NEW DATABASE - 350 MILLION DATASHEETS FROM 8500 MANUFACTURERS
NEW DATABASE - 350 MILLION DATASHEETS FROM 8500 MANUFACTURERS
CY7C64013/ CY7C64113 CY7C65013/ CY7C65113 CY7C66013/ CY7C66113 CY7C66013 - Datasheet Archive
Product Qualification Report QTP# 98452/99274/000302 VERSION 2.1 June, 2000 CYUSB3 Family P26 Technology, Fab 2-CTI CY7C64013/
Cypress Semiconductor Product Qualification Report QTP# 98452/99274/000302 VERSION 2.1 June, 2000 CYUSB3 Family P26 Technology, Fab 2-CTI CY7C64013/ CY7C64013/ CY7C64113 CY7C64113 Full Speed USB (12 Mbps) Function CY7C65013/ CY7C65013/ CY7C65113 CY7C65113 USB Hub with Microcontroller CY7C66013/ CY7C66013/ CY7C66113 CY7C66113 Full Speed USB (12 Mbp) Peripheral Controller with Integrated Hub CYPRESS TECHNICAL CONTACT FOR QUALIFICATION DATA: Ed Russell Reliability Director (408) 432-7069 Cypress Semiconductor USB3, Keyboard Controller with Integrated Hub, P26 Technology, Fab 2. Device: CY7C66013 CY7C66013 and its Product Family QTP# 98452/99274/000302, V. 2.1 June,2000 Page 2 of 7 PRODUCT DESCRIPTION (for qualification) Qualification Purpose: Qualify CY7C66013 CY7C66013 and its CYUSB3 product family, P26 Technology, Fab 2-CTI. Marketing Part #: . Device Description: CYUSB3 Microcontroller available in SOIC, SSOP and PDIP Package. Cypress Division: Cypress Semiconductor Corporation - IPD Division Overall Die (or Mask) REV: *Rev. D (not in production) *Rev. F (not in production) *Rev. G Die Size: 133.8 mils x 165.1 mils What ID markings on Die: 7C6600A 7C6600A (Rev. D) 7C6601A 7C6601A (Rev. F) 7C6602A 7C6602A Note: *Rev. D, CYUSB3 and its Product Family Qualification *Rev. F, All layer change *Rev. G, 3 layer change TECHNOLOGY/FAB PROCESS DESCRIPTION Number of Metal Layers: 2 Metal Composition: Passivation Type and Materials: Oxynitride Free Phosphorus contents in top glass layer(%): Metal 1: 6000Å Al, 1200 Å TiW Metal 2: 1500Å TiW, 9000Å Al, 320Å TiW None Die Coating(s), if used: Generic Process Technology/Design Rule (µdrawn): Gate Oxide Material/Thickness (MOS): Name/Location of Die Fab (prime) Facility: Die Fab Line ID/Wafer Process ID: N/A CMOS, Double Metal / 0.65µm SiO2 / 165 Å Cypress Semiconductor - Round Rock, TX (CTI) Fab 2/ P26 Cypress Semiconductor USB3, Keyboard Controller with Integrated Hub, P26 Technology, Fab 2. Device: CY7C66013 CY7C66013 and its Product Family QTP# 98452/99274/000302, V. 2.1 June,2000 Page 3 of 7 RELIABILITY TESTS PERFORMED PER SPECIFICATION REQUIREMENT Stress/Test High Temperature Operating Life Test Condition (Temp/Bias) Result P/F Dynamic Operating Condition, Vcc = 5.75 V, 150°C P Dynamic Operating Condition, Vcc = 5.75 V, 150°C P 130°C, 5.5V, 85%RH Precondition: JESD22 JESD22 Moisture Sensitivity Level 1 P Early Failure Rate High Temperature Operating Life Latent Failure Rate High Accelerated Saturation Test (HAST (168 Hrs, 85/85% RH+3IR-Reflow) Temperature Cycle MIL-STD-883C MIL-STD-883C, Method 1010, Condition C, -65°C to 150°C Precondition: P JESD22 JESD22 Moisture Sensitivity Level 1 (168 hrs, 85°C/85%RH+3IR-Reflow) Electrostatic Discharge MIL-STD-883 MIL-STD-883, Method 3015.7 (2,200V) P Electrostatic Discharge Charge Device Model (ESD-CDM) Cypress Spec. 25-00020 (500V) P Acoustic Microscopy Cypress Spec. 25-00104 P Pressure Cooker 121°C/100 C/100%RH P Human Body Model (ESD-HBM) Precondition: JESD22 JESD22 Moisture Sensitivity Level 1 (168 hrs, 85°C/85%RH+3IR-Reflow) Data Retention (Plastic) 165C, no bias P Latchup Sensitivity In accordance with JEDEC 17. P Cypress Spec. 01-00081 (10V /± 200mA) Cypress Semiconductor USB3, Keyboard Controller with Integrated Hub, P26 Technology, Fab 2. Device: CY7C66013 CY7C66013 and its Product Family QTP# 98452/99274/000302, V. 2.1 June,2000 Page 4 of 7 RELIABILITY FAILURE RATE SUMMARY Stress/Test High Temperature Operating Life Early Failure Rate High Temperature Operating Life1,2 Long Term Failure Rate 1 2 3 Device Tested/ Device Hours # Fails Activation Energy Acceleration Factor3 Failure Rate4 3581 0 N/A N/A 0 PPM 134,500 DHRs 0 0.7 170 40 FIT Assuming an ambient temperature of 150°C and a junction temperature rise of 15°C. Chi-squared 60% estimations used to calculate the failure rate. Thermal Acceleration Factor is calculated from the Arrhenius equation E 1 1 AF = exp A - k T 2 T1 where: EA =The Activation Energy of the defect mechanism. k = Boltzmann's constant = 8.62x10-5 eV/Kelvin. T1 is the junction temperature of the device under stress and T2 is the junction temperature of the device at use conditions. 4 Note: Short Term Failure Rate is based on QTP #98452 and QTP #99274. Long Term Failure Rate is based on QTP #98452 Cypress Semiconductor USB3, Keyboard Controller with Integrated Hub, P26 Technology, Fab 2. Device: CY7C66013 CY7C66013 and its Product Family QTP# 98452/99274/000302, V. 2.1 June,2000 Page 5 of 7 RELIABILITY TEST DATA QTP#: 98452 DEVICE ASSY-LOC FABLOT# ASSYLOT# = = = = STRESS: DATA RETENTION-PLASTIC (165C, NO BIAS) DURATION = S/S = REJ = FAIL MODE = CY7C66013-PVC CY7C66013-PVC INDNS-O 2819797 519810652 168 80 0 CY7C66013-PVC CY7C66013-PVC INDNS-O 2819797 519810652 552 80 0 -STRESS: HIGH TEMP DYNAMIC OPERATING LIFE-EARLY FAILURE RATE (150C, 5.75V) CY7C66013-PVC CY7C66013-PVC INDNS-O 2845832 519817122 48 719 0 CY7C66013-PVC CY7C66013-PVC INDNS-O 2847034 519902559 48 518 0 CY7C65113-SC CY7C65113-SC ALPHA-X 2902711 619906716 48 298 0 CY7C65113-SC CY7C65113-SC ALPHA-X 2902711 619906716 45 202 0 CY7C65113-SC CY7C65113-SC ALPHA-X 2902711 619906719 57 295 0 CY7C65113-SC CY7C65113-SC ALPHA-X 2904855 619906875 48 299 0 CY7C65113-SC CY7C65113-SC ALPHA-X 2904855 619906875 48 210 0 -STRESS: ESD-CHARGE DEVICE MODEL (1000V) CY7C66113-PVC CY7C66113-PVC CSPI-R 2818758 619807023 COMP 3 0 CY7C66113-PVC CY7C66113-PVC CSPI-R 2845832 619817974 COMP 3 0 CY7C64113-PVC CY7C64113-PVC CSPI-R 2845832 619818000 COMP 3 0 CY7C65013-PVC CY7C65013-PVC CSPI-R 2845832 619818001 COMP 3 0 -STRESS: ESD-HUMAN BODY CIRCUIT PER MIL STD 883, METHOD 3015(2,200V) CY7C66113-PVC CY7C66113-PVC CSPI-R 2818758 619807023 COMP 3 0 CY7C66113-ROC CY7C66113-ROC CSPI-R 2845832 619817974 COMP 3 0 CY7C64113-PVC CY7C64113-PVC CSPI-R 2845832 619818000 COMP 3 0 CY7C65013-PVC CY7C65013-PVC CSPI-R 2845832 619818001 COMP 3 0 -STRESS: HI-ACCEL SATURATION TEST (130C/85 130C/85%RH/5.5V), PRECOND. 168 HRS 85C/85 85C/85%RH CY7C66113-PVC CY7C66113-PVC CSPI-R 2819797 619809906 128 45 0 -STRESS: HIGH TEMP DYNAMIC OPERATING LIFE-LATENT FAILURE RATE (150C, 5.75V) CY7C66013-PVC CY7C66013-PVC INDNS-O 2820896 519812947 80 149 0 CY7C66013-PVC CY7C66013-PVC INDNS-O 2820896 519812947 500 149 0 CY7C66013-PVC CY7C66013-PVC INDNS-O 2847034 519902559 80 120 0 CY7C66013-PVC CY7C66013-PVC INDNS-O 2847034 519902559 500 120 0 -STRESS: PRESSURE COOKER TEST (121C, 100%RH) CY7C66113-PVC CY7C66113-PVC CSPI-R 2845832 619817974 168 48 0 -STRESS: TC COND. C, -65 TO 150C, PRECOND. 168 HRS 85C/85 85C/85%RH (MSL 1) CY7C66113-PVC CY7C66113-PVC CSPI-R 2818758 619807023 300 46 0 - Note: PV is a Cypress Semiconductor symbol in SSOP package. Cypress Semiconductor USB3, Keyboard Controller with Integrated Hub, P26 Technology, Fab 2. Device: CY7C66013 CY7C66013 and its Product Family QTP# 98452/99274/000302, V. 2.1 June,2000 Page 6 of 7 RELIABILITY TEST DATA QTP#: 99274 DEVICE ASSY-LOC FABLOT# ASSYLOT# DURATION S/S REJ = = = = = = = STRESS: HIGH TEMP DYNAMIC OPERATING LIFE-EARLY FAILURE RATE (150C, 5.75V) FAIL MODE = CY7C65113-SC CY7C65113-SC INDNS-O 2919190 519912085 48 545 0 CY7C65113-SC CY7C65113-SC INDNS-O 2919190 519912085 48 495 0 -STRESS: ESD-CHARGE DEVICE MODEL (1,000V) CY7C65013-PVC CY7C65013-PVC CSPI-R 2919190 619919237 COMP 3 0 CY7C64113-PVC CY7C64113-PVC CSPI-R 2919190 619919238 COMP 3 0 CY7C66113-PVC CY7C66113-PVC CSPI-R 2919190 619919240 COMP 3 0 -STRESS: ESD-HUMAN BODY CIRCUIT PER MIL STD 883, METHOD 3015 (2,200V) CY7C65013-PVC CY7C65013-PVC CSPI-R 2919190 619919237 COMP 3 0 CY7C64113-PVC CY7C64113-PVC CSPI-R 2919190 619919238 COMP 3 0 CY7C66113-PVC CY7C66113-PVC CSPI-R 2919190 619919240 COMP 3 0 -STRESS: PRESSURE COOKER TEST (121C, 100%RH) CY7C66013-PVC CY7C66013-PVC CSPI-R 2919190 619919239 168 48 0 -STRESS: TC COND. C, -65 TO 150C, PRECOND. 168 HRS 85C/85 85C/85%RH (MSL 1) CY7C66013-PVC CY7C66013-PVC CSPI-R 2919190 619919239 300 48 0 CY7C66013-PVC CY7C66013-PVC CSPI-R 2919190 619919239 500 48 0 CY7C66013-PVC CY7C66013-PVC CSPI-R 2919190 619919239 1000 47 0 - Note: PV is a Cypress Semiconductor symbol in SSOP package. Cypress Semiconductor USB3, Keyboard Controller with Integrated Hub, P26 Technology, Fab 2. Device: CY7C66013 CY7C66013 and its Product Family QTP# 98452/99274/000302, V. 2.1 June,2000 Page 7 of 7 Reliability Test Data QTP #: Device STRESS: Fab Lot # Assy Lot # 000302 Assy Loc Duration Samp Re Failure Mechanism ESD-CHARGE DEVICE MODEL (1,000V) CY7C64013-SC CY7C64013-SC 2950919 510001216 INDNS-O COMP 3 0 CY7C66113-PVC CY7C66113-PVC 2950919 610003709 CSPI-R COMP 3 0 CY7C64113-PVC CY7C64113-PVC 2950919 610003710 CSPI-R COMP 3 0 STRESS: ESD-HUMAN BODY CIRCUIT PER MIL STD 883, METHOD 3015 (3,300V) CY7C64013-SC CY7C64013-SC 2950919 510001216 INDNS-O COMP 3 0 CY7C66113-PVC CY7C66113-PVC 2950919 610003709 CSPI-R COMP 3 0 CY7C64113-PVC CY7C64113-PVC 2950919 610003710 CSPI-R COMP 3 0 Note: PV is a Cypress Semiconductor symbol in SSOP package.