CY8C27143 CY8C27243 CY8C27443 CY8C27543 CY8C27643 DBB00 DBB01 DCB02 DCB03 DBB10 - Datasheet Archive

 

CY8C27443, CY8C27543, CY8C27643 PSoC® Programmable System-on-Chip Features Powerful Harvard Architecture Processor M8C

 

CY8C27143 CY8C27143, CY8C27243 CY8C27243 CY8C27443 CY8C27443, CY8C27543 CY8C27543, CY8C27643 CY8C27643 PSoC® Programmable System-on-Chip Features Powerful Harvard Architecture Processor M8C processor speeds to 24 MHz 8x8 multiply, 32-bit accumulate Low power at high speed 3.0 to 5.25V operating voltage Operating voltages down to 1.0V using on-chip switch mode pump (SMP) Industrial temperature range: -40°C to +85°C Additional System Resources I2C slave, master, and multi-master to 400 kHz Watchdog and sleep timers User-configurable low voltage detection Integrated supervisory circuit On-chip precision voltage reference Complete Development Tools Free development software (PSoC DesignerTM) Full featured, In-Circuit Emulator and Programmer Full speed emulation Complex breakpoint structure 128K trace memory Advanced Peripherals (PSoC® Blocks) 12 rail-to-rail analog PSoC blocks provide: · Up to 14-Bit ADCs · Up to 9-Bit DACs · Programmable Gain Amplifiers · Programmable filters and comparators Eight digital PSoC blocks provide: · 8- to 32-bit timers, counters, and PWMs · CRC and PRS modules · Up to two full-duplex UARTs · Multiple SPITM Masters or Slaves · Connectable to all GPIO pins Complex peripherals by combining blocks Logic Block Diagram Port 5 Port 4 Port 3 Port 2 Port 1 Port 0 Analog Drivers PSoC CORE System Bus Global Digital Interconnect Precision, Programmable Clocking Internal 2.5% 24/48 MHz oscillator 24/48 MHz with optional 32 kHz crystal Optional external oscillator, up to 24 MHz Internal oscillator for watchdog and sleep SRAM 256 Bytes SROM Flash 16K CPUCore (M8C) Interrupt Controller Sleep and Watchdog Multiple Clock Sources (Includes IMO, ILO, PLL, and ECO) Flexible On-Chip Memory 16K Flash program storage 50,000 erase/write cycles 256 bytes SRAM data storage In-System Serial Programming (ISSP) Partial Flash updates Flexible protection modes EEPROM emulation in Flash Programmable Pin Configurations 25 mA Sink, 10 mA Source on all GPIO Pull up, pull down, high Z, strong, or open drain drive modes on all GPIO Eight standard analog inputs on GPIO, plus four additional analog inputs with restricted routing Four 30 mA analog outputs on GPIO Configurable interrupt on all GPIO Global Analog Interconnect DIGITAL SYSTEM ANALOG SYSTEM Analog Ref. Digital Block Array Digital Clocks Multiply Accum. Analog Block Array POR and LVD Decimator I 2C System Resets Analog Input Muxing Internal Voltage Ref. Switch Mode Pump SYSTEM RESOURCES Cypress Semiconductor Corporation Document Number: 38-12012 Rev. *P · 198 Champion Court · San Jose, CA 95134-1709 · 408-943-2600 Revised February 10, 2010 [+] Feedback CY8C27143 CY8C27143, CY8C27243 CY8C27243 CY8C27443 CY8C27443, CY8C27543 CY8C27543, CY8C27643 CY8C27643 Contents Features .1 Logic Block Diagram .1 Contents .2 PSoC Functional Overview .3 PSoC Core .3 Digital System .3 Analog System .4 Additional System Resources .5 PSoC Device Characteristics .5 Getting Started .5 Application Notes .5 Development Kits .5 Training .5 CYPros Consultants .5 Solutions Library .5 Technical Support .5 Development Tools .6 PSoC Designer Software Subsystems .6 In-Circuit Emulator .6 Designing with PSoC Designer .7 Select Components .7 Configure Components .7 Organize and Connect .7 Generate, Verify, and Debug .7 Document Conventions .8 Acronyms Used .8 Units of Measure .8 Numeric Naming .8 Pinouts .9 8-Pin Part Pinout .9 Document Number: 38-12012 Rev. *P 20-Pin Part Pinout . 9 28-Pin Part Pinout .10 44-Pin Part Pinout .11 48-Pin Part Pinout .12 56-Pin Part Pinout .14 Register Reference .16 Register Conventions .16 Register Mapping Tables .16 Electrical Specifications .19 Absolute Maximum Ratings .20 Operating Temperature .20 DC Electrical Characteristics .21 AC Electrical Characteristics .32 Packaging Information .41 Packaging Dimensions .41 Thermal Impedances .46 Capacitance on Crystal Pins .46 Solder Reflow Peak Temperature .47 Development Tool Selection .48 Software .48 Development Kits .48 Evaluation Tools .48 Device Programmers .49 Accessories (Emulation and Programming) .49 Ordering Information .50 Ordering Code Definitions .51 Document History Page .52 Sales, Solutions, and Legal Information .53 Worldwide Sales and Design Support .53 Products .53 Page 2 of 53 [+] Feedback CY8C27143 CY8C27143, CY8C27243 CY8C27243 CY8C27443 CY8C27443, CY8C27543 CY8C27543, CY8C27643 CY8C27643 PSoC Functional Overview The PSoC family consists of many Programmable System-on-Chip Controller devices. These devices are designed to replace multiple traditional MCU-based system components with one, low cost single-chip programmable device. PSoC devices include configurable blocks of analog and digital logic, as well as programmable interconnects. This architecture allows the user to create customized peripheral configurations that match the requirements of each individual application. Additionally, a fast CPU, Flash program memory, SRAM data memory, and configurable I/O are included in a range of convenient pinouts and packages. Digital System The Digital System is composed of 8 digital PSoC blocks. Each block is an 8-bit resource that can be used alone or combined with other blocks to form 8, 16, 24, and 32-bit peripherals, which are called user modules. Figure 1. Digital System Block Diagram Port 5 To System Bus ToAnalog System Row 0 DBB00 DBB00 DBB01 DBB01 DCB02 DCB02 4 DCB03 DCB03 4 Row Output Configuration Row Input Configuration Digital PSoC Block Array 8 8 Row Input Configuration 8 The M8C CPU core is a powerful processor with speeds up to 24 MHz, providing a four MIPS 8-bit Harvard architecture microprocessor. The CPU utilizes an interrupt controller with 17 vectors, to simplify programming of real time embedded events. Program execution is timed and protected using the included Sleep and Watch Dog Timers (WDT). Row 1 DBB10 DBB10 DBB11 DBB11 DCB12 DCB12 4 DCB13 DCB13 4 GIE[7:0] GIO[7:0] Global Digital Interconnect 8 Row Output Configuration The PSoC Core is a powerful engine that supports a rich feature set. The core includes a CPU, memory, clocks, and configurable GPIO (General Purpose I/O). PSoC GPIOs provide connection to the CPU, digital and analog resources of the device. Each pin's drive mode may be selected from eight options, allowing great flexibility in external interfacing. Every pin also has the capability to generate a system interrupt on high level, low level, and change from last read. Port 0 DIGITAL SYSTEM PSoC Core The PSoC device incorporates flexible internal clock generators, including a 24 MHz IMO (internal main oscillator) accurate to 2.5% over temperature and voltage. The 24 MHz IMO can also be doubled to 48 MHz for use by the digital system. A low power 32 kHz ILO (internal low speed oscillator) is provided for the Sleep timer and WDT. If crystal accuracy is desired, the ECO (32.768 kHz external crystal oscillator) is available for use as a Real Time Clock (RTC) and can optionally generate a crystal-accurate 24 MHz system clock using a PLL. The clocks, together with programmable clock dividers (as a System Resource), provide the flexibility to integrate almost any timing requirement into the PSoC device. Port 1 Port 2 Digital Clocks FromCore The PSoC architecture, as illustrated on the left, is comprised of four main areas: PSoC Core, Digital System, Analog System, and System Resources. Configurable global busing allows all the device resources to be combined into a complete custom system. The PSoC CY8C27x43 family can have up to five I/O ports that connect to the global digital and analog interconnects, providing access to 8 digital blocks and 12 analog blocks. Memory encompasses 16K of Flash for program storage, 256 bytes of SRAM for data storage, and up to 2K of EEPROM emulated using the Flash. Program Flash utilizes four protection levels on blocks of 64 bytes, allowing customized software IP protection. Port 3 Port 4 GOE[7:0] GOO[7:0] Digital peripheral configurations include those listed below. PWMs (8 to 32 bit) PWMs with Dead band (8 to 32 bit) Counters (8 to 32 bit) Timers (8 to 32 bit) UART 8 bit with selectable parity (up to 2) SPI slave and master (up to 2) I2C slave and multi-master (1 available as a System Resource) Cyclical Redundancy Checker/Generator (8 to 32 bit) IrDA (up to 2) Pseudo Random Sequence Generators (8 to 32 bit) The digital blocks can be connected to any GPIO through a series of global buses that can route any signal to any pin. The buses also allow for signal multiplexing and for performing logic operations. This configurability frees your designs from the constraints of a fixed peripheral controller. Digital blocks are provided in rows of four, where the number of blocks varies by PSoC device family. This allows you the optimum choice of system resources for your application. Family resources are shown in the table titled "PSoC Device Characteristics" on page 5. Document Number: 38-12012 Rev. *P Page 3 of 53 [+] Feedback CY8C27143 CY8C27143, CY8C27243 CY8C27243 CY8C27443 CY8C27443, CY8C27543 CY8C27543, CY8C27643 CY8C27643 The Analog System is composed of 12 configurable blocks, each comprised of an opamp circuit allowing the creation of complex analog signal flows. Analog peripherals are very flexible and can be customized to support specific application requirements. Some of the more common PSoC analog functions (most available as user modules) are listed below. Analog-to-digital converters (up to 4, with 6- to 14-bit resolution, selectable as Incremental, Delta Sigma, and SAR) Figure 2. Analog System Block Diagram P0[7] P0[6] P0[5] P0[4] P0[3] P0[2] P0[1] P0[0] AGNDIn RefIn Analog System P2[3] Filters (2, 4, 6, and 8 pole band-pass, low-pass, and notch) Amplifiers (up to 4, with selectable gain to 48x) Instrumentation amplifiers (up to 2, with selectable gain to 93x) DACs (up to 4, with 6- to 9-bit resolution) Multiplying DACs (up to 4, with 6- to 9-bit resolution) High current output drivers (four with 30 mA drive as a Core Resource) P2[4] Comparators (up to 4, with 16 selectable thresholds) P2[1] P2[6] Modulators Correlators ACI0[1:0] ACI1[1:0] ACI2[1:0] ACI3[1:0] Peak detectors Array Input Configuration DTMF Dialer P2[0] 1.3V reference (as a System Resource) P2[2] Many other topologies possible Block Array ACB00 ACB00 ACB01 ACB01 ACB02 ACB02 ACB03 ACB03 ASC10 ASC10 ASD11 ASD11 ASC12 ASC12 ASD13 ASD13 ASD20 ASD20 ASC21 ASC21 ASD22 ASD22 ASC23 ASC23 Analog blocks are provided in columns of three, which includes one CT (Continuous Time) and two SC (Switched Capacitor) blocks, as shown in the figure below. Analog Reference Interface to Digital System RefHi RefLo AGND Reference Generators AGNDIn RefIn Bandgap M8C Interface (Address Bus, Data Bus, Etc.) Document Number: 38-12012 Rev. *P Page 4 of 53 [+] Feedback CY8C27143 CY8C27143, CY8C27243 CY8C27243 CY8C27443 CY8C27443, CY8C27543 CY8C27543, CY8C27643 CY8C27643 Getting Started Additional System Resources System Resources, some of which have been previously listed, provide additional capability useful to complete systems. Additional resources include a multiplier, decimator, switch mode pump, low voltage detection, and power on reset. Statements describing the merits of each system resource are below. Digital clock dividers provide three customizable clock frequencies for use in applications. The clocks can be routed to both the digital and analog systems. Additional clocks can be generated using digital PSoC blocks as clock dividers. Multiply accumulate (MAC) provides fast 8-bit multiplier with 32-bit accumulate, to assist in general math and digital filters. The decimator provides a custom hardware filter for digital signal processing applications including the creation of Delta Sigma ADCs. The I2C module provides 100 and 400 kHz communication over two wires. Slave, master, and multi-master modes are all supported. Low Voltage Detection (LVD) interrupts can signal the application of falling voltage levels, while the advanced POR (Power On Reset) circuit eliminates the need for a system supervisor. An internal 1.3V reference provides an absolute reference for the analog system, including ADCs and DACs. An integrated switch mode pump (SMP) generates normal operating voltages from a single 1.2V battery cell, providing a low cost boost converter. PSoC Device Characteristics The quickest way to understand PSoC silicon is to read this data sheet and then use the PSoC Designer Integrated Development Environment (IDE). This data sheet is an overview of the PSoC integrated circuit and presents specific pin, register, and electrical specifications. For in depth information, along with detailed programming information, see the Technical Reference Manual for this PSoC device. For up to date ordering, packaging, and electrical specification information, see the latest PSoC device data sheets on the web at http//www.cypress.com. Application Notes Application notes are an excellent introduction to the wide variety of possible PSoC designs and are available at http://www.cypress.com. Development Kits PSoC Development Kits are available online from Cypress at http://www.cypress.com and through a growing number of regional and global distributors, which include Arrow, Avnet, Digi-Key, Farnell, Future Electronics, and Newark. Training Free PSoC technical training (on demand, webinars, and workshops) is available online at http://www.cypress.com. The training covers a wide variety of topics and skill levels to assist you in your designs. Analog Inputs Analog Outputs Analog Columns Analog Blocks SRAM Size Flash Size Solutions Library Digital Blocks Table 1. PSoC Device Characteristics Digital Rows CYPros Consultants Digital I/O Depending on your PSoC device characteristics, the digital and analog systems can have 16, 8, or 4 digital blocks and 12, 6, or 4 analog blocks. The following table lists the resources available for specific PSoC device groups.The PSoC device covered by this data sheet is highlighted below. CY8C29x66 up to 64 4 16 12 4 4 12 2K 32K CY8C27x43 up to 44 2 8 12 4 4 12 256 Bytes 16K CY8C24x94 49 1 4 48 2 2 6 1K 16K CY8C24x23 up to 24 1 4 12 2 2 6 256 Bytes 4K CY8C24x23A up to 24 1 4 12 2 2 6 256 Bytes 4K CY8C21x34 up to 28 1 4 28 0 2 4[1] 512 Bytes 8K CY8C21x23 16 1 4 8 0 2 4[2] 256 Bytes 4K CY8C20x34 up to 28 0 0 28 0 0 3[2] 512 Bytes Certified PSoC Consultants offer everything from technical assistance to completed PSoC designs. To contact or become a PSoC Consultant go to http://www.cypress.com and refer to CYPros Consultants. 8K PSoC Part Number Visit our growing library of solution focused designs at http://www.cypress.com. Here you can find various application designs that include firmware and hardware design files that enable you to complete your designs quickly. Technical Support For assistance with technical issues, search KnowledgeBase articles and forums at http://www.cypress.com. If you cannot find an answer to your question, call technical support at 1-800-541-4736. Notes 1. Limited analog functionality. 2. Two analog blocks and one CapSense. Document Number: 38-12012 Rev. *P Page 5 of 53 [+] Feedback CY8C27143 CY8C27143, CY8C27243 CY8C27243 CY8C27443 CY8C27443, CY8C27543 CY8C27543, CY8C27643 CY8C27643 Development Tools PSoC Designer is a Microsoft® Windows-based, integrated development environment for the Programmable System-on-Chip (PSoC) devices. The PSoC Designer IDE runs on Windows XP or Windows Vista. This system provides design database management by project, an integrated debugger with In-Circuit Emulator, in-system programming support, and built in support for third party assemblers and C compilers. PSoC Designer also supports C language compilers developed specifically for the devices in the PSoC family. PSoC Designer Software Subsystems System-Level View A drag-and-drop visual embedded system design environment based on PSoC Express. In the system level view you create a model of your system inputs, outputs, and communication interfaces. You define when and how an output device changes state based upon any or all other system devices. Based upon the design, PSoC Designer automatically selects one or more PSoC Programmable System-on-Chip Controllers that match your system requirements. PSoC Designer generates all embedded code, then compiles and links it into a programming file for a specific PSoC device. Chip-Level View The chip-level view is a more traditional IDE. Choose a base device to work with and then select different onboard analog and digital components called user modules that use the PSoC blocks. Examples of user modules are ADCs, DACs, Amplifiers, and Filters. Configure the user modules for your chosen application and connect them to each other and to the proper pins. Then generate your project. This prepopulates your project with APIs and libraries that you can use to program your application. The device editor also supports easy development of multiple configurations and dynamic reconfiguration. Dynamic configuration allows for changing configurations at run time. Hybrid Designs You can begin in the system-level view, allow it to choose and configure your user modules, routing, and generate code, then switch to the chip-level view to gain complete control over on-chip resources. All views of the project share a common code editor, builder, and common debug, emulation, and programming tools. Document Number: 38-12012 Rev. *P Code Generation Tools PSoC Designer supports multiple third party C compilers and assemblers. The code generation tools work seamlessly within the PSoC Designer interface and have been tested with a full range of debugging tools. The choice is yours. Assemblers. The assemblers allow assembly code to merge seamlessly with C code. Link libraries automatically use absolute addressing or are compiled in relative mode, and linked with other software modules to get absolute addressing. C Language Compilers. C language compilers are available that support the PSoC family of devices. The products allow you to create complete C programs for the PSoC family devices. The optimizing C compilers provide all the features of C tailored to the PSoC architecture. They come complete with embedded libraries providing port and bus operations, standard keypad and display support, and extended math functionality. Debugger The PSoC Designer Debugger subsystem provides hardware in-circuit emulation, allowing you to test the program in a physical system while providing an internal view of the PSoC device. Debugger commands allow the designer to read and program and read and write data memory, read and write I/O registers, read and write CPU registers, set and clear breakpoints, and provide program run, halt, and step control. The debugger also allows the designer to create a trace buffer of registers and memory locations of interest. Online Help System The online help system displays online, context-sensitive help for the user. Designed for procedural and quick reference, each functional subsystem has its own context-sensitive help. This system also provides tutorials and links to FAQs and an Online Support Forum to aid the designer in getting started. In-Circuit Emulator A low cost, high functionality In-Circuit Emulator (ICE) is available for development support. This hardware has the capability to program single devices. The emulator consists of a base unit that connects to the PC by way of a USB port. The base unit is universal and operates with all PSoC devices. Emulation pods for each device family are available separately. The emulation pod takes the place of the PSoC device in the target board and performs full speed (24 MHz) operation. Page 6 of 53 [+] Feedback CY8C27143 CY8C27143, CY8C27243 CY8C27243 CY8C27443 CY8C27443, CY8C27543 CY8C27543, CY8C27643 CY8C27643 Designing with PSoC Designer The development process for the PSoC device differs from that of a traditional fixed function microprocessor. The configurable analog and digital hardware blocks give the PSoC architecture a unique flexibility that pays dividends in managing specification change during development and by lowering inventory costs. These configurable resources, called PSoC Blocks, have the ability to implement a wide variety of user selectable functions. The PSoC development process can be summarized in the following four steps: 1. Select Components 2. Configure Components 3. Organize and Connect 4. Generate, Verify, and Debug Organize and Connect You can build signal chains at the chip level by interconnecting user modules to each other and the I/O pins, or connect system level inputs, outputs, and communication interfaces to each other with valuator functions. In the system-level view, selecting a potentiometer driver to control a variable speed fan driver and setting up the valuators to control the fan speed based on input from the pot selects, places, routes, and configures a programmable gain amplifier (PGA) to buffer the input from the potentiometer, an analog to digital converter (ADC) to convert the potentiometer's output to a digital signal, and a PWM to control the fan. In the chip-level view, perform the selection, configuration, and routing so that you have complete control over the use of all on-chip resources. Select Components Generate, Verify, and Debug Both the system-level and chip-level views provide a library of prebuilt, pretested hardware peripheral components. In the system-level view, these components are called "drivers" and correspond to inputs (a thermistor, for example), outputs (a brushless DC fan, for example), communication interfaces (I2C-bus, for example), and the logic to control how they interact with one another (called valuators). When you are ready to test the hardware configuration or move on to developing code for the project, perform the "Generate Application" step. This causes PSoC Designer to generate source code that automatically configures the device to your specification and provides the software for the system. In the chip-level view, the components are called "user modules". User modules make selecting and implementing peripheral devices simple, and come in analog, digital, and programmable system-on-chip varieties. Configure Components Each of the components you select establishes the basic register settings that implement the selected function. They also provide parameters and properties that allow you to tailor their precise configuration to your particular application. For example, a Pulse Width Modulator (PWM) User Module configures one or more digital PSoC blocks, one for each 8 bits of resolution. The user module parameters permit you to establish the pulse width and duty cycle. Configure the parameters and properties to correspond to your chosen application. Enter values directly or by selecting values from drop-down menus. Both the system-level drivers and chip-level user modules are documented in data sheets that are viewed directly in PSoC Designer. These data sheets explain the internal operation of the component and provide performance specifications. Each data sheet describes the use of each user module parameter or driver property, and other information you may need to successfully implement your design. Document Number: 38-12012 Rev. *P Both system-level and chip-level designs generate software based on your design. The chip-level design provides application programming interfaces (APIs) with high level functions to control and respond to hardware events at run time and interrupt service routines that you can adapt as needed. The system-level design also generates a C main() program that completely controls the chosen application and contains placeholders for custom code at strategic positions allowing you to further refine the software without disrupting the generated code. A complete code development environment allows you to develop and customize your applications in C, assembly language, or both. The last step in the development process takes place inside PSoC Designer's Debugger subsystem. The Debugger downloads the HEX image to the ICE where it runs at full speed. Debugger capabilities rival those of systems costing many times more. In addition to traditional single-step, run-to-breakpoint and watch-variable features, the Debugger provides a large trace buffer and allows you define complex breakpoint events that include monitoring address and data bus values, memory locations and external signals. Page 7 of 53 [+] Feedback CY8C27143 CY8C27143, CY8C27243 CY8C27243 CY8C27443 CY8C27443, CY8C27543 CY8C27543, CY8C27643 CY8C27643 Document Conventions Units of Measure Acronyms Used This table lists the acronyms used in this data sheet. A units of measure table is located in the section Electrical Specifications on page 19. Table 13 on page 19 lists all the abbreviations used to measure the PSoC devices. Table 2. Acronyms Numeric Naming Acronym Description AC alternating current ADC analog-to-digital converter API application programming interface CPU central processing unit CT continuous time DAC digital-to-analog converter DC direct current EEPROM electrically erasable programmable read-only memory FSR full scale range GPIO general purpose I/O ICE in-circuit emulator IDE integrated development environment I/O input/output ISSP in-system serial programming IPOR imprecise power on reset LSb least-significant bit LVD low voltage detect MSb most-significant bit PC program counter PGA programmable gain amplifier POR power on reset PPOR precision power on reset PSoC® Programmable System-on-ChipTM PWM pulse width modulator ROM read only memory SC switched capacitor SMP switch mode pump SRAM Hexadecimal numbers are represented with all letters in uppercase with an appended lowercase `h' (for example, `14h' or `3Ah'). Hexadecimal numbers may also be represented by a `0x' prefix, the C coding convention. Binary numbers have an appended lowercase `b' (for example, 01010100b' or `01000011b'). Numbers not indicated by an `h', `b', or 0x are decimal. static random access memory Document Number: 38-12012 Rev. *P Page 8 of 53 [+] Feedback CY8C27143 CY8C27143, CY8C27243 CY8C27243 CY8C27443 CY8C27443, CY8C27543 CY8C27543, CY8C27643 CY8C27643 Pinouts The CY8C27x43 PSoC device is available in a variety of packages which are listed and illustrated in the following tables. Every port pin (labeled with a "P") is capable of Digital I/O. However, Vss, Vdd, SMP, and XRES are not capable of Digital I/O. 8-Pin Part Pinout Table 3. Pin Definitions - 8-Pin PDIP Type Pin No. Digital Analog Pin Name 1 I/O I/O P0[5] Analog column mux input and column output. 2 I/O I/O P0[3] Analog column mux input and column output. 3 I/O P1[1] Crystal Input (XTALin), I2C Serial Clock (SCL), ISSP-SCLK*. 4 Power 5 I/O 6 I/O 7 I/O Vss 8 Description Figure 3. CY8C27143 CY8C27143 8-Pin PSoC Device A, IO, P0[5] A, IO, P0[3] I2CSCL,XTALin, P1[1] Vss 1 8 2PDIP 7 3 6 4 5 Vdd P0[4], A, IO P0[2], A, IO P1[0],XTALout,I2CSDA Ground connection. P1[0] Crystal Output (XTALout), I2C Serial Data (SDA), ISSP-SDATA*. I/O P0[2] Analog column mux input and column output. I/O P0[4] Analog column mux input and column output. Vdd Supply voltage. Power LEGEND: A = Analog, I = Input, and O = Output. * These are the ISSP pins, which are not High Z at POR (Power On Reset). See the PSoC Programmable System-on-Chip Technical Reference Manual for details. 20-Pin Part Pinout Table 4. Pin Definitions - 20-Pin SSOP, SOIC Type Pin No. Digital Analog Pin Name 1 I/O I P0[7] Analog column mux input. 2 I/O I/O P0[5] Analog column mux input and column output. 3 I/O I/O P0[3] Analog column mux input and column output. 4 I/O I P0[1] Analog column mux input. SMP Switch Mode Pump (SMP) connection to external components required. 5 Power Description 6 I/O P1[7] I2C Serial Clock (SCL). 7 I/O P1[5] I/O I/O P1[1] 1 2 3 4 5 6 7 8 9 10 SSOP SOIC 20 19 18 17 16 15 14 13 12 11 Vdd P0[6], A, I P0[4], A, IO P0[2], A, IO P0[0], A, I XRES P1[6] P1[4],EXTCLK P1[2] P1[0],XTALout,I2CSDA P1[3] 9 A, I, P0[7] A, IO, P0[5] A, IO, P0[3] A, I, P0[1] SMP I2CSCL,P1[7] I2CSDA, P1[5] P1[3] I2CSCL,XTALin, P1[1] Vss I2C Serial Data (SDA). 8 Figure 4. CY8C27243 CY8C27243 20-Pin PSoC Device 10 Power Vss 11 I/O P1[0] 12 I/O I/O P1[4] 14 I/O Ground connection. P1[2] 13 Crystal Input (XTALin), I2C Serial Clock (SCL), ISSP-SCLK*. P1[6] 15 Optional External Clock Input (EXTCLK). XRES Active high external reset with internal pull down. 16 I/O I P0[0] Analog column mux input. 17 I/O I/O P0[2] Analog column mux input and column output. 18 I/O I/O P0[4] Analog column mux input and column output. 19 I/O I P0[6] Analog column mux input. Vdd Supply voltage. 20 Input Crystal Output (XTALout), I2C Serial Data (SDA), ISSP-SDATA*. Power LEGEND: A = Analog, I = Input, and O = Output. * These are the ISSP pins, which are not High Z at POR (Power On Reset). See the PSoC Programmable System-on-Chip Technical Reference Manual for details. Document Number: 38-12012 Rev. *P Page 9 of 53 [+] Feedback CY8C27143 CY8C27143, CY8C27243 CY8C27243 CY8C27443 CY8C27443, CY8C27543 CY8C27543, CY8C27643 CY8C27643 28-Pin Part Pinout Table 5. Pin Definitions - 28-Pin PDIP, SSOP, SOIC Type Digital Analog Pin Name 1 I/O I P0[7] Analog column mux input. 2 I/O I/O P0[5] Analog column mux input and column output. 3 I/O I/O P0[3] Analog column mux input and column output. 4 I/O I P0[1] Analog column mux input. 5 I/O 6 I/O 7 I/O I P2[3] 8 I/O I P2[1] Direct switched capacitor block input. SMP Switch Mode Pump (SMP) connection to external components required. Pin No. 9 Description P2[7] P2[5] Power Direct switched capacitor block input. 10 I/O P1[7] I/O P1[5] I/O I/O P1[1] PDIP SSOP SOIC 28 27 26 25 24 23 22 21 20 19 18 17 16 15 Vdd P0[6], A, I P0[4], A, IO P0[2], A, IO P0[0], A, I P2[6],ExternalVRef P2[4],ExternalAGND P2[2], A, I P2[0], A, I XRES P1[6] P1[4],EXTCLK P1[2] P1[0],XTALout,I2CSDA P1[3] 13 1 2 3 4 5 6 7 8 9 10 11 12 13 14 I2C Serial Data (SDA). 12 A, I, P0[7] A, IO, P0[5] A, IO, P0[3] A, I, P0[1] P2[7] P2[5] A, I, P2[3] A, I, P2[1] SMP I2CSCL,P1[7] I2CSDA, P1[5] P1[3] I2CSCL,XTALin, P1[1] Vss I2C Serial Clock (SCL). 11 Figure 5. CY8C27443 CY8C27443 28-Pin PSoC Device 14 Power Vss 15 I/O P1[0] 16 I/O I/O P1[4] 18 I/O Ground connection. P1[2] 17 Crystal Input (XTALin), I2C Serial Clock (SCL), ISSP-SCLK*. 19 Crystal Output (XTALout), I2C Serial Data (SDA), ISSP-SDATA*. Optional External Clock Input (EXTCLK). P1[6] Input XRES Active high external reset with internal pull down. 20 I/O I P2[0] Direct switched capacitor block input. 21 I/O I P2[2] Direct switched capacitor block input. 22 I/O P2[4] External Analog Ground (AGND). 23 I/O P2[6] External Voltage Reference (VRef). 24 I/O I P0[0] Analog column mux input. 25 I/O I/O P0[2] Analog column mux input and column output. 26 I/O I/O P0[4] Analog column mux input and column output. 27 I/O I P0[6] Analog column mux input. Vdd Supply voltage. 28 Power LEGEND: A = Analog, I = Input, and O = Output. * These are the ISSP pins, which are not High Z at POR (Power On Reset). See the PSoC Programmable System-on-Chip Technical Reference Manual for details. Document Number: 38-12012 Rev. *P Page 10 of 53 [+] Feedback CY8C27143 CY8C27143, CY8C27243 CY8C27243 CY8C27443 CY8C27443, CY8C27543 CY8C27543, CY8C27643 CY8C27643 44-Pin Part Pinout Table 6. Pin Definitions - 44-Pin TQFP I/O I/O I/O I/O I/O I/O I/O I/O 17 18 I/O 19 20 21 22 23 24 25 26 27 28 29 30 31 32 33 34 35 36 37 38 39 40 41 42 43 44 Power P3[7] P3[5] P3[3] P3[1] P1[7] P1[5] P1[3] P1[1] Power Vss P1[0] I/O I/O I/O I/O I/O I/O I/O Input I/O I/O I/O I/O I/O I/O I/O I/O I/O I/O I/O I/O I I I I/O I/O I Power I/O I/O I/O I/O I/O P2[5] P2[3] P2[1] P4[7] P4[5] P4[3] P4[1] SMP I I/O I/O I P1[2] P1[4] P1[6] P3[0] P3[2] P3[4] P3[6] XRES P4[0] P4[2] P4[4] P4[6] P2[0] P2[2] P2[4] P2[6] P0[0] P0[2] P0[4] P0[6] Vdd P0[7] P0[5] P0[3] P0[1] P2[7] Figure 6. CY8C27543 CY8C27543 44-Pin PSoC Device Direct switched capacitor block input. Direct switched capacitor block input. Switch Mode Pump (SMP) connection to external components required. I2C Serial Clock (SCL). I2C Serial Data (SDA). Crystal Input (XTALin), I2C Serial Clock (SCL), ISSP-SCLK*. Ground connection. Crystal Output (XTALout), I2C Serial Data (SDA), ISSP-SDATA*. P2[5] A, I, P2[3] A, I, P2[1] P4[7] P4[5] P4[3] P4[1] SMP P3[7] P3[5] P3[3] P0[6], A, I P0[4], A, IO P0[2], A, IO P0[0], A, I P2[6],ExternalVRef 9 10 11 12 13 14 15 16 I I Description P2[7] P0[1], A, I P0[3], A, IO P0[5], A, IO P0[7], A, I Vdd I/O I/O I/O I/O I/O I/O I/O Pin Name 44 43 42 41 40 39 38 37 36 35 34 1 2 3 4 5 6 7 8 Analog 1 2 3 4 5 6 7 8 9 10 11 TQFP 33 32 31 30 29 28 27 26 25 24 23 12 13 14 15 16 17 18 19 20 21 22 Type Digital P2[4], External AGND P2[2], A, I P2[0], A, I P4[6] P4[4] P4[2] P4[0] XRES P3[6] P3[4] P3[2] P3[1] I2CSCL, P1[7] I2C SDA, P1[5] P1[3] I2CSCL,XTALin,P1[1] Vss I2CSDA,XTALout,P1[0] P1[2] EXTCLK,P1[4] P1[6] P3[0] Pin No. Optional External Clock Input (EXTCLK). Active high external reset with internal pull down. Direct switched capacitor block input. Direct switched capacitor block input. External Analog Ground (AGND). External Voltage Reference (VRef). Analog column mux input. Analog column mux input and column output. Analog column mux input and column output. Analog column mux input. Supply voltage. Analog column mux input. Analog column mux input and column output. Analog column mux input and column output. Analog column mux input. LEGEND: A = Analog, I = Input, and O = Output. * These are the ISSP pins, which are not High Z at POR (Power On Reset). See the PSoC Programmable System-on-Chip Technical Reference Manual for details. Document Number: 38-12012 Rev. *P Page 11 of 53 [+] Feedback CY8C27143 CY8C27143, CY8C27243 CY8C27243 CY8C27443 CY8C27443, CY8C27543 CY8C27543, CY8C27643 CY8C27643 48-Pin Part Pinout Table 7. 48-Pin Part Pinout (SSOP) Pin No. Type Digital Analog Pin Name Description 1 I/O I P0[7] Analog column mux input. 2 I/O I/O P0[5] Analog column mux input and column output. 3 I/O I/O P0[3] Analog column mux input and column output. 4 I/O I P0[1] Analog column mux input. 5 I/O 6 I/O 7 I/O I P2[3] Direct switched capacitor block input. 8 I/O I P2[1] Direct switched capacitor block input. 9 I/O P4[7] 10 I/O P4[5] 11 I/O P4[3] 12 I/O 13 P2[7] P2[5] P4[1] Power SMP Switch Mode Pump (SMP) connection to external components required. 14 I/O P3[7] 15 I/O P3[5] 16 I/O P3[3] 17 I/O P3[1] 18 I/O P5[3] 19 I/O P5[1] 20 I/O P1[7] I2C Serial Clock (SCL). 21 I/O P1[5] I2C Serial Data (SDA). 22 I/O P1[3] 23 I/O P1[1] 24 Power Figure 7. CY8C27643 CY8C27643 48-Pin PSoC Device A, I, P0[7] A, IO, P0[5] A, IO, P0[3] A, I, P0[1] P2[7] P2[5] A, I, P2[3] A, I, P2[1] P4[7] P4[5] P4[3] P4[1] SMP P3[7] P3[5] P3[3] P3[1] P5[3] P5[1] I2CSCL, P1[7] I2CSDA, P1[5] P1[3] I2CSCL,XTALin,P1[1] Vss 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 SSOP 48 47 46 45 44 43 42 41 40 39 38 37 36 35 34 33 32 31 30 29 28 27 26 25 Vdd P0[6], A, I P0[4], A, IO P0[2], A, IO P0[0], A, I P2[6],External VRef P2[4],External AGND P2[2], A, I P2[0], A, I P4[6] P4[4] P4[2] P4[0] XRES P3[6] P3[4] P3[2] P3[0] P5[2] P5[0] P1[6] P1[4],EXTCLK P1[2] P1[0],XTALout,I2C SDA Crystal Input (XTALin), I2C Serial Clock (SCL), ISSP-SCLK*. Vss Ground connection. 25 I/O P1[0] Crystal Output (XTALout), I2C Serial Data (SDA), ISSP-SDATA.* 26 I/O P1[2] 27 I/O P1[4] 28 I/O P1[6] 29 I/O P5[0] 30 I/O P5[2] 31 I/O P3[0] 32 I/O P3[2] 33 I/O P3[4] 34 I/O 35 Optional External Clock Input (EXTCLK). P3[6] Input XRES Active high external reset with internal pull down. 36 I/O P4[0] 37 I/O P4[2] 38 I/O P4[4] 39 I/O 40 I/O I P2[0] 41 I/O I P2[2] Direct switched capacitor block input. 42 I/O P2[4] External Analog Ground (AGND). 43 I/O P2[6] External Voltage Reference (VRef). 44 I/O I P0[0] Analog column mux input. 45 I/O I/O P0[2] Analog column mux input and column output. 46 I/O I/O P0[4] Analog column mux input and column output. 47 I/O I P0[6] Analog column mux input. Vdd Supply voltage. 48 P4[6] Power Direct switched capacitor block input. LEGEND: A = Analog, I = Input, and O = Output. * These are the ISSP pins, which are not High Z at POR (Power On Reset). See the PSoC Mixed-Signal Array Technical Reference Manual for details. Document Number: 38-12012 Rev. *P Page 12 of 53 [+] Feedback CY8C27143 CY8C27143, CY8C27243 CY8C27243 CY8C27443 CY8C27443, CY8C27543 CY8C27543, CY8C27643 CY8C27643 Table 8. 48-Pin Part Pinout (QFN)* Type Pin Name Description Analog 1 I/O I P2[3] Direct switched capacitor block input. 2 I/O I P2[1] Direct switched capacitor block input. 3 I/O P4[7] 4 I/O P4[5] 5 I/O P4[3] 6 I/O Figure 8. CY8C27643 CY8C27643 48-Pin PSoC Device Switch Mode Pump (SMP) connection to external components required. 8 I/O P3[7] 9 I/O P3[5] 10 I/O P3[3] 11 I/O P3[1] 12 I/O P5[3] 13 I/O P5[1] 14 I/O P1[7] I2C Serial Clock (SCL). 15 I/O P1[5] I2C Serial Data (SDA). 16 I/O P1[3] 17 I/O P1[1] 18 Power Crystal Input (XTALin), I2C Serial Clock (SCL), ISSP-SCLK*. Vss Ground connection. 19 I/O P1[0] Crystal Output (XTALout), I2C Serial Data (SDA), ISSP-SDATA*. 20 I/O P1[2] 21 I/O P1[4] 22 I/O P1[6] 23 I/O I/O I/O I/O P3[2] 27 I/O P3[4] 28 I/O P2[4],External AGND P2[2], A, I P2[0], A, I P4[6] P4[4] P4[2] P4[0] XRES P3[6] P3[4] P3[2] P3[0] P3[0] 26 QFN (Top View ) 36 35 34 33 32 31 30 29 28 27 26 25 P5[2] 25 1 2 3 4 5 6 7 8 9 10 11 12 P5[0] 24 A, I, P2[3] A, I, P2[1] P4[7] P4[5] P4[3] P4[1] SMP P3[7] P3[5] P3[3] P3[1] P5[3] 48 47 46 45 44 43 42 41 40 39 38 37 SMP 13 14 I2CSDA,P1[5] 15 P1[3] 16 I2CSCL,XTALin,P1[1] 17 Vss 18 I2CSDA,XTALout,P1[0] 19 P1[2] 20 EXTCLK,P1[4] 21 P1[6] 22 P5[0] 23 P5[2] 24 P4[1] Power P5[1] I2CSCL,P1[7] 7 P2[5] P2[7] P0[1], A,I P0[3], A,IO P0[5], A,IO P0[7], A,I Digital Vdd P0[6], A,I P0[4], A,IO P0[2], A,IO P0[0], A,I P2[6],ExternalVRef Pin No. 29 Optional External Clock Input (EXTCLK). P3[6] Input XRES Active high external reset with internal pull down. 30 I/O P4[0] 31 I/O P4[2] 32 I/O P4[4] 33 I/O 34 I/O I P2[0] Direct switched capacitor block input. 35 I/O I P2[2] Direct switched capacitor block input. 36 I/O P2[4] External Analog Ground (AGND). 37 I/O P2[6] External Voltage Reference (VRef). 38 I/O I P0[0] Analog column mux input. 39 I/O I/O P0[2] Analog column mux input and column output. 40 I/O I/O P0[4] Analog column mux input and column output. 41 I/O I P0[6] Analog column mux input. 42 P4[6] Power Vdd Supply voltage. 43 I/O I P0[7] Analog column mux input. 44 I/O I/O P0[5] Analog column mux input and column output. 45 I/O I/O P0[3] Analog column mux input and column output. 46 I/O I P0[1] Analog column mux input. 47 I/O P2[7] 48 I/O P2[5] LEGEND: A = Analog, I = Input, and O = Output. * The QFN package has a center pad that must be connected to ground (Vss). * These are the ISSP pins, which are not High Z at POR (Power On Reset). See the PSoC Mixed-Signal Array Technical Reference Manual for details. Document Number: 38-12012 Rev. *P Page 13 of 53 [+] Feedback CY8C27143 CY8C27143, CY8C27243 CY8C27243 CY8C27443 CY8C27443, CY8C27543 CY8C27543, CY8C27643 CY8C27643 56-Pin Part Pinout The 56-pin SSOP part is for the CY8C27002 CY8C27002 On-Chip Debug (OCD) PSoC device. Note This part is only used for in-circuit debugging. It is NOT available for production. Table 9. 56-Pin Part Pinout (SSOP) Pin No. Type Digital Analog 1 Pin Name Description NC No connection. 2 I/O I P0[7] Analog column mux input. 3 I/O I P0[5] Analog column mux input and column output. 4 I/O I P0[3] Analog column mux input and column output. 5 I/O I P0[1] Analog column mux input. 6 I/O P2[7] 7 I/O P2[5] 8 I/O I P2[3] Direct switched capacitor block input. 9 I/O I P2[1] Direct switched capacitor block input. 10 I/O P4[7] 11 I/O P4[5] 12 I/O I P4[3] 13 I/O I P4[1] 14 OCD OCDE OCD even data I/O. 15 OCD OCDO OCD odd data output. 16 Power SMP Switch Mode Pump (SMP) connection to required external components. 17 I/O I/O I/O P3[3] 20 I/O P3[1] 21 I/O I/O I/O P1[7] I/O P1[5] 14 15 16 17 I2C SDA, P1[5] NC P1[3] SCLK, I2C SCL, XTALIn, P1[1] Vss 24 25 26 27 28 18 19 20 21 22 23 SSOP 33 32 31 30 29 P5[0] P1[6] P1[4], EXTCLK P1[2] P1[0], XTALOut, I2C SDA, SDATA NC NC I2C Serial Data (SDA). NC OCDE OCDO SMP P3[7] P3[5] P3[3] P3[1] P5[3] P5[1] I2C SCL, P1[7] I2C Serial Clock (SCL). 24 11 12 13 50 49 48 47 46 45 44 43 42 41 40 39 38 37 36 35 34 P5[1] 23 52 51 Vdd P0[6], AI P0[4], AIO P0[2], AIO P0[0], AI P2[6], External VRef P2[4], External AGND P2[2], AI P2[0], AI P4[6] P4[4] P4[2] P4[0] CCLK HCLK XRES P3[6] P3[4] P3[2] P3[0] P5[2] P5[3] 22 P2[5] AI, P2[3] AI, P2[1] P4[7] P4[5] P4[3] P4[1] 56 55 54 53 1 2 3 4 5 6 7 8 9 10 P3[5] 19 NC AI, P0[7] AIO, P0[5] AIO, P0[3] AI, P0[1] P2[7] P3[7] 18 Figure 9. CY8C27002 CY8C27002 56-Pin PSoC Device No connection. 25 Not for Production 26 I/O P1[3] 27 I/O P1[1] Crystal Input (XTALin), I2C Serial Clock (SCL), ISSP-SCLK*. 28 Vdd Supply voltage. 29 Power NC No connection. 30 NC No connection. Crystal Output (XTALout), I2C Serial Data (SDA), ISSP-SDATA*. 31 I/O P1[0] 32 I/O P1[2] 33 I/O P1[4] 34 I/O P1[6] 35 I/O P5[0] 36 I/O P5[2] 37 I/O P3[0] 38 I/O P3[2] 39 I/O P3[4] 40 I/O P3[6] Optional External Clock Input (EXTCLK). Document Number: 38-12012 Rev. *P Page 14 of 53 [+] Feedback CY8C27143 CY8C27143, CY8C27243 CY8C27243 CY8C27443 CY8C27443, CY8C27543 CY8C27543, CY8C27643 CY8C27643 Table 9. 56-Pin Part Pinout (SSOP) Pin No. Type Digital Analog Pin Name Description 42 OCD HCLK OCD high-speed clock output. 43 OCD CCLK OCD CPU clock output. 44 I/O P4[0] 45 I/O P4[2] 46 I/O P4[4] 47 I/O 48 I/O I P2[0] Direct switched capacitor block input. 49 I/O I P2[2] Direct switched capacitor block input. 50 I/O P2[4] External Analog Ground (AGND). 51 I/O P2[6] External Voltage Reference (VRef). 52 I/O I P0[0] Analog column mux input. 53 I/O I P0[2] Analog column mux input and column output. 54 I/O I P0[4] Analog column mux input and column output. 55 I/O 56 P4[6] I Power P0[6] Analog column mux input. Vdd Supply voltage. LEGEND: A = Analog, I = Input, O = Output, and OCD = On-Chip Debug. * These are the ISSP pins, which are not High Z at POR (Power On Reset). See the PSoC Mixed-Signal Array Technical Reference Manual for details. Document Number: 38-12012 Rev. *P Page 15 of 53 [+] Feedback CY8C27143 CY8C27143, CY8C27243 CY8C27243 CY8C27443 CY8C27443, CY8C27543 CY8C27543, CY8C27643 CY8C27643 Register Reference Register Mapping Tables This chapter lists the registers of the CY8C27x43 PSoC device. For detailed register information, reference the PSoC Programmable System-on-Chip Technical Reference Manual. The PSoC device has a total register address space of 512 bytes. The register space is referred to as I/O space and is divided into two banks. The XOI bit in the Flag register (CPU_F) determines which bank the user is currently in. When the XOI bit is set the user is in Bank 1. Register Conventions Note In the following register mapping tables, blank fields are reserved and must not be accessed. The register conventions specific to this section are listed in the following table. Table 10. Register Conventions Convention Description R Read register or bit(s) W Write register or bit(s) L Logical register or bit(s) C Clearable register or bit(s) # Access is bit specific Table 11. Register Map Bank 0 Table: User Space INT_CLR3 INT_MSK3 INT_MSK0 INT_MSK1 INT_VC RES_WDT DEC_DH DEC_DL C0 C1 C2 C3 C4 C5 C6 C7 C8 C9 CA CB CC CD CE CF D0 D1 D2 D3 D4 D5 D6 D7 D8 D9 DA DB DC DD DE DF E0 E1 E2 E3 E4 E5 Access I2C_CFG I2C_SCR I2C_DR I2C_MSCR INT_CLR0 INT_CLR1 Addr (0,Hex) RW # # RW RW RW RW RW RW RW RW RW RW RW RW RW RW RW RW RW RW RW RW RW RW RW RW RW RW RW RW RW RW RW RW Name RW 80 81 82 83 84 85 86 87 88 89 8A 8B 8C 8D 8E 8F 90 91 92 93 94 95 96 97 98 99 9A 9B 9C 9D 9E 9F A0 A1 A2 A3 A4 A5 # Access is bit specific. Access ASC10CR0 ASC10CR0 ASC10CR1 ASC10CR1 ASC10CR2 ASC10CR2 ASC10CR3 ASC10CR3 ASD11CR0 ASD11CR0 ASD11CR1 ASD11CR1 ASD11CR2 ASD11CR2 ASD11CR3 ASD11CR3 ASC12CR0 ASC12CR0 ASC12CR1 ASC12CR1 ASC12CR2 ASC12CR2 ASC12CR3 ASC12CR3 ASD13CR0 ASD13CR0 ASD13CR1 ASD13CR1 ASD13CR2 ASD13CR2 ASD13CR3 ASD13CR3 ASD20CR0 ASD20CR0 ASD20CR1 ASD20CR1 ASD20CR2 ASD20CR2 ASD20CR3 ASD20CR3 ASC21CR0 ASC21CR0 ASC21CR1 ASC21CR1 ASC21CR2 ASC21CR2 ASC21CR3 ASC21CR3 ASD22CR0 ASD22CR0 ASD22CR1 ASD22CR1 ASD22CR2 ASD22CR2 ASD22CR3 ASD22CR3 ASC23CR0 ASC23CR0 ASC23CR1 ASC23CR1 ASC23CR2 ASC23CR2 ASC23CR3 ASC23CR3 Addr (0,Hex) 40 41 42 43 44 45 46 47 48 49 4A 4B 4C 4D 4E 4F 50 51 52 53 54 55 56 57 58 59 5A 5B 5C 5D 5E 5F 60 61 62 63 64 65 Name Document Number: 38-12012 Rev. *P Access 00 RW 01 RW 02 RW 03 RW 04 RW 05 RW 06 RW 07 RW 08 RW 09 RW 0A RW 0B RW 0C RW 0D RW 0E RW 0F RW 10 RW 11 RW 12 RW 13 RW 14 RW 15 RW 16 RW 17 RW 18 19 1A 1B 1C 1D 1E 1F DBB00DR0 DBB00DR0 20 # AMX_IN DBB00DR1 DBB00DR1 21 W DBB00DR2 DBB00DR2 22 RW DBB00CR0 DBB00CR0 23 # ARF_CR DBB01DR0 DBB01DR0 24 # CMP_CR0 DBB01DR1 DBB01DR1 25 W ASY_CR Blank fields are Reserved and must not be accessed. Addr (0,Hex) Name Access Addr (0,Hex) Name PRT0DR PRT0IE PRT0GS PRT0DM2 PRT1DR PRT1IE PRT1GS PRT1DM2 PRT2DR PRT2IE PRT2GS PRT2DM2 PRT3DR PRT3IE PRT3GS PRT3DM2 PRT4DR PRT4IE PRT4GS PRT4DM2 PRT5DR PRT5IE PRT5GS PRT5DM2 RW # RW # RW RW RW RW RW RW RC W RC RC Page 16 of 53 [+] Feedback CY8C27143 CY8C27143, CY8C27243 CY8C27243 CY8C27443 CY8C27443, CY8C27543 CY8C27543, CY8C27643 CY8C27643 Table 11. Register Map Bank 0 Table: User Space (continued) RW RW RW RW RW RW RW CPU_F RW RW RW RW RW RW RW CPU_SCR1 CPU_SCR0 Access DEC_CR0 DEC_CR1 MUL_X MUL_Y MUL_DH MUL_DL ACC_DR1 ACC_DR0 ACC_DR3 ACC_DR2 Addr (0,Hex) RW RW RW RW RW RW RW RW RW RW RW RW RW RW RW RW Name A6 A7 A8 A9 AA AB AC AD AE AF RDI0RI B0 RDI0SYN B1 RDI0IS B2 RDI0LT0 B3 RDI0LT1 B4 RDI0RO0 B5 RDI0RO1 B6 B7 RDI1RI B8 RDI1SYN B9 RDI1IS BA RDI1LT0 BB RDI1LT1 BC RDI1RO0 BD RDI1RO1 BE BF # Access is bit specific. Access RW Addr (0,Hex) 66 67 68 69 6A 6B 6C 6D 6E 6F 70 71 72 73 74 75 76 77 78 79 7A 7B 7C 7D 7E 7F Name Access Addr (0,Hex) Name Access Addr (0,Hex) Name DBB01DR2 DBB01DR2 26 RW CMP_CR1 DBB01CR0 DBB01CR0 27 # DCB02DR0 DCB02DR0 28 # DCB02DR1 DCB02DR1 29 W DCB02DR2 DCB02DR2 2A RW DCB02CR0 DCB02CR0 2B # DCB03DR0 DCB03DR0 2C # DCB03DR1 DCB03DR1 2D W DCB03DR2 DCB03DR2 2E RW DCB03CR0 DCB03CR0 2F # DBB10DR0 DBB10DR0 30 # ACB00CR3 ACB00CR3 DBB10DR1 DBB10DR1 31 W ACB00CR0 ACB00CR0 DBB10DR2 DBB10DR2 32 RW ACB00CR1 ACB00CR1 DBB10CR0 DBB10CR0 33 # ACB00CR2 ACB00CR2 DBB11DR0 DBB11DR0 34 # ACB01CR3 ACB01CR3 DBB11DR1 DBB11DR1 35 W ACB01CR0 ACB01CR0 DBB11DR2 DBB11DR2 36 RW ACB01CR1 ACB01CR1 DBB11CR0 DBB11CR0 37 # ACB01CR2 ACB01CR2 DCB12DR0 DCB12DR0 38 # ACB02CR3 ACB02CR3 DCB12DR1 DCB12DR1 39 W ACB02CR0 ACB02CR0 DCB12DR2 DCB12DR2 3A RW ACB02CR1 ACB02CR1 DCB12CR0 DCB12CR0 3B # ACB02CR2 ACB02CR2 DCB13DR0 DCB13DR0 3C # ACB03CR3 ACB03CR3 DCB13DR1 DCB13DR1 3D W ACB03CR0 ACB03CR0 DCB13DR2 DCB13DR2 3E RW ACB03CR1 ACB03CR1 DCB13CR0 DCB13CR0 3F # ACB03CR2 ACB03CR2 Blank fields are Reserved and must not be accessed. E6 E7 E8 E9 EA EB EC ED EE EF F0 F1 F2 F3 F4 F5 F6 F7 F8 F9 FA FB FC FD FE FF RW RW W W R R RW RW RW RW RL # # Table 12. Register Map Bank 1 Table: Configuration Space C0 C1 C2 C3 C4 C5 C6 C7 C8 C9 CA CB CC CD CE CF D0 D1 D2 D3 D4 D5 D6 D7 D8 D9 DA DB Access GDI_O_IN GDI_E_IN GDI_O_OU GDI_E_OU Addr (1,Hex) RW RW RW RW RW RW RW RW RW RW RW RW RW RW RW RW RW RW RW RW RW RW RW RW RW RW RW RW Name ASC10CR0 ASC10CR0 80 ASC10CR1 ASC10CR1 81 ASC10CR2 ASC10CR2 82 ASC10CR3 ASC10CR3 83 ASD11CR0 ASD11CR0 84 ASD11CR1 ASD11CR1 85 ASD11CR2 ASD11CR2 86 ASD11CR3 ASD11CR3 87 ASC12CR0 ASC12CR0 88 ASC12CR1 ASC12CR1 89 ASC12CR2 ASC12CR2 8A ASC12CR3 ASC12CR3 8B ASD13CR0 ASD13CR0 8C ASD13CR1 ASD13CR1 8D ASD13CR2 ASD13CR2 8E ASD13CR3 ASD13CR3 8F ASD20CR0 ASD20CR0 90 ASD20CR1 ASD20CR1 91 ASD20CR2 ASD20CR2 92 ASD20CR3 ASD20CR3 93 ASC21CR0 ASC21CR0 94 ASC21CR1 ASC21CR1 95 ASC21CR2 ASC21CR2 96 ASC21CR3 ASC21CR3 97 ASD22CR0 ASD22CR0 98 ASD22CR1 ASD22CR1 99 ASD22CR2 ASD22CR2 9A ASD22CR3 ASD22CR3 9B # Access is bit specific. Access Addr (1,Hex) Name Document Number: 38-12012 Rev. *P 40 41 42 43 44 45 46 47 48 49 4A 4B 4C 4D 4E 4F 50 51 52 53 54 55 56 57 58 59 5A 5B Access 00 RW 01 RW 02 RW 03 RW 04 RW 05 RW 06 RW 07 RW 08 RW 09 RW 0A RW 0B RW 0C RW 0D RW 0E RW 0F RW 10 RW 11 RW 12 RW 13 RW 14 RW 15 RW 16 RW 17 RW 18 19 1A 1B Blank fields are Reserved and must not be accessed. Addr (1,Hex) Name Access Addr (1,Hex) Name PRT0DM0 PRT0DM1 PRT0IC0 PRT0IC1 PRT1DM0 PRT1DM1 PRT1IC0 PRT1IC1 PRT2DM0 PRT2DM1 PRT2IC0 PRT2IC1 PRT3DM0 PRT3DM1 PRT3IC0 PRT3IC1 PRT4DM0 PRT4DM1 PRT4IC0 PRT4IC1 PRT5DM0 PRT5DM1 PRT5IC0 PRT5IC1 RW RW RW RW Page 17 of 53 [+] Feedback CY8C27143 CY8C27143, CY8C27243 CY8C27243 CY8C27443 CY8C27443, CY8C27543 CY8C27543, CY8C27643 CY8C27643 Table 12. Register Map Bank 1 Table: Configuration Space (continued) IMO_TR ILO_TR BDG_TR ECO_TR RW RW RW RW RW RW RW CPU_F RW RW RW RW RW RW RW CPU_SCR1 CPU_SCR0 Access RW RW RW RW RW RW RW RW RW RW RW RW RW RW RW RW OSC_GO_EN OSC_CR4 OSC_CR3 OSC_CR0 OSC_CR1 OSC_CR2 VLT_CR VLT_CMP Addr (1,Hex) RW RW RW RW RW RW RW RW Name RW RW RW RW 9C 9D 9E 9F A0 A1 A2 A3 A4 A5 A6 A7 A8 A9 AA AB AC AD AE AF RDI0RI B0 RDI0SYN B1 RDI0IS B2 RDI0LT0 B3 RDI0LT1 B4 RDI0RO0 B5 RDI0RO1 B6 B7 RDI1RI B8 RDI1SYN B9 RDI1IS BA RDI1LT0 BB RDI1LT1 BC RDI1RO0 BD RDI1RO1 BE BF # Access is bit specific. Access ASC23CR0 ASC23CR0 ASC23CR1 ASC23CR1 ASC23CR2 ASC23CR2 ASC23CR3 ASC23CR3 Addr (1,Hex) 5C 5D 5E 5F 60 61 62 63 64 65 66 67 68 69 6A 6B 6C 6D 6E 6F 70 71 72 73 74 75 76 77 78 79 7A 7B 7C 7D 7E 7F Name Access Document Number: 38-12012 Rev. *P Addr (1,Hex) Name Access Addr (1,Hex) Name 1C 1D 1E 1F DBB00FN DBB00FN 20 RW CLK_CR0 DBB00IN DBB00IN 21 RW CLK_CR1 DBB00OU DBB00OU 22 RW ABF_CR0 23 AMD_CR0 DBB01FN DBB01FN 24 RW DBB01IN DBB01IN 25 RW DBB01OU DBB01OU 26 RW AMD_CR1 27 ALT_CR0 DCB02FN DCB02FN 28 RW ALT_CR1 DCB02IN DCB02IN 29 RW CLK_CR2 DCB02OU DCB02OU 2A RW 2B DCB03FN DCB03FN 2C RW DCB03IN DCB03IN 2D RW DCB03OU DCB03OU 2E RW 2F DBB10FN DBB10FN 30 RW ACB00CR3 ACB00CR3 DBB10IN DBB10IN 31 RW ACB00CR0 ACB00CR0 DBB10OU DBB10OU 32 RW ACB00CR1 ACB00CR1 33 ACB00CR2 ACB00CR2 DBB11FN DBB11FN 34 RW ACB01CR3 ACB01CR3 DBB11IN DBB11IN 35 RW ACB01CR0 ACB01CR0 DBB11OU DBB11OU 36 RW ACB01CR1 ACB01CR1 37 ACB01CR2 ACB01CR2 DCB12FN DCB12FN 38 RW ACB02CR3 ACB02CR3 DCB12IN DCB12IN 39 RW ACB02CR0 ACB02CR0 DCB12OU DCB12OU 3A RW ACB02CR1 ACB02CR1 3B ACB02CR2 ACB02CR2 DCB13FN DCB13FN 3C RW ACB03CR3 ACB03CR3 DCB13IN DCB13IN 3D RW ACB03CR0 ACB03CR0 DCB13OU DCB13OU 3E RW ACB03CR1 ACB03CR1 3F ACB03CR2 ACB03CR2 Blank fields are Reserved and must not be accessed. DC DD DE DF E0 E1 E2 E3 E4 E5 E6 E7 E8 E9 EA EB EC ED EE EF F0 F1 F2 F3 F4 F5 F6 F7 F8 F9 FA FB FC FD FE FF RW RW RW RW RW RW RW R W W RW W RL # # Page 18 of 53 [+] Feedback CY8C27143 CY8C27143, CY8C27243 CY8C27243 CY8C27443 CY8C27443, CY8C27543 CY8C27543, CY8C27643 CY8C27643 Electrical Specifications This chapter presents the DC and AC electrical specifications of the CY8C27x43 PSoC device. For the most up to date electrical specifications, confirm that you have the most recent data sheet by going to the web at http://www.cypress.com. Specifications are valid for -40°C TA 85°C and TJ 100°C, except where noted. Specifications for devices running at greater than 12 MHz are valid for -40°C TA 70°C and TJ 82°C. Figure 10. Voltage versus CPU Frequency 5.25 O Vdd Voltage l id g Va atin n r pe gio Re 4.75 3.00 93 kHz CPU Fre que ncy 12 MHz 24 MHz The following table lists the units of measure that are used in this chapter. Table 13. Units of Measure Symbol Unit of Measure Symbol Unit of Measure oC degree Celsius W microwatts dB decibels mA milli-ampere fF femto farad ms milli-second Hz hertz mV milli-volts KB 1024 bytes nA nanoampere Kbit 1024 bits ns nanosecond kHz kilohertz nV nanovolts k kilohm W ohm MHz megahertz pA picoampere M megaohm pF picofarad A microampere pp peak-to-peak F microfarad H microhenry ps picosecond s microsecond sps samples per second V microvolts s sigma: one standard deviation microvolts root-mean-square V volts Vrms Document Number: 38-12012 Rev. *P ppm parts per million Page 19 of 53 [+] Feedback CY8C27143 CY8C27143, CY8C27243 CY8C27243 CY8C27443 CY8C27443, CY8C27543 CY8C27543, CY8C27643 CY8C27643 Absolute Maximum Ratings Exceeding maximum ratings may shorten the useful life of the device. User guidelines are not tested. Table 14. Absolute Maximum Ratings Symbol TSTG Description Storage Temperature TBAKETEMP Bake Temperature Min Typ Max Unit -55 25 +100 o - 125 See package label o See package label - 72 Notes Hours C Higher storage temperatures reduce data retention time. Recommended storage temperature is +25°C ± 25°C. Extended duration storage temperatures above 65oC degrade reliability. C TBAKETIME Bake Time TA Ambient Temperature with Power Applied -40 ­ +85 oC Vdd Supply Voltage on Vdd Relative to Vss -0.5 ­ +6.0 V VIO DC Input Voltage Vss- 0.5 ­ Vdd + 0.5 V VIOZ DC Voltage Applied to Tristate Vss - 0.5 ­ Vdd + 0.5 V IMIO Maximum Current into any Port Pin -25 ­ +50 mA IMAIO Maximum Current into any Port Pin Configured as Analog Driver -50 ­ +50 mA ESD Electro Static Discharge Voltage 2000 ­ ­ V LU Latch up Current ­ ­ 200 mA Min -40 -40 Typ ­ ­ Human Body Model ESD. Operating Temperature Table 15. Operating Temperature Symbol TA TJ Description Ambient Temperature Junction Temperature Document Number: 38-12012 Rev. *P Max +85 +100 Unit oC o C Notes The temperature rise from ambient to junction is package specific. See "Thermal Impedances" on page 48. The user must limit the power consumption to comply with this requirement. Page 20 of 53 [+] Feedback CY8C27143 CY8C27143, CY8C27243 CY8C27243 CY8C27443 CY8C27443, CY8C27543 CY8C27543, CY8C27643 CY8C27643 DC Electrical Characteristics DC Chip-Level Specifications The following table lists guaranteed maximum and minimum specifications for the voltage and temperature ranges: 4.75V to 5.25V and -40°C TA 85°C, or 3.0V to 3.6V and -40°C TA 85°C, respectively. Typical parameters apply to 5V and 3.3V at 25°C and are for design guidance only. Table 16. DC Chip-Level Specifications Symbol Description Vdd Supply Voltage IDD Supply Current Min 3.00 ­ Typ ­ 5 Max 5.25 8 Unit V mA IDD3 Supply Current ­ 3.3 6.0 mA ISB Sleep (Mode) Current with POR, LVD, Sleep Timer, and WDT.[3] ­ 3 6.5 A ISBH Sleep (Mode) Current with POR, LVD, Sleep Timer, and WDT at high temperature.[3] ­ 4 25 A ISBXTL Sleep (Mode) Current with POR, LVD, Sleep Timer, WDT, and external crystal.[3] ­ 4 7.5 A ISBXTLH Sleep (Mode) Current with POR, LVD, Sleep Timer, WDT, and external crystal at high temperature.[3] VREF Reference Voltage (Bandgap) for Silicon A [4] VREF Reference Voltage (Bandgap) for Silicon B [4] ­ 5 26 A 1.275 1.280 1.300 1.300 1.325 1.320 V V Notes Conditions are Vdd = 5.0V, TA = 25 oC, CPU = 3 MHz, SYSCLK doubler disabled. VC1 = 1.5 MHz, VC2 = 93.75 kHz, VC3 = 93.75 kHz. Conditions are Vdd = 3.3V, TA = 25 oC, CPU = 3 MHz, SYSCLK doubler disabled. VC1 = 1.5 MHz, VC2 = 93.75 kHz, VC3 = 93.75 kHz. Conditions are with internal slow speed oscillator, Vdd = 3.3V, -40 oC TA 55 oC. Conditions are with internal slow speed oscillator, Vdd = 3.3V, 55 oC < TA 85 oC. Conditions are with properly loaded, 1 W max, 32.768 kHz crystal. Vdd = 3.3V, -40 oC TA 55 oC. Conditions are with properly loaded, 1 W max, 32.768 kHz crystal. Vdd = 3.3V, 55 oC < TA 85 oC. Trimmed for appropriate Vdd. Trimmed for appropriate Vdd. DC General Purpose I/O Specifications The following table lists guaranteed maximum and minimum specifications for the voltage and temperature ranges: 4.75V to 5.25V and -40°C TA 85°C, or 3.0V to 3.6V and -40°C TA 85°C, respectively. Typical parameters apply to 5V and 3.3V at 25°C and are for design guidance only. Table 17. DC GPIO Specifications Symbol Description Pull up Resistor RPU Pull down Resistor RPD High Output Level VOH VOL Low Output Level Min 4 4 Vdd 1.0 Typ 5.6 5.6 ­ Max 8 8 ­ Unit k k V ­ ­ 0.75 V Notes IOH = 10 mA, Vdd = 4.75 to 5.25V (8 total loads, 4 on even port pins (for example, P0[2], P1[4]), 4 on odd port pins (for example, P0[3], P1[5]). IOL = 25 mA, Vdd = 4.75 to 5.25V (8 total loads, 4 on even port pins (for example, P0[2], P1[4]), 4 on odd port pins (for example, P0[3], P1[5]). Notes 3. Standby current includes all functions (POR, LVD, WDT, Sleep Time) needed for reliable system operation. This must be compared with devices that have similar functions enabled. 4. Refer to the "Ordering Information" on page 51. Document Number: 38-12012 Rev. *P Page 21 of 53 [+] Feedback CY8C27143 CY8C27143, CY8C27243 CY8C27243 CY8C27443 CY8C27443, CY8C27543 CY8C27543, CY8C27643 CY8C27643 Table 17. DC GPIO Specifications (continued) Symbol Description IOH High Level Source Current Min 10 Typ ­ Max ­ Unit mA IOL Low Level Sink Current 25 ­ ­ mA VIL VIH VH IIL CIN Input Low Level Input High Level Input Hysterisis Input Leakage (Absolute Value) Capacitive Load on Pins as Input ­ 2.1 ­ ­ ­ ­ ­ 60 1 3.5 0.8 ­ ­ 10 V V mV nA pF COUT Capacitive Load on Pins as Output ­ 3.5 10 pF Notes VOH = Vdd-1.0V, see the limitations of the total current in the note for VOH VOL = 0.75V, see the limitations of the total current in the note for VOL Vdd = 3.0 to 5.25 Vdd = 3.0 to 5.25 Gross tested to 1 A. Package and pin dependent. Temp = 25oC. Package and pin dependent. Temp = 25oC. DC Operational Amplifier Specifications The following tables list guaranteed maximum and minimum specifications for the voltage and temperature ranges: 4.75V to 5.25V and -40°C TA 85°C, or 3.0V to 3.6V and -40°C TA 85°C, respectively. Typical parameters apply to 5V and 3.3V at 25°C and are for design guidance only. The Operational Amplifier is a component of both the Analog Continuous Time PSoC blocks and the Analog Switched Cap PSoC blocks. The guaranteed specifications are measured in the Analog Continuous Time PSoC block. Typical parameters apply to 5V at 25°C and are for design guidance only. Table 18. 5V DC Operational Amplifier Specifications Symbol VOSOA Description Input Offset Voltage (absolute value) Power = Low, Opamp Bias = High Power = Medium, Opamp Bias = High Power = High, Opamp Bias = High TCVOSOA Average Input Offset Voltage Drift Input Leakage Current (Port 0 Analog Pins) IEBOA CINOA Input Capacitance (Port 0 Analog Pins) VCMOA Common Mode Voltage Range Common Mode Voltage Range (high power or high opamp bias) Min Typ Max Unit ­ ­ ­ ­ ­ ­ 1.6 1.3 1.2 10 8 7.5 mV mV mV 7.0 20 4.5 35.0 ­ 9.5 0.0 0.5 ­ ­ Vdd Vdd - 0.5 ­ ­ ­ ­ ­ ­ ­ ­ ­ ­ V V V ­ ­ ­ 0.2 0.2 0.5 V V V CMRROA Common Mode Rejection Ratio 60 Power = Low 60 Power = Medium 60 Power = High GOLOA Open Loop Gain Power = Low 60 Power = Medium 60 Power = High 80 VOHIGHOA High Output Voltage Swing (internal signals) Power = Low Vdd - 0.2 Power = Medium Vdd - 0.2 Power = High Vdd - 0.5 VOLOWOA Low Output Voltage Swing (internal signals) Power = Low ­ Power = Medium ­ Power = High ­ Document Number: 38-12012 Rev. *P Notes V/oC pA Gross tested to 1 A. pF Package and pin dependent. Temp = 25oC. V The common-mode input voltage V range is measured through an analog output buffer. The specification includes the limitations imposed by the characteristics of the analog output buffer. dB Specification is applicable at high power. For all other bias modes (except high power, high opamp bias), minimum is 60 dB. dB Specification is applicable at high power. For all other bias modes (except high power, high opamp bias), minimum is 60 dB. Page 22 of 53 [+] Feedback CY8C27143 CY8C27143, CY8C27243 CY8C27243 CY8C27443 CY8C27443, CY8C27543 CY8C27543, CY8C27643 CY8C27643 Table 18. 5V DC Operational Amplifier Specifications (continued) Symbol ISOA PSRROA Description Supply Current (including associated AGND buffer) Power = Low, Opamp Bias = Low Power = Low, Opamp Bias = High Power = Medium, Opamp Bias = Low Power = Medium, Opamp Bias = High Power = High, Opamp Bias = Low Power = High, Opamp Bias = High Supply Voltage Rejection Ratio Min Typ Max Unit ­ ­ ­ ­ ­ ­ 150 300 600 1200 2400 4600 200 400 800 1600 3200 6400 A A A A A A 60 ­ ­ dB Notes Vss VIN (Vdd - 2.25) or (Vdd - 1.25V) VIN Vdd. Table 19. 3.3V DC Operational Amplifier Specifications Symbol Min Typ Max Unit ­ ­ 1.65 1.32 10 8 mV mV TCVOSOA Average Input Offset Voltage Drift ­ 7.0 35.0 V/oC IEBOA Input Leakage Current (Port 0 Analog Pins) ­ 20 ­ pA Gross tested to 1 A. CINOA Input Capacitance (Port 0 Analog Pins) ­ 4.5 9.5 pF Package and pin dependent. Temp = 25oC. VCMOA Common Mode Voltage Range 0.2 ­ Vdd - 0.2 V The common-mode input voltage range is measured through an analog output buffer. The specification includes the limitations imposed by the characteristics of the analog output buffer. CMRROA Common Mode Rejection Ratio Power = Low Power = Medium Power = High 50 50 50 ­ ­ ­ ­ ­ ­ dB dB dB Specification is applicable at high power. For all other bias modes (except high power, high opamp bias), minimum is 60 dB. GOLOA Open Loop Gain Power = Low Power = Medium Power = High 60 60 80 ­ ­ ­ ­ ­ ­ dB dB dB Specification is applicable at high power. For all other bias modes (except high power, high opamp bias), minimum is 60 dB. Vdd - 0.2 Vdd - 0.2 Vdd - 0.2 ­ ­ ­ ­ ­ ­ V V V VOSOA Description Input Offset Voltage (absolute value) Power = Low, Opamp Bias = High Power = Medium, Opamp Bias = High High Power is 5 Volts Only VOHIGHOA High Output Voltage Swing (internal signals) Power = Low Power = Medium Power = High is 5V only Document Number: 38-12012 Rev. *P Notes Page 23 of 53 [+] Feedback CY8C27143 CY8C27143, CY8C27243 CY8C27243 CY8C27443 CY8C27443, CY8C27543 CY8C27543, CY8C27643 CY8C27643 Table 19. 3.3V DC Operational Amplifier Specifications (continued) Symbol Description Min Typ Max Unit ­ ­ ­ ­ ­ ­ 0.2 0.2 0.2 V V V Supply Current (including associated AGND buffer) Power = Low, Opamp Bias = Low Power = Low, Opamp Bias = High Power = Medium, Opamp Bias = Low Power = Medium, Opamp Bias = High Power = High, Opamp Bias = Low Power = High, Opamp Bias = High ­ ­ ­ ­ ­ ­ 150 300 600 1200 2400 4600 200 400 800 1600 3200 6400 A A A A A A Supply Voltage Rejection Ratio 50 80 ­ dB VOLOWOA Low Output Voltage Swing (internal signals) Power = Low Power = Medium Power = High ISOA PSRROA Notes Vss VIN (Vdd - 2.25) or (Vdd - 1.25V) VIN Vdd. DC Low Power Comparator Specifications The following table lists guaranteed maximum and minimum specifications for the voltage and temperature ranges: 4.75V to 5.25V and -40°C TA 85°C, 3.0V to 3.6V and -40°C TA 85°C, or 2.4V to 3.0V and -40°C TA 85°C, respectively. Typical parameters apply to 5V at 25°C and are for design guidance only. Table 20. DC Low Power Comparator Specifications Symbol VREFLPC ISLPC VOSLPC Description Low power comparator (LPC) reference voltage range LPC supply current LPC voltage offset Min 0.2 Typ ­ Max Vdd - 1 Unit V ­ ­ 10 2.5 40 30 A mV DC Analog Output Buffer Specifications The following tables list guaranteed maximum and minimum specifications for the voltage and temperature ranges: 4.75V to 5.25V and -40°C TA 85°C, or 3.0V to 3.6V and -40°C TA 85°C, respectively. Typical parameters apply to 5V and 3.3V at 25°C and are for design guidance only. Table 21. 5V DC Analog Output Buffer Specifications Symbol VOSOB TCVOSOB VCMOB ROUTOB VOHIGHOB VOLOWOB ISOB PSRROB IOMAX Description Min Input Offset Voltage (Absolute Value) ­ Average Input Offset Voltage Drift ­ Common-Mode Input Voltage Range 0.5 Output Resistance Power = Low ­ Power = High ­ High Output Voltage Swing (Load = 32 ohms to Vdd/2) Power = Low 0.5 x Vdd + 1.3 Power = High 0.5 x Vdd + 1.3 Low Output Voltage Swing (Load = 32 ohms to Vdd/2) Power = Low ­ Power = High ­ Supply Current Including Bias Cell (No Load) ­ Power = Low ­ Power = High Supply Voltage Rejection Ratio 60 Maximum Output Current ­ Document Number: 38-12012 Rev. *P Typ 3 +6 ­ Max 12 ­ Vdd - 1.0 Unit mV V/°C V 1 1 ­ ­ W W ­ ­ ­ ­ V V ­ ­ 0.5 x Vdd - 1.3 0.5 x Vdd - 1.3 V V 1.1 2.6 64 40 5.1 8.8 ­ ­ mA mA dB mA Page 24 of 53 [+] Feedback CY8C27143 CY8C27143, CY8C27243 CY8C27243 CY8C27443 CY8C27443, CY8C27543 CY8C27543, CY8C27643 CY8C27643 Table 22. 3.3V DC Analog Output Buffer Specifications Symbol VOSOB TCVOSOB VCMOB ROUTOB VOHIGHOB VOLOWOB ISOB PSRROB Description Min Input Offset Voltage (Absolute Value) ­ Average Input Offset Voltage Drift ­ Common-Mode Input Voltage Range 0.5 Output Resistance Power = Low ­ Power = High ­ High Output Voltage Swing (Load = 1k ohms to Vdd/2) Power = Low 0.5 x Vdd + 1.0 Power = High 0.5 x Vdd + 1.0 Low Output Voltage Swing (Load = 1k ohms to Vdd/2) Power = Low ­ Power = High ­ Supply Current Including Bias Cell (No Load) Power = Low Power = High ­ Supply Voltage Rejection Ratio 60 Typ 3 +6 - Max 12 ­ Vdd - 1.0 Units mV V/°C V 1 1 ­ ­ W W ­ ­ ­ ­ V V ­ ­ 0.5 x Vdd - 1.0 0.5 x Vdd - 1.0 V V 0.8 2.0 64 2.0 4.3 ­ mA mA dB DC Switch Mode Pump Specifications The following table lists guaranteed maximum and minimum specifications for the voltage and temperature ranges: 4.75V to 5.25V and -40°C TA 85°C, or 3.0V to 3.6V and -40°C TA 85°C, respectively. Typical parameters apply to 5V and 3.3V at 25°C and are for design guidance only. Table 23. DC Switch Mode Pump (SMP) Specifications Min Typ Max Unit Notes VPUMP 5V Symbol 5V Output Voltage Description 4.75 5.0 5.25 V Configuration of footnote.[5] Average, neglecting ripple. SMP trip voltage is set to 5.0V. VPUMP 3V 3V Output Voltage 3.00 3.25 3.60 V Configuration of footnote.[5] Average, neglecting ripple. SMP trip voltage is set to 3.25V. IPUMP Available Output Current VBAT = 1.5V, VPUMP = 3.25V VBAT = 1.8V, VPUMP = 5.0V VBAT5V Configuration of footnote.[5] SMP trip voltage is set to 3.25V. SMP trip voltage is set to 5.0V. 8 5 ­ ­ ­ ­ mA mA Input Voltage Range from Battery 1.8 ­ 5.0 V Configuration of footnote.[5] SMP trip voltage is set to 5.0V. VBAT3V Input Voltage Range from Battery 1.0 ­ 3.3 V Configuration of footnote.[5] SMP trip voltage is set to 3.25V. VBATSTART Minimum Input Voltage from Battery to Start Pump 1.1 ­ ­ V Configuration of footnote.[5] VPUMP_Line Line Regulation (over VBAT range) ­ 5 ­ %VO Configuration of footnote.[5] VO is the "Vdd Value for PUMP Trip" specified by the VM[2:0] setting in the DC POR and LVD Specification, Table 29 on page 30. Note 5. L1 = 2 mH inductor, C1 = 10 mF capacitor, D1 = Schottky diode. See Figure 11. Document Number: 38-12012 Rev. *P Page 25 of 53 [+] Feedback CY8C27143 CY8C27143, CY8C27243 CY8C27243 CY8C27443 CY8C27443, CY8C27543 CY8C27543, CY8C27643 CY8C27643 Table 23. DC Switch Mode Pump (SMP) Specifications (continued) Symbol Min Typ Max Unit Notes ­ 5 ­ %VO Configuration of footnote.[5] VO is the "Vdd Value for PUMP Trip" specified by the VM[2:0] setting in the DC POR and LVD Specification, Table 29 on page 30. VPUMP_Ripple Output Voltage Ripple (depends on capacitor/load) ­ 100 ­ mVpp Configuration of footnote.[5] Load is 5 mA. E3 Efficiency 35 50 ­ % FPUMP Switching Frequency ­ 1.3 ­ MHz DCPUMP Switching Duty Cycle ­ 50 ­ % VPUMP_Load Description Load Regulation Configuration of footnote.[5] Load is 5 mA. SMP trip voltage is set to 3.25V. Figure 11. Basic Switch Mode Pump Circuit D1 Vdd L1 V BAT + V PUMP C1 SMP Battery PSoC TM Vss Document Number: 38-12012 Rev. *P Page 26 of 53 [+] Feedback CY8C27143 CY8C27143, CY8C27243 CY8C27243 CY8C27443 CY8C27443, CY8C27543 CY8C27543, CY8C27643 CY8C27643 DC Analog Reference Specifications The following tables list guaranteed maximum and minimum specifications for the voltage and temperature ranges: 4.75V to 5.25V and -40°C TA 85°C, or 3.0V to 3.6V and -40°C TA 85°C, respectively. Typical parameters apply to 5V and 3.3V at 25°C and are for design guidance only. The guaranteed specifications are measured through the Analog Continuous Time PSoC blocks. The power levels for AGND refer to the power of the Analog Continuous Time PSoC block. The power levels for RefHi and RefLo refer to the Analog Reference Control register. The limits stated for AGND include the offset error of the AGND buffer local to the Analog Continuous Time PSoC block. Reference control power is high. Note Avoid using P2[4] for digital signaling when using an analog resource that depends on the Analog Reference. Some coupling of the digital signal may appear on the AGND. Table 24. Silicon Revision A ­ 5V DC Analog Reference Specifications Symbol BG ­ ­ ­ ­ ­ ­ ­ ­ ­ ­ ­ ­ ­ ­ ­ ­ ­ Description Bandgap Voltage Reference AGND = Vdd/2[6] AGND = 2 x BandGap[6] AGND = P2[4] (P2[4] = Vdd/2)[6] AGND = BandGap[6] AGND = 1.6 x BandGap[6] AGND Block to Block Variation (AGND = Vdd/2)[6] RefHi = Vdd/2 + BandGap RefHi = 3 x BandGap RefHi = 2 x BandGap + P2[6] (P2[6] = 1.3V) RefHi = P2[4] + BandGap (P2[4] = Vdd/2) RefHi = P2[4] + P2[6] (P2[4] = Vdd/2, P2[6] = 1.3V) RefHi = 3.2 x BandGap RefLo = Vdd/2 ­ BandGap RefLo = BandGap RefLo = 2 x BandGap - P2[6] (P2[6] = 1.3V) RefLo = P2[4] ­ BandGap (P2[4] = Vdd/2) RefLo = P2[4]-P2[6] (P2[4] = Vdd/2, P2[6] = 1.3V) Min 1.274 Vdd/2 - 0.030 2 x BG - 0.043 P2[4] - 0.013 BG - 0.009 1.6 x BG - 0.018 -0.034 Typ 1.30 Vdd/2 - 0.004 2 x BG - 0.010 P2[4] BG 1.6 x BG 0.000 Max 1.326 Vdd/2 + 0.003 2 x BG + 0.024 P2[4] + 0.014 BG + 0.009 1.6 x BG + 0.018 0.034 Unit V V V V V V V Vdd/2 + BG - 0.140 3 x BG - 0.112 2 x BG + P2[6] - 0.113 Vdd/2 + BG - 0.018 3 x BG - 0.018 2 x BG + P2[6] - 0.018 Vdd/2 + BG + 0.103 3 x BG + 0.076 2 x BG + P2[6] + 0.077 V V V P2[4] + BG - 0.130 P2[4] + BG - 0.016 P2[4] + BG + 0.098 V P2[4] + P2[6] - 0.133 P2[4] + P2[6] - 0.016 P2[4] + P2[6] + 0.100 V 3.2 x BG - 0.112 Vdd/2 - BG - 0.051 BG - 0.082 2 x BG - P2[6] - 0.084 3.2 x BG Vdd/2 - BG + 0.024 BG + 0.023 2 x BG - P2[6] + 0.025 3.2 x BG + 0.076 Vdd/2 - BG + 0.098 BG + 0.129 2 x BG - P2[6] + 0.134 V V V V P2[4] - BG - 0.056 P2[4] - BG + 0.026 P2[4] - BG + 0.107 V P2[4] - P2[6] - 0.057 P2[4] - P2[6] + 0.026 P2[4] - P2[6] + 0.110 V Note 6. AGND tolerance includes the offsets of the local buffer in the PSoC block. Document Number: 38-12012 Rev. *P Page 27 of 53 [+] Feedback CY8C27143 CY8C27143, CY8C27243 CY8C27243 CY8C27443 CY8C27443, CY8C27543 CY8C27543, CY8C27643 CY8C27643 Table 25. Silicon Revision B ­ 5V DC Analog Reference Specifications Symbol BG ­ ­ ­ ­ ­ ­ ­ ­ ­ ­ ­ ­ ­ ­ ­ ­ ­ Description Bandgap Voltage Reference AGND = Vdd/2[7] AGND = 2 x BandGap[7] AGND = P2[4] (P2[4] = Vdd/2)[7] AGND = BandGap[7] AGND = 1.6 x BandGap[7] AGND Block to Block Variation (AGND = Vdd/2)[7] RefHi = Vdd/2 + BandGap RefHi = 3 x BandGap RefHi = 2 x BandGap + P2[6] (P2[6] = 1.3V) RefHi = P2[4] + BandGap (P2[4] = Vdd/2) RefHi = P2[4] + P2[6] (P2[4] = Vdd/2, P2[6] = 1.3V) RefHi = 3.2 x BandGap RefLo = Vdd/2 ­ BandGap RefLo = BandGap RefLo = 2 x BandGap - P2[6] (P2[6] = 1.3V) RefLo = P2[4] ­ BandGap (P2[4] = Vdd/2) RefLo = P2[4]-P2[6] (P2[4] = Vdd/2, P2[6] = 1.3V) Min Typ Max Unit V V V V V V V 1.28 Vdd/2 - 0.030 2 x BG - 0.043 P2[4] - 0.011 BG - 0.009 1.6 x BG - 0.018 -0.034 1.30 Vdd/2 2 x BG P2[4] BG 1.6 x BG 0.000 1.32 Vdd/2 + 0.007 2 x BG + 0.024 P2[4] + 0.011 BG + 0.009 1.6 x BG + 0.018 0.034 Vdd/2 + BG - 0.1 3 x BG - 0.06 2 x BG + P2[6] - 0.06 Vdd/2 + BG - 0.01 3 x BG - 0.01 2 x BG + P2[6] - 0.01 Vdd/2 + BG + 0.1 3 x BG + 0.06 2 x BG + P2[6] + 0.06 V V V P2[4] + BG - 0.06 P2[4] + BG - 0.01 P2[4] + BG + 0.06 V P2[4] + P2[6] - 0.06 P2[4] + P2[6] - 0.01 P2[4] + P2[6] + 0.06 V 3.2 x BG - 0.06 Vdd/2 - BG - 0.051 BG - 0.06 2 x BG - P2[6] - 0.04 3.2 x BG - 0.01 Vdd/2 - BG + 0.01 BG + 0.01 2 x BG - P2[6] + 0.01 3.2 x BG + 0.06 Vdd/2 - BG + 0.06 BG + 0.06 2 x BG - P2[6] + 0.04 V V V V P2[4] - BG - 0.056 P2[4] - BG + 0.01 P2[4] - BG + 0.056 V P2[4] - P2[6] - 0.056 P2[4] - P2[6] + 0.01 P2[4] - P2[6] + 0.056 V Table 26. Silicon Revision A ­ 3.3V DC Analog Reference Specifications Symbol BG ­ ­ ­ ­ ­ ­ ­ ­ ­ ­ ­ ­ ­ Description Bandgap Voltage Reference AGND = Vdd/2[8] AGND = 2 x BandGap[8] AGND = P2[4] (P2[4] = Vdd/2) AGND = BandGap[8] AGND = 1.6 x BandGap[8] AGND Block to Block Variation (AGND = Vdd/2)[8] RefHi = Vdd/2 + BandGap RefHi = 3 x BandGap RefHi = 2 x BandGap + P2[6] (P2[6] = 0.5V) RefHi = P2[4] + BandGap (P2[4] = Vdd/2) RefHi = P2[4] + P2[6] (P2[4] = Vdd/2, P2[6] = 0.5V) RefHi = 3.2 x BandGap RefLo = Vdd/2 - BandGap Min 1.274 Vdd/2 - 0.027 Not Allowed P2[4] - 0.008 BG - 0.009 1.6 x BG - 0.018 -0.034 Typ 1.30 Vdd/2 - 0.003 Max 1.326 Vdd/2 + 0.002 Unit V V P2[4] + 0.001 BG 1.6 x BG 0.000 P2[4] + 0.009 BG + 0.009 1.6 x BG + 0.018 0.034 V V V V P2[4] + P2[6] - 0.009 P2[4] + P2[6] + 0.057 V Not Allowed Not Allowed Not Allowed Not Allowed P2[4] + P2[6] - 0.075 Not Allowed Not Allowed Note 7. AGND tolerance includes the offsets of the local buffer in the PSoC block. Document Number: 38-12012 Rev. *P Page 28 of 53 [+] Feedback CY8C27143 CY8C27143, CY8C27243 CY8C27243 CY8C27443 CY8C27443, CY8C27543 CY8C27543, CY8C27643 CY8C27643 Table 26. Silicon Revision A ­ 3.3V DC Analog Reference Specifications (continued) Symbol Description ­ RefLo = BandGap ­ RefLo = 2 x BandGap - P2[6] (P2[6] = 0.5V) ­ RefLo = P2[4] ­ BandGap (P2[4] = Vdd/2) ­ RefLo = P2[4]-P2[6] (P2[4] = Vdd/2, P2[6] = 0.5V) Min Not Allowed Not Allowed Typ Max Unit P2[4] - P2[6] + 0.092 V Not Allowed P2[4] - P2[6] - 0.048 P2[4] - P2[6] + 0.022 Table 27. Silicon Revision B ­ 3.3V DC Analog Reference Specifications Symbol BG ­ ­ ­ ­ ­ ­ ­ ­ ­ ­ ­ ­ ­ ­ ­ ­ ­ Description Bandgap Voltage Reference AGND = Vdd/2[8] AGND = 2 x BandGap[8] AGND = P2[4] (P2[4] = Vdd/2) AGND = BandGap[8] AGND = 1.6 x BandGap[8] AGND Block to Block Variation (AGND = Vdd/2)[8] RefHi = Vdd/2 + BandGap RefHi = 3 x BandGap RefHi = 2 x BandGap + P2[6] (P2[6] = 0.5V) RefHi = P2[4] + BandGap (P2[4] = Vdd/2) RefHi = P2[4] + P2[6] (P2[4] = Vdd/2, P2[6] = 0.5V) RefHi = 3.2 x BandGap RefLo = Vdd/2 - BandGap RefLo = BandGap RefLo = 2 x BandGap - P2[6] (P2[6] = 0.5V) RefLo = P2[4] ­ BandGap (P2[4] = Vdd/2) RefLo = P2[4]-P2[6] (P2[4] = Vdd/2, P2[6] = 0.5V) Min 1.28 Vdd/2 - 0.027 Not Allowed P2[4] - 0.008 BG - 0.009 1.6 x BG - 0.018 -0.034 1.30 Vdd/2 Typ Max 1.32 Vdd/2 + 0.005 Unit V V P2[4] BG 1.6 x BG 0.000 P2[4] + 0.009 BG + 0.009 1.6 x BG + 0.018 0.034 V V V mV P2[4] + P2[6] - 0.01 P2[4] + P2[6] + 0.057 V P2[4] - P2[6] + 0.01 P2[4] - P2[6] + 0.048 V Not Allowed Not Allowed Not Allowed Not Allowed P2[4] + P2[6] - 0.06 Not Allowed Not Allowed Not Allowed Not Allowed Not Allowed P2[4] - P2[6] - 0.048 DC Analog PSoC Block Specifications The following table lists guaranteed maximum and minimum specifications for the voltage and temperature ranges: 4.75V to 5.25V and -40°C TA 85°C, or 3.0V to 3.6V and -40°C TA 85°C, respectively. Typical parameters apply to 5V and 3.3V at 25°C and are for design guidance only. Table 28. DC Analog PSoC Block Specifications Symbol RCT CSC Description Resistor Unit Value (Continuous Time) Capacitor Unit Value (Switch Cap) Min ­ ­ Typ 12.2 80 Max ­ ­ Unit k fF Note 8. AGND tolerance includes the offsets of the local buffer in the PSoC block. See Application Note AN2012 AN2012 "Adjusting PSoC Microcontroller Trims for Dual Voltage-Range Operation" at http://www.cypress.com for information on trimming for operation at 3.3V. Document Number: 38-12012 Rev. *P Page 29 of 53 [+] Feedback CY8C27143 CY8C27143, CY8C27243 CY8C27243 CY8C27443 CY8C27443, CY8C27543 CY8C27543, CY8C27643 CY8C27643 DC POR and LVD Specifications The following table lists guaranteed maximum and minimum specifications for the voltage and temperature ranges: 4.75V to 5.25V and -40°C TA 85°C, or 3.0V to 3.6V and -40°C TA 85°C, respectively. Typical parameters apply to 5V and 3.3V at 25°C and are for design guidance only. Note The bits PORLEV and VM in the following table refer to bits in the VLT_CR register. See the PSoC Programmable System-on-Chip Technical Reference Manual for more information on the VLT_CR register. Table 29. DC POR and LVD Specifications Symbol Description Min Typ Max Unit Notes Vdd must be greater than or equal to 2.5V during startup, reset from the XRES pin, or reset from Watchdog. VPPOR0R VPPOR1R VPPOR2R Vdd Value for PPOR Trip (positive ramp) PORLEV[1:0] = 00b PORLEV[1:0] = 01b PORLEV[1:0] = 10b ­ ­ ­ 2.91 4.39 4.55 ­ ­ ­ V V V VPPOR0 VPPOR1 VPPOR2 Vdd Value for PPOR Trip (negative ramp) PORLEV[1:0] = 00b PORLEV[1:0] = 01b PORLEV[1:0] = 10b ­ ­ ­ 2.82 4.39 4.55 ­ ­ ­ V V V VPH0 VPH1 VPH2 PPOR Hysteresis PORLEV[1:0] = 00b PORLEV[1:0] = 01b PORLEV[1:0] = 10b ­ ­ ­ 92 0 0 ­ ­ ­ mV mV mV VLVD0 VLVD1 VLVD2 VLVD3 VLVD4 VLVD5 VLVD6 VLVD7 Vdd Value for LVD Trip VM[2:0] = 000b VM[2:0] = 001b VM[2:0] = 010b VM[2:0] = 011b VM[2:0] = 100b VM[2:0] = 101b VM[2:0] = 110b VM[2:0] = 111b 2.86 2.96 3.07 3.92 4.39 4.55 4.63 4.72 2.92 3.02 3.13 4.00 4.48 4.64 4.73 4.81 2.98[9] 3.08 3.20 4.08 4.57 4.74[10] 4.82 4.91 V V V V V V V V V VPUMP0 VPUMP1 VPUMP2 VPUMP3 VPUMP4 VPUMP5 VPUMP6 VPUMP7 Vdd Value for PUMP Trip VM[2:0] = 000b VM[2:0] = 001b VM[2:0] = 010b VM[2:0] = 011b VM[2:0] = 100b VM[2:0] = 101b VM[2:0] = 110b VM[2:0] = 111b 2.96 3.03 3.18 4.11 4.55 4.63 4.72 4.90 3.02 3.10 3.25 4.19 4.64 4.73 4.82 5.00 3.08 3.16 3.32 4.28 4.74 4.82 4.91 5.10 V V V V V V V V V Notes 9. Always greater than 50 mV above PPOR (PORLEV = 00) for falling supply. 10. Always greater than 50 mV above PPOR (PORLEV = 10) for falling supply. Document Number: 38-12012 Rev. *P Page 30 of 53 [+] Feedback CY8C27143 CY8C27143, CY8C27243 CY8C27243 CY8C27443 CY8C27443, CY8C27543 CY8C27543, CY8C27643 CY8C27643 DC Programming Specifications The following table lists guaranteed maximum and minimum specifications for the voltage and temperature ranges: 4.75V to 5.25V and -40°C TA 85°C, or 3.0V to 3.6V and -40°C TA 85°C, respectively. Typical parameters apply to 5V and 3.3V at 25°C and are for design guidance only. Table 30. DC Programming Specifications Symbol IDDP VILP FlashENPB Description Supply Current During Programming or Verify Input Low Voltage During Programming or Verify Input High Voltage During Programming or Verify Input Current when Applying Vilp to P1[0] or P1[1] During Programming or Verify Input Current when Applying Vihp to P1[0] or P1[1] During Programming or Verify Output Low Voltage During Programming or Verify Output High Voltage During Programming or Verify Flash Endurance (per block) FlashENT FlashDR Flash Endurance (total)[12] Flash Data Retention VIHP IILP IIHP VOLV VOHV Min ­ ­ Typ 5 ­ Max 25 0.8 Unit mA V 2.2 ­ ­ V ­ ­ 0.2 mA ­ ­ 1.5 mA ­ ­ V Vdd - 1.0 ­ Vss + 0.75 Vdd 50,000[11] ­ ­ Cycles 1,800,000 10 ­ ­ ­ ­ Cycles Years Notes Driving internal pull down resistor. Driving internal pull down resistor. V Erase/write cycles per block. Erase/write cycles. Notes 11. The 50,000 cycle flash endurance per block will only be guaranteed if the flash is operating within one voltage range. Voltage ranges are 3.0V to 3.6V and 4.75V to 5.25V. 12. A maximum of 36 x 50,000 block endurance cycles is allowed. This may be balanced between operations on 36x1 blocks of 50,000 maximum cycles each, 36x2 blocks of 25,000 maximum cycles each, or 36x4 blocks of 12,500 maximum cycles each (to limit the total number of cycles to 36x50,000 and that no single block ever sees more than 50,000 cycles). For the full industrial range, the user must employ a temperature sensor user module (FlashTemp) and feed the result to the temperature argument before writing. Refer to the Flash APIs Application Note AN2015 AN2015 at http://www.cypress.com under Application Notes for more information Document Number: 38-12012 Rev. *P Page 31 of 53 [+] Feedback CY8C27143 CY8C27143, CY8C27243 CY8C27243 CY8C27443 CY8C27443, CY8C27543 CY8C27543, CY8C27643 CY8C27643 AC Electrical Characteristics AC Chip-Level Specifications The following table lists guaranteed maximum and minimum specifications for the voltage and temperature ranges: 4.75V to 5.25V and -40°C TA 85°C, or 3.0V to 3.6V and -40°C TA 85°C, respectively. Typical parameters apply to 5V and 3.3V at 25°C and are for design guidance only. Table 31. AC Chip-Level Specifications Symbol FIMO Description Internal Main Oscillator Frequency Min 23.4 Typ 24 Max 24.6[13] Unit MHz FCPU1 CPU Frequency (5V Nominal) 0.0914 24 24.6[13,14] MHz FCPU2 CPU Frequency (3.3V Nominal) 0.0914 12 12.3[14,15] MHz F48M Digital PSoC Block Frequency 0 48 49.2[13,14, 16] MHz F24M F32K1 F32K1 Digital PSoC Block Frequency Internal Low Speed Oscillator Frequency External Crystal Oscillator 0 15 24 32 24.6[14, 16] 64 MHz kHz ­ 32.768 ­ kHz F32K_U Internal Low Speed Oscillator (ILO) Untrimmed Frequency 5 ­ ­ kHz FPLL PLL Frequency ­ 23.986 ­ MHz Jitter24M2 TPLLSLEW TPLLSLEWSLOW TOS 24 MHz Period Jitter (PLL) PLL Lock Time PLL Lock Time for Low Gain Setting External Crystal Oscillator Startup to 1% External Crystal Oscillator Startup to 100 ppm ­ 0.5 0.5 ­ ­ ­ ­ 1700 600 10 50 2620 ps ms ms ms ­ 2800 3800 ms 32 kHz Period Jitter External Reset Pulse Width 24 MHz Duty Cycle Internal Low Speed Oscillator Duty Cycle 24 MHz Trim Step Size ­ 10 40 20 100 ­ 50 50 ­ ­ 60 80 ns s % % ­ 50 ­ kHz F32K2 F32K2 TOSACC Jitter32k TXRST DC24M DC24M DCILO Step24M Notes Trimmed. Utilizing factory trim values. Trimmed. Utilizing factory trim values. Trimmed. Utilizing factory trim values. Refer to the AC Digital Block Specifications below. Accuracy is capacitor and crystal dependent. 50% duty cycle. After a reset and before the m8c starts to run, the ILO is not trimmed. See the System Resets section of the PSoC Technical Reference Manual for details on timing this Multiple (x732) of crystal frequency. The crystal oscillator frequency is within 100 ppm of its final value by the end of the Tosacc period. Correct operation assumes a properly loaded 1 µW maximum drive level 32.768 kHz crystal. 3.0V Vdd 5.5V, -40°C TA 85°C. Notes 13. 4.75V < Vdd < 5.25V. 14. Accuracy derived from Internal Main Oscillator with appropriate trim for Vdd range. 15. 3.0V < Vdd < 3.6V. See Application Note AN2012 AN2012 "Adjusting PSoC Microcontroller Trims for Dual Voltage-Range Operation" at http://www.cypress.com for information on trimming for operation at 3.3V. 16. See the individual user module data sheets for information on maximum frequencies for user modules. Document Number: 38-12012 Rev. *P Page 32 of 53 [+] Feedback CY8C27143 CY8C27143, CY8C27243 CY8C27243 CY8C27443 CY8C27443, CY8C27543 CY8C27543, CY8C27643 CY8C27643 Table 31. AC Chip-Level Specifications (continued) Symbol TPOWERUP Description Time from end of POR to CPU executing code Min ­ Typ 16 Max 100 Unit ms Fout48M 48 MHz Output Frequency 46.8 48.0 49.2[13,15] MHz Jitter24M1 FMAX 24 MHz Period Jitter (IMO) Maximum frequency of signal on row input or row output. Power Supply Slew Rate ­ ­ 600 ­ ­ 12.3 ps MHz ­ ­ 250 V/ms SRPOWER_UP Notes Power up from 0V. See the System Resets section of the PSoC Technical Reference Manual. Trimmed. Utilizing factory trim values. Vdd slew rate during power up. Figure 12. PLL Lock Timing Diagram PLL Enable TPLLSLEW 24 MHz FPLL PLL Gain 0 Figure 13. PLL Lock for Low Gain Setting Timing Diagram PLL Enable TPLLSLEWLOW 24 MHz FPLL PLL Gain 1 Figure 14. External Crystal Oscillator Startup Timing Diagram 32K Select 32 kHz TOS F32K2 F32K2 Figure 15. 24 MHz Period Jitter (IMO) Timing Diagram Jitter24M1 F 24M Figure 16. 32 kHz Period Jitter (ECO) Timing Diagram Jitter32k F 32K2 Document Number: 38-12012 Rev. *P Page 33 of 53 [+] Feedback CY8C27143 CY8C27143, CY8C27243 CY8C27243 CY8C27443 CY8C27443, CY8C27543 CY8C27543, CY8C27643 CY8C27643 AC General Purpose I/O Specifications The following table lists guaranteed maximum and minimum specifications for the voltage and temperature ranges: 4.75V to 5.25V and -40°C TA 85°C, or 3.0V to 3.6V and -40°C TA 85°C, respectively. Typical parameters apply to 5V and 3.3V at 25°C and are for design guidance only. Table 32. AC GPIO Specifications Symbol FGPIO TRiseF TFallF TRiseS TFallS Description GPIO Operating Frequency Rise Time, Normal Strong Mode, Cload = 50 pF Fall Time, Normal Strong Mode, Cload = 50 pF Rise Time, Slow Strong Mode, Cload = 50 pF Fall Time, Slow Strong Mode, Cload = 50 pF Min 0 3 2 10 10 Typ ­ ­ ­ 27 22 Max 12 18 18 ­ ­ Unit MHz ns ns ns ns Notes Normal Strong Mode Vdd = 4.5 to 5.25V, 10% - 90% Vdd = 4.5 to 5.25V, 10% - 90% Vdd = 3 to 5.25V, 10% - 90% Vdd = 3 to 5.25V, 10% - 90% Figure 17. GPIO Timing Diagram 90% GPIO Pin Output Voltage 10% TRiseF TRiseS TFallF TFallS AC Operational Amplifier Specifications The following tables list guaranteed maximum and minimum specifications for the voltage and temperature ranges: 4.75V to 5.25V and -40°C TA 85°C, or 3.0V to 3.6V and -40°C TA 85°C, respectively. Typical parameters apply to 5V and 3.3V at 25°C and are for design guidance only. Settling times, slew rates, and gain bandwidth are based on the Analog Continuous Time PSoC block. Power = High and Opamp Bias = High is not supported at 3.3V. Table 33. 5V AC Operational Amplifier Specifications Symbol TROA TSOA SRROA SRFOA Description Rising Settling Time from 80% of V to 0.1% of V (10 pF load, Unity Gain) Power = Low, Opamp Bias = Low Power = Medium, Opamp Bias = High Power = High, Opamp Bias = High Falling Settling Time from 20% of V to 0.1% of V (10 pF load, Unity Gain) Power = Low, Opamp Bias = Low Power = Medium, Opamp Bias = High Power = High, Opamp Bias = High Rising Slew Rate (20% to 80%)(10 pF load, Unity Gain) Power = Low, Opamp Bias = Low Power = Medium, Opamp Bias = High Power = High, Opamp Bias = High Falling Slew Rate (20% to 80%)(10 pF load, Unity Gain) Power = Low, Opamp Bias = Low Power = Medium, Opamp Bias = High Power = High, Opamp Bias = High Document Number: 38-12012 Rev. *P Min Typ Max Unit ­ ­ ­ ­ ­ ­ 3.9 0.72 0.62 s s s ­ ­ ­ ­ ­ ­ 5.9 0.92 0.72 s s s 0.15 1.7 6.5 ­ ­ ­ ­ ­ ­ V/s V/s V/s 0.01 0.5 4.0 ­ ­ ­ ­ ­ ­ V/s V/s V/s Page 34 of 53 [+] Feedback CY8C27143 CY8C27143, CY8C27243 CY8C27243 CY8C27443 CY8C27443, CY8C27543 CY8C27543, CY8C27643 CY8C27643 Table 33. 5V AC Operational Amplifier Specifications (continued) Symbol BWOA ENOA Description Gain Bandwidth Product Power = Low, Opamp Bias = Low Power = Medium, Opamp Bias = High Power = High, Opamp Bias = High Noise at 1 kHz (Power = Medium, Opamp Bias = High) Min Typ Max Unit 0.75 3.1 5.4 ­ ­ ­ ­ 100 ­ ­ ­ ­ MHz MHz MHz nV/rt-Hz Min Typ Max Units ­ ­ ­ ­ 3.92 0.72 s s ­ ­ ­ ­ 5.41 0.72 s s 0.31 2.7 ­ ­ ­ ­ V/s V/s 0.24 1.8 ­ ­ ­ ­ V/s V/s 0.67 2.8 ­ ­ ­ 100 ­ ­ ­ MHz MHz nV/rt-Hz Table 34. 3.3V AC Operational Amplifier Specifications Symbol Description Rising Settling Time from 80% of V to 0.1% of V (10 pF load, Unity Gain) TROA Power = Low, Opamp Bias = Low Power = Low, Opamp Bias = High Falling Settling Time from 20% of V to 0.1% of V (10 pF load, Unity Gain) TSOA Power = Low, Opamp Bias = Low Power = Medium, Opamp Bias = High Rising Slew Rate (20% to 80%)(10 pF load, Unity Gain) SRROA Power = Low, Opamp Bias = Low Power = Medium, Opamp Bias = High Falling Slew Rate (20% to 80%)(10 pF load, Unity Gain) SRFOA Power = Low, Opamp Bias = Low Power = Medium, Opamp Bias = High Gain Bandwidth Product BWOA Power = Low, Opamp Bias = Low Power = Medium, Opamp Bias = High Noise at 1 kHz (Power = Medium, Opamp Bias = High) ENOA When bypassed by a capacitor on P2[4], the noise of the analog ground signal distributed to each block is reduced by a factor of up to 5 (14 dB). This is at frequencies above the corner frequency defined by the on-chip 8.1k resistance and the external capacitor. Figure 18. Typical AGND Noise with P2[4] Bypass dBV/rtHz 10000 0 0.01 0.1 1.0 10 1000 100 0.001 Document Number: 38-12012 Rev. *P 0.01 0.1 Freq (kHz) 1 10 100 Page 35 of 53 [+] Feedback CY8C27143 CY8C27143, CY8C27243 CY8C27243 CY8C27443 CY8C27443, CY8C27543 CY8C27543, CY8C27643 CY8C27643 At low frequencies, the opamp noise is proportional to 1/f, power independent, and determined by device geometry. At high frequencies, increased power level reduces the noise spectrum level. Figure 19. Typical Opamp Noise nV/rtHz 10000 PH_BH PH_BL PM_BL PL_BL 1000 100 10 0.001 0.01 0.1 Freq (kHz) 1 10 100 AC Low Power Comparator Specifications The following table lists guaranteed maximum and minimum specifications for the voltage and temperature ranges: 4.75V to 5.25V and -40°C TA 85°C, 3.0V to 3.6V and -40°C TA 85°C, or 2.4V to 3.0V and -40°C TA 85°C, respectively. Typical parameters apply to 5V at 25°C and are for design guidance only. Table 35. AC Low Power Comparator Specifications Symbol TRLPC Description LPC response time Document Number: 38-12012 Rev. *P Min ­ Typ ­ Max 50 Unit s Notes 50 mV overdrive comparator reference set within VREFLPC. Page 36 of 53 [+] Feedback CY8C27143 CY8C27143, CY8C27243 CY8C27243 CY8C27443 CY8C27443, CY8C27543 CY8C27543, CY8C27643 CY8C27643 AC Digital Block Specifications The following table lists guaranteed maximum and minimum specifications for the voltage and temperature ranges: 4.75V to 5.25V and -40°C TA 85°C, or 3.0V to 3.6V and -40°C TA 85°C, respectively. Typical parameters apply to 5V and 3.3V at 25°C and are for design guidance only. Table 36. AC Digital Block Specifications Function Description Min All Functions Maximum Block Clocking Frequency (> 4.75V) Timer Capture Pulse Width Max Unit ­ 49.2 MHz 4.75V < Vdd < 5.25V Notes 3.0V < Vdd < 4.75V ­ ­ 24.6 MHz 50[17] ­ ­ ns Maximum Frequency, No Capture ­ ­ 49.2 MHz Maximum F