface-Mounted Device (SMD) plastic package using Trench , Simplified outline 1 2 3 7 6 5 4 Graphic symbol D G 8 Transparent top view DFN2020MD-6 , Description Version SOT1220 DFN2020MD-6 plastic thermal enhanced ultra thin small outline package; no leads; 6 , Fig. 17. Package outline DFN2020MD-6 (SOT1220) PMPB10XNE All information provided in this , 10. Soldering Footprint information for reflow soldering of DFN2020MD-6 package SOT1220 0.33 (6 NXP Semiconductors
Original

NX3008NBKMB

Abstract: •åƒä¸­è´è½½å¼'å³çš"主要产å"ï¼š } DFN2020MD-6åç‡ä¸º1.7 W,可替æ¢æ›´å¤§å , «˜3A DFN2020MD-6 / DFN2020-6: } 2.0 x 2.0 x 0.65 mm } å•/双è¯ç‰‡ï¼Œå¸¦çƒ­æ²‰ } é'对å•å°è£ç‰æ¬çš"é , •'é"¡å¯ç"æ¥ä¾§ç"盘 å¨åç"µæ¿ä¸­ï¼ŒMOSFETé'šè¿‡ä¸'个é"线åçš"ç , 12 DFN2020MD-6 DFN2020MD-6 Næ²é"ï¼Œå• 20 15 Næ²é"ã'åŒã'ESDä¿æ¤ 20 85 DFN2020-6 PMPB16XN Næ²é"ï¼Œå• 30 16 DFN2020MD-6 PMPB40SNA Næ²é"ï¼Œå• 60
NXP Semiconductors
Original
NX3008NBKMB PESD18VF1BL PESD24VF1BL PESD18VF1BSF PESD24VF1BSF DSN0603 DFN2520
Abstract: leadless medium power DFN2020MD-6 (SOT1220) Surface-Mounted Device (SMD) plastic package using Trench , 8 5 4 Transparent top view G S 017aaa253 DFN2020MD-6 (SOT1220) 6. Ordering , Version DFN2020MD-6 DFN2020MD-6: plastic thermal enhanced ultra thin small outline package; no leads , 30 V, N-channel Trench MOSFET 12. Package outline DFN2020MD-6: plastic thermal enhanced ultra , European projection Issue date 12-04-23 12-04-30 SOT1220 Fig. 18. Package outline DFN2020MD-6 NXP Semiconductors
Original
NX2020N2
Abstract: leadless medium power DFN2020MD-6 (SOT1220) Surface-Mounted Device (SMD) plastic package using Trench , 8 5 G 4 S 017aaa253 Transparent top view DFN2020MD-6 (SOT1220) 6. Ordering , Version DFN2020MD-6 DFN2020MD-6: plastic thermal enhanced ultra thin small outline package; no leads , outline DFN2020MD-6: plastic thermal enhanced ultra thin small outline package; no leads; 6 terminals , outline DFN2020MD-6 (SOT1220) PMPB40SNA Product data sheet All information provided in this NXP Semiconductors
Original
Abstract: leadless medium power DFN2020MD-6 (SOT1220) Surface-Mounted Device (SMD) plastic package using Trench , 6 5 G Transparent top view SOT1220 (DFN2020MD-6) 3. Ordering information Table 3. Ordering information Package Name PMPB11EN DFN2020MD-6 Description plastic thermal enhanced ultra thin , (DFN2020MD-6) PMPB11EN All information provided in this document is subject to legal disclaimers , soldering of DFN2020MD-6 package SOT1220 0.33 (6×) 0.43 (6×) 0.53 (6×) 0.76 0.66 0.56 0.25 0.35 NXP Semiconductors
Original
Abstract: leadless medium power DFN2020MD-6 (SOT1220) Surface-Mounted Device (SMD) plastic package using Trench , symbol D 1 7 2 6 5 G Transparent top view SOT1220 (DFN2020MD-6) 3. Ordering information Table 3. Ordering information Package Name PMPB20EN DFN2020MD-6 Description plastic thermal enhanced , (DFN2020MD-6) PMPB20EN All information provided in this document is subject to legal disclaimers , soldering of DFN2020MD-6 package SOT1220 0.33 (6×) 0.43 (6×) 0.53 (6×) 0.76 0.66 0.56 0.25 0.35 NXP Semiconductors
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PMPB15XP,115

Abstract: leadless medium power DFN2020MD-6 (SOT1220) Surface-Mounted Device (SMD) plastic package using Trench , G S Graphic symbol D 8 Transparent top view 017aaa257 DFN2020MD-6 (SOT1220) 3 , DFN2020MD-6 plastic thermal enhanced ultra thin small outline package; no leads; 6 terminals Type number , 0.3 1.0 1.2 Dimensions in mm 12-04-30 Fig. 18. Package outline DFN2020MD-6 (SOT1220 , DFN2020MD-6 package SOT1220 0.33 (6×) 0.43 (6×) 0.53 (6×) 0.76 0.66 0.56 0.25 0.35 0.45 0.775
NXP Semiconductors
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PMPB15XP,115
Abstract: leadless medium power DFN2020MD-6 (SOT1220) Surface-Mounted Device (SMD) plastic package using Trench , Transparent top view DFN2020MD-6 (SOT1220) S 017aaa259 3. Ordering information Table 3. Ordering information Package Name PMPB43XPE Description Version SOT1220 DFN2020MD-6 plastic thermal enhanced ultra thin , 1.0 1.2 Dimensions in mm 12-04-30 Fig. 18. Package outline DFN2020MD-6 (SOT1220) PMPB43XPE , , single P-channel Trench MOSFET 10. Soldering Footprint information for reflow soldering of DFN2020MD-6 NXP Semiconductors
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Abstract: leadless medium power DFN2020MD-6 (SOT1220) Surface-Mounted Device (SMD) plastic package using Trench , Transparent top view DFN2020MD-6 (SOT1220) S 017aaa259 3. Ordering information Table 3. Ordering information Package Name PMPB29XPE Description Version SOT1220 DFN2020MD-6 plastic thermal enhanced ultra thin , 0.3 1.0 1.2 Dimensions in mm 12-04-30 Fig. 18. Package outline DFN2020MD-6 (SOT1220 , DFN2020MD-6 package SOT1220 0.33 (6×) 0.43 (6×) 0.53 (6×) 0.76 0.66 0.56 0.25 0.35 0.45 0.775 NXP Semiconductors
Original
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