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934068618315 Nexperia MOSFET N-CH 60V SGL 3-DFN1006B visit Digikey Buy
934065927315 Nexperia 100mA, 50V, PNP, Si, SMALL SIGNAL TRANSISTOR, 1 X 0.60 MM, 0.37 MM HEIGHT, LEADLESS, ULTRA SMALL, PLASTIC, DFN1006B-3, 3 PIN visit Digikey Buy
934066055315 Nexperia 100mA, 50V, PNP, Si, SMALL SIGNAL TRANSISTOR, 1 X 0.60 MM, 0.37 MM HEIGHT, LEADLESS, ULTRA SMALL, PLASTIC, DFN1006B-3, 3 PIN visit Digikey Buy
934067008315 Nexperia 100mA, 50V, NPN, Si, SMALL SIGNAL TRANSISTOR, 1 X 0.60 MM, 0.37 MM HEIGHT, LEADLESS, ULTRA SMALL, PLASTIC, DFN1006B-3, 3 PIN visit Digikey Buy
934065939315 Nexperia 100mA, 50V, NPN, Si, SMALL SIGNAL TRANSISTOR, 1 X 0.60 MM, 0.37 MM HEIGHT, LEADLESS, ULTRA SMALL, PLASTIC, DFN1006B-3, 3 PIN visit Digikey Buy
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DFN1006B-3

Catalog Datasheet MFG & Type PDF Document Tags
Abstract: ) in a leadless ultra small DFN1006B-3 (SOT883B) Surface-Mounted Device (SMD) plastic package. NPN , (DFN1006B-3) sym003 3. Ordering information Table 3. Ordering information Package Name PDTA114EMB DFN1006B-3 Description Leadless ultra small plastic package; 3 solder lands; body 1.0 x 0.6 x 0.37 mm , ) READING DIRECTION 006aac673 Fig 1. DFN1006B-3 (SOT883B) binary marking code description , 125 175 Tamb (°C) FR4 PCB, standard footprint Fig 2. Power derating curve for DFN1006B-3 (SOT883B NXP Semiconductors
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PDTC114EMB AEC-Q101
Abstract: ) in a leadless ultra small DFN1006B-3 (SOT883B) Surface-Mounted Device (SMD) plastic package. NPN , (DFN1006B-3) sym003 3. Ordering information Table 3. Ordering information Package Name PDTA143EMB DFN1006B-3 Description Leadless ultra small plastic package; 3 solder lands; body 1.0 x 0.6 x 0.37 mm , ) READING DIRECTION 006aac673 Fig 1. DFN1006B-3 (SOT883B) binary marking code description , 125 175 Tamb (°C) FR4 PCB, standard footprint Fig 2. Power derating curve for DFN1006B-3 (SOT883B NXP Semiconductors
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PDTC143EMB
Abstract: transistors in a leadless ultra small DFN1006B-3 (SOT883B) Surface-Mounted Device (SMD) plastic package , Version DFN1006B-3 leadless ultra small plastic package; 3 solder lands; body 1.0 ï'´ 0.6 ï'´ 0.37 , ] 2PA1774QMB 0100 0000 2PA1774RMB 0000 1101 2PA1774SMB 0000 1110 [1] For DFN1006B-3 , 006aac673 Fig 1. 2PA1774XMB_SER Product data sheet DFN1006B-3 (SOT883B) binary marking code , 3 0.55 0.47 Dimensions in mm Fig 7. 11-11-02 Package outline DFN1006B-3 (SOT883B) 10 NXP Semiconductors
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2PA1774 2PC4617QMB 2PC4617RMB

t8 smd transistor

Abstract: ) in a leadless ultra small DFN1006B-3 (SOT883B) Surface-Mounted Device (SMD) plastic package. PNP , (collector) 1 3 2 Transparent top view 1 R2 R1 Simplified outline Graphic symbol 3 2 DFN1006B-3 , DFN1006B-3 Description Leadless ultra small plastic package; 3 solder lands; body 1.0 x 0.6 x 0.37 mm , ) READING DIRECTION 006aac673 Fig 1. DFN1006B-3 (SOT883B) binary marking code description , 125 175 Tamb (°C) FR4 PCB, standard footprint Fig 2. Power derating curve for DFN1006B-3 (SOT883B
NXP Semiconductors
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t8 smd transistor
Abstract: ) in a leadless ultra small DFN1006B-3 (SOT883B) Surface-Mounted Device (SMD) plastic package. PNP , (collector) 1 3 2 Transparent top view 1 R2 R1 Simplified outline Graphic symbol 3 2 DFN1006B-3 , DFN1006B-3 Description Leadless ultra small plastic package; 3 solder lands; body 1.0 x 0.6 x 0.37 mm , ) READING DIRECTION 006aac673 Fig 1. DFN1006B-3 (SOT883B) binary marking code description , 125 175 Tamb (°C) FR4 PCB, standard footprint Fig 2. Power derating curve for DFN1006B-3 (SOT883B NXP Semiconductors
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PDTC144WMB PDTA144WMB
Abstract: Resistor-Equipped Transistor (RET) in a leadless ultra small DFN1006B-3 (SOT883B) Surface-Mounted Device (SMD , 3 3 3 O output (collector) R1 2 1 Transparent top view 2 DFN1006B-3 , Name PDTC124TMB Description Version DFN1006B-3 Leadless ultra small plastic package; 3 , EXAMPLE: 0111 1011 MARKING CODE (EXAMPLE) READING DIRECTION 006aac673 Fig 1. DFN1006B-3 , curve for DFN1006B-3 (SOT883B) 6. Thermal characteristics Table 6. Symbol Rth(j-a) [1 NXP Semiconductors
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PDTA124TMB
Abstract: Resistor-Equipped Transistor (RET) in a leadless ultra small DFN1006B-3 (SOT883B) Surface-Mounted Device (SMD , 3 3 3 O output (collector) R1 2 1 Transparent top view 2 SOT883B (DFN1006B-3 , PDTC123TMB Description Version DFN1006B-3 Leadless ultra small plastic package; 3 solder lands , 1011 MARKING CODE (EXAMPLE) READING DIRECTION 006aac673 Fig 1. DFN1006B-3 (SOT883B) binary , curve for DFN1006B-3 (SOT883B) 6. Thermal characteristics Table 6. Symbol Rth(j-a) [1 NXP Semiconductors
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PDTA123TMB
Abstract: Resistor-Equipped Transistor (RET) in a leadless ultra small DFN1006B-3 (SOT883B) Surface-Mounted Device (SMD , Transparent top view R2 2 SOT883B (DFN1006B-3) sym003 3. Ordering information Table 3. Ordering information Type number Package Name PDTA114YMB Description Version DFN1006B-3 , Fig 1. DFN1006B-3 (SOT883B) binary marking code description PDTA114YMB Product data sheet , curve for DFN1006B-3 (SOT883B) PDTA114YMB Product data sheet All information provided in this NXP Semiconductors
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PDTC114YMB
Abstract: Resistor-Equipped Transistor (RET) in a leadless ultra small DFN1006B-3 (SOT883B) Surface-Mounted Device (SMD , Transparent top view R2 2 DFN1006B-3 (SOT883B) sym003 3. Ordering information Table 3. Ordering information Type number Package Name Description Version PDTA144WMB DFN1006B-3 , Fig 1. DFN1006B-3 (SOT883B) binary marking code description PDTA144WMB Product data sheet , curve for DFN1006B-3 (SOT883B) 6. Thermal characteristics Table 6. Thermal characteristics NXP Semiconductors
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Abstract: Resistor-Equipped Transistor (RET) in a leadless ultra small DFN1006B-3 (SOT883B) Surface-Mounted Device (SMD , 3 3 3 O output (collector) R1 2 1 Transparent top view 2 DFN1006B-3 , Name PDTA124TMB Description Version DFN1006B-3 Leadless ultra small plastic package; 3 , EXAMPLE: 0111 1011 MARKING CODE (EXAMPLE) READING DIRECTION 006aac673 Fig 1. DFN1006B-3 , curve for DFN1006B-3 (SOT883B) 6. Thermal characteristics Table 6. Symbol Rth(j-a) [1 NXP Semiconductors
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Abstract: Resistor-Equipped Transistor (RET) in a leadless ultra small DFN1006B-3 (SOT883B) Surface-Mounted Device (SMD , 3 3 O output (collector) R1 2 1 Transparent top view 2 DFN1006B-3 (SOT883B , Description Version PDTA114TMB DFN1006B-3 Leadless ultra small plastic package; 3 solder lands , 1011 MARKING CODE (EXAMPLE) READING DIRECTION 006aac673 Fig 1. DFN1006B-3 (SOT883B) binary , curve for DFN1006B-3 (SOT883B) 6. Thermal characteristics Table 6. Symbol Rth(j-a) [1 NXP Semiconductors
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PDTC114TMB

PDTA123TM

Abstract: ) in a leadless ultra small DFN1006B-3 (SOT883B) Surface-Mounted Device (SMD) plastic package. NPN , Simplified outline Graphic symbol 3 1 SOT883B (DFN1006B-3) sym009 3. Ordering information Table 3. Ordering information Package Name PDTA123TMB DFN1006B-3 Description Leadless ultra small , . DFN1006B-3 (SOT883B) binary marking code description PDTA123TMB All information provided in this , derating curve for DFN1006B-3 (SOT883B) 6. Thermal characteristics Table 6. Symbol Rth(j-a) Thermal
NXP Semiconductors
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PDTA123TM
Abstract: ) in a leadless ultra small DFN1006B-3 (SOT883B) Surface-Mounted Device (SMD) plastic package. PNP , (DFN1006B-3) sym007 3. Ordering information Table 3. Ordering information Package Name PDTC123YMB DFN1006B-3 Description Leadless ultra small plastic package; 3 solder lands; body 1.0 x 0.6 x 0.37 mm , ) READING DIRECTION 006aac673 Fig 1. DFN1006B-3 (SOT883B) binary marking code description , 125 175 Tamb (°C) FR4 PCB, standard footprint Fig 2. Power derating curve for DFN1006B-3 (SOT883B NXP Semiconductors
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PDTA123YMB
Abstract: ) in a leadless ultra small DFN1006B-3 (SOT883B) Surface-Mounted Device (SMD) plastic package. PNP , Simplified outline Graphic symbol 3 1 DFN1006B-3 (SOT883B) sym012 3. Ordering information Table 3. Ordering information Package Name PDTC115TMB DFN1006B-3 Description Leadless ultra small , . DFN1006B-3 (SOT883B) binary marking code description PDTC115TMB All information provided in this , curve for DFN1006B-3 (SOT883B) PDTC115TMB All information provided in this document is subject to NXP Semiconductors
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PDTA115TMB
Abstract: ) in a leadless ultra small DFN1006B-3 (SOT883B) Surface-Mounted Device (SMD) plastic package. NPN , (collector) 1 3 2 Transparent top view 1 R2 R1 Simplified outline Graphic symbol 3 2 DFN1006B-3 , DFN1006B-3 Description Leadless ultra small plastic package; 3 solder lands; body 1.0 x 0.6 x 0.37 mm , ) READING DIRECTION 006aac673 Fig 1. DFN1006B-3 (SOT883B) binary marking code description , 125 175 Tamb (°C) FR4 PCB, standard footprint Fig 2. Power derating curve for DFN1006B-3 (SOT883B NXP Semiconductors
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PDTA143ZMB PDTC143ZMB
Abstract: leadless ultra small DFN1006B-3 (SOT883B) Surface-Mounted Device (SMD) plastic package using Trench MOSFET , outline 1 3 2 Transparent top view G Graphic symbol D DFN1006B-3 (SOT883B) S 017aaa259 3. Ordering information Table 3. Ordering information Package Name PMZB350UPE DFN1006B-3 Description Leadless , . DFN1006B-3 (SOT883B) binary marking code description PMZB350UPE All information provided in this , . DFN1006B-3 (SOT883B) 10. Soldering Footprint information for reflow soldering SOT883B 1.3 0.7 R0 NXP Semiconductors
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Abstract: 2 SOT883B (DFN1006B-3) sym007 3. Ordering information Table 3. Ordering information Type number Package Name PDTC143ZMB Description Version DFN1006B-3 Leadless ultra , . DFN1006B-3 (SOT883B) binary marking code description PDTC143ZMB Product data sheet All information , 125 175 Tamb (° C) FR4 PCB, standard footprint Fig 2. Power derating curve for DFN1006B-3 , 0.30 0.22 3 0.55 0.47 Dimensions in mm 11-11-02 Fig 10. Package outline SOT883B (DFN1006B-3 NXP Semiconductors
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Abstract: Resistor-Equipped Transistor (RET) in a leadless ultra small DFN1006B-3 (SOT883B) Surface-Mounted Device (SMD , Transparent top view R2 2 SOT883B (DFN1006B-3) sym007 3. Ordering information Table 3. Ordering information Type number Package Name PDTC123YMB Description Version DFN1006B-3 , Fig 1. DFN1006B-3 (SOT883B) binary marking code description PDTC123YMB Product data sheet , DFN1006B-3 (SOT883B) 6. Thermal characteristics Table 6. Thermal characteristics Symbol NXP Semiconductors
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Abstract: Resistor-Equipped Transistor (RET) in a leadless ultra small DFN1006B-3 (SOT883B) Surface-Mounted Device (SMD , view R2 2 SOT883B (DFN1006B-3) sym003 3. Ordering information Table 3. Ordering information Type number Package Name PDTA144EMB Description Version DFN1006B-3 Leadless , . DFN1006B-3 (SOT883B) binary marking code description PDTA144EMB Product data sheet All information , 125 175 Tamb (° C) FR4 PCB, standard footprint Fig 2. Power derating curve for DFN1006B-3 NXP Semiconductors
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PDTC144EMB
Abstract: unidirectional double ElectroStatic Discharge (ESD) protection diode in a DFN1006B-3 (SOT883B) leadless ultra , symbol 1 3 2 1 3 2 Transparent top view brb051 DFN1006B-3 (SOT883B) 6 , Description Version DFN1006B-3 DFN1006B-3: leadless ultra small plastic package; 3 solder lands , 1011 MARKING CODE (EXAMPLE) READING DIRECTION 006aac673 Fig. 1. DFN1006B-3 (SOT883B) binary , SOT883B Fig. 9. European projection Package outline DFN1006B-3 (SOT883B) PESD5V0X2UMB NXP Semiconductors
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IEC61000-4-2
Abstract: ) in a leadless ultra small DFN1006B-3 (SOT883B) Surface-Mounted Device (SMD) plastic package using , Graphic symbol SOT883B (DFN1006B-3) S 017aaa255 3. Ordering information Table 3. Ordering information Package Name 2N7002BKMB DFN1006B-3 Description Leadless ultra small plastic package; 3 solder , : 0111 1011 MARKING CODE (EXAMPLE) READING DIRECTION 006aac673 Fig 1. DFN1006B-3 (SOT883B) binary , 19. Package outline SOT883B (DFN1006B-3) 2N7002BKMB All information provided in this document NXP Semiconductors
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Abstract: ) in a leadless ultra small DFN1006B-3 (SOT883B) Surface-Mounted Device (SMD) plastic package using , Transparent top view G D Simplified outline Graphic symbol SOT883B (DFN1006B-3) S 017aaa259 3. Ordering information Table 3. Ordering information Package Name BSS84AKMB DFN1006B-3 Description Leadless , 1. DFN1006B-3 (SOT883B) binary marking code description BSS84AKMB All information provided , 0.40 0.34 0.04 max 2 1 Fig 19. Package outline SOT883B (DFN1006B-3) BSS84AKMB All NXP Semiconductors
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