500 MILLION PARTS FROM 12000 MANUFACTURERS

DATASHEET SEARCH ENGINE

Top Results

Part Manufacturer Description Datasheet BUY
CU5605-000 TE Connectivity (CU5605-000) WCSM-130/35-1500/S(C30) visit TE Connectivity
CU5607-000 TE Connectivity (CU5607-000) WCSM-130/35-1250/S(C30) visit TE Connectivity
CU5611-000 TE Connectivity (CU5611-000) WCSM-130/35-600/S(C30) visit TE Connectivity
CU5606-000 TE Connectivity (CU5606-000) WCSM-130/35-200/S(S10) visit TE Connectivity
CU5608-000 TE Connectivity (CU5608-000) WCSM-130/35-1200/S(C30) visit TE Connectivity
CU5612-000 TE Connectivity (CU5612-000) WCSM-130/35-800/S(C30) visit TE Connectivity

Search Stock

Shift+Click on the column header for multi-column sorting 
Part
Manufacturer
Supplier
Stock
Best Price
Price Each
Ordering
Part : CU5614-000 Supplier : TE Connectivity Manufacturer : Avnet Stock : - Best Price : - Price Each : -
Part : CU5617-000 Supplier : TE Connectivity Manufacturer : Avnet Stock : - Best Price : - Price Each : -
Part : CU5621-000 Supplier : TE Connectivity Manufacturer : Avnet Stock : - Best Price : $5.59 Price Each : $6.29
Part : CU5668-000 Supplier : TE Connectivity Manufacturer : Avnet Stock : - Best Price : - Price Each : -
Part : ACU5600A-MM Supplier : Black Box Manufacturer : Newark element14 Stock : 6 Best Price : $1,453.4500 Price Each : $1,453.4500
Part : PCU5644AF0MVZ1 Supplier : Freescale Semiconductor Manufacturer : Rochester Electronics Stock : 397 Best Price : - Price Each : -
Part : AR12BTCU5602 Supplier : Viking Technology Manufacturer : TME Electronic Components Stock : 980 Best Price : $0.1086 Price Each : $0.3030
Part : AR12BTCU5603 Supplier : Viking Technology Manufacturer : TME Electronic Components Stock : 950 Best Price : $0.1086 Price Each : $0.3030
Part : 3005W1PCU56L20X Supplier : Conec Manufacturer : Chip1Stop Stock : 25 Best Price : $10.2440 Price Each : $10.2440
Part : CU5614-000 Supplier : TE Connectivity Manufacturer : Sager Stock : - Best Price : - Price Each : -
Part : CU5617-000 Supplier : TE Connectivity Manufacturer : Sager Stock : - Best Price : - Price Each : -
Part : CU5621-000 Supplier : TE Connectivity Manufacturer : Sager Stock : - Best Price : $5.73 Price Each : $6.37
Shipping cost not included. Currency conversions are estimated. 

Cu-56

Catalog Datasheet MFG & Type PDF Document Tags
Abstract: latest information. cu56_120326_taping1_e Crystal Units Taping Package â  â  XXXXXXXX The Nihon Dempa Kogyo
Original
NX1255GB NX8045GB NX5032GA NX5032SA NX5032SD NX3225SA/GA

Cu-56

Abstract: DM74LS136 ±0.127) IÃ=LEÏE t D.Q2Q y (0.508) MIN 0,125-0.150 (3.175-3.810) 0.014-0 023 (CU56 -0.584) - TYP- 0.060. y
-
OCR Scan
DM74LS136 DM74LS136M DM74LS136N Cu-56 M14A N14A DS009819

entek Cu-56

Abstract: Cu-56 Surface Laminar Circuit (SLC) Ball Grid Array (BGA) Eutectic Surface Mount Assembly Application Note 5026 Introduction Printed Circuit Design Package Description Avago Technologies used Entek Cu-56 surface for all evaluations. This document outlines the design and assembly guidelines for surface laminar circuitry (SLC) ball grid array (BGA) packages. SLC BGA is a custom platform supporting a wide variety of performance applications. Flip-chip is the first level interconnection, and
Avago Technologies
Original
entek Cu-56 pcb warpage* in smt reflow pcb warpage after reflow thick bga die size Solder Paste, Indium, Type 3 bga thermal cycling reliability 5989-0491EN AV02-0770EN

solder paste alpha WS609

Abstract: WS609 pitch grid array · Ball 0.76 mm Avago Technologies used Entek Cu-56 surface for all their
Avago Technologies
Original
solder paste alpha WS609 WS609 Alpha WS609 solder Alpha WS609 epoxy adhesive paste cte table ceramic rework 5988-6603EN

SLOA103

Abstract: TPA200X =1.4 mil 2oz cu=2.8 mil 4oz cu=5.6 mil AWG # Diameter (mil) Cir mil Square mil Square mm Width (mil
Texas Instruments
Original
SLOA103 TPA200X bruce carsten d 7377 circuit diagram electronic choke for tube light Snubber circuits theory, design and application TPA300 TPA200

IPC-D-275 Design standard for Rigid Printed Boards and Rigid Printed Board Assemblies

Abstract: Coffin-Manson Equation process yields. Note: IBM generally uses Entek Cu-56 surfaces. Most of the IBM reliability testing has
IBM
Original
IPC-D-275 Design standard for Rigid Printed Boards and Rigid Printed Board Assemblies Coffin-Manson Equation senju solder bar senju solder paste vps BGA PROFILING Senju metal solder paste

IPC-D-275 Design standard for Rigid Printed Boards and Rigid Printed Board Assemblies

Abstract: entek Cu-56 quality can help increase process yields. Note: IBM generally uses Entek Cu-56 surfaces for manufacturing
IBM
Original
CCGA Kester 953 Flux PEAK TRAY bga APD-SBSC-101 T- 200x thinner QFP Shipping Trays

GPS-501-15

Abstract: mi1p -626 QQ-B-750 QQ-C-530 QQ-C-576 QQ-S-365 2.1.3 Test Specifications: MÌ1-C-U5662 Mil-Std-202 Polyt e tr af , that have been calibrated in accordance with specification MÌ1-C-U5662, U.3,2 Laboratory Conditions
-
OCR Scan
GPS-501-15 mi1p LI69 Brass QQ-B-626 1-P-19U68 QQ-B-626 1-C-U5662 AMP-109-1

be 3312

Abstract: TM3300 ±0.127) IÃ=LEÏE t D.Q2Q y (0.508) MIN 0,125-0.150 (3.175-3.810) 0.014-0 023 (CU56 -0.584) - TYP- 0.060. y
-
Original
be 3312 TM3300 3318H 3312 10-3CFM

3312L

Abstract: Surface Laminar Circuit (SLC) Ball Grid Array (BGA) Eutectic Surface Mount Assembly Application Note 5026 Introduction Printed Circuit Design Package Description Avago Technologies used Entek Cu-56 surface for all evaluations. This document outlines the design and assembly guidelines for surface laminar circuitry (SLC) ball grid array (BGA) packages. SLC BGA is a custom platform supporting a wide variety of performance applications. Flip-chip is the first level interconnection, and
-
Original
3312L

entek Cu-56

Abstract: thick bga die size pitch grid array · Ball 0.76 mm Avago Technologies used Entek Cu-56 surface for all their
QuickLogic
Original
stencil tension BGA "direct replacement" bga rework