4FCT264 CY74FCT2646T FCT2646T FCT646T MIL-STD-883 CY74FCT2646AT CY74FCT2646CT - Datasheet Archive

 

1CY 54/7 4FCT264 8T CY74FCT2646T 8-Bit Registered Transceiver Features Functional Description · Function and pinout

 

fax id: 7037 1CY 54/7 4FCT264 4FCT264 8T CY74FCT2646T CY74FCT2646T 8-Bit Registered Transceiver Features Functional Description · Function and pinout compatible with FCT and F logic · FCT-C speed at 5.4 ns max. FCT-A speed at 6.3 ns max. · Reduced VOH (typically = 3.3V) versions of equivalent FCT functions · 25 output series resistors to reduce transmission line reflection noise · Reduced VOH (typically=3.3V) versions of equivalent FCT functions · Edge-rate control circuitry for significantly improved noise characteristics · Power-off disable feature permits live insertion · Matched rise and fall times · ESD > 2000V · Fully compatible with TTL input and output logic levels · Sink current 12 mA Source current 15 mA · Independent register for A and B buses · Extended commercial temp. range of ­40°C to +85°C · Three-state output The FCT2646T FCT2646T consists of a bus transceiver circuit with three-state, D-type flip-flops, and control circuitry arranged for multiplexed transmission of data directly from the input bus or from the internal registers. Data on the A or B bus will be clocked into the registers as the appropriate clock pin goes to a HIGH logic level. Enable Control G and direction pins are provided to control the transceiver function. On-chip termination resistors have been added to the outputs to reduce system noise caused by reflections so that the FCT2646T FCT2646T can be used to replace the FCT646T FCT646T in an existing design. In the transceiver mode, data present at the high impedance port may be stored in either the A or B register, or in both. Select controls can multiplex stored and real-time (transparent mode) data. The direction control determines which bus will receive data when the enable control G is Active LOW. In the isolation mode (enable control G HIGH), A data may be stored in the B register and/or B data may be stored in the A register. The outputs are designed with a power-off disable feature to allow for live insertion of boards. Pin Configurations Functional Block Diagram G QSOP Top View DIR CPBA SBA CPAB 1 24 SAB 2 23 VCC CPBA CPAB DIR 3 22 SBA SAB A1 4 21 G A2 5 20 B1 A3 6 19 B2 A4 7 18 B3 A5 8 17 B4 A6 9 16 B5 A7 10 B6 A8 11 15 14 GND 12 13 B8 D C A1 B1 B7 FCT2646T FCT2646T­3 D C Logic Block Diagram A1 CPAB SAB DIR TO 7 OTHER CHANNELS A2 A3 A4 A5 A6 A7 A8 B2 B3 B4 B5 B6 B7 B8 CPBA FCT2646T FCT2646T­1 SBA G B1 FCT2646T FCT2646T­4 Cypress Semiconductor Corporation · 3901 North First Street · San Jose · CA 95134 · 408-943-2600 September 1994 ­ Revised March 17, 1997 CY74FCT2646T CY74FCT2646T Pin Description Name Description A Data Register A Inputs, Data Register B Outputs B Data Register B Inputs, Data Register A Outputs CPAB, CPBA Clock Pulse Inputs SAB, SBA Output Data Source Select Inputs DIR, G Output Enable Inputs BUS A DIR L BUS B G L CPAB X CPBA X SAB X BUS A SBA X DIR H BUS B G L Real-Time Transfer Bus B to Bus A BUS B G L L H CPAB CPBA X X CPBA X SAB L SBA X Real-Time Transfer Bus A to Bus B BUS A DIR H L X CPAB X SAB X X X BUS A SBA X X X DIR [1] L H Storage from A and/or B BUS A G L L CPAB X H or L CPBA H or L X Transfer Stored Data to A and/or B Note: 1. Cannot transfer data to A bus and B bus simultaneously. 2 SAB X H SBA H X CY74FCT2646T CY74FCT2646T Function Table[2] Data I/O[3] Inputs Operation or Function G DIR CPAB CPBA SAB SBA A1 thru A8 B1 thru B8 H H X X H or L H or L X X X X Input Input Isolation Store A and B Data L L L L X X X H or L X X L H Output Input Real Time B Data to A Bus Stored B Data to A Bus L L H H X H or L X X L H X X Input Output Real Time A Data to B Bus Stored A Data to B Bus Maximum Ratings[4, 5] FCT2646T FCT2646T DC Output Current (Maximum Sink Current/Pin) . 120 mA Power Dissipation. 0.5W (Above which the useful life may be impaired. For user guidelines, not tested.) Storage Temperature . ­65°C to +150°C Static Discharge Voltage . >2001V (per MIL-STD-883 MIL-STD-883, Method 3015) Ambient Temperature with Power Applied. ­65°C to +135°C Operating Range Supply Voltage to Ground Potential . ­0.5V to +7.0V Range DC Input Voltage. ­0.5V to +7.0V Commercial Ambient Temperature VCC ­40°C to +85°C 5V ± 5% DC Output Voltage . ­0.5V to +7.0V Electrical Characteristics Over the Operating Range Parameter Description Test Conditions Min. Typ[6] 2.4 3.3 VOH Output HIGH Voltage VCC=Min., IOH=­15 mA VOL Output LOW Voltage VCC=Min., IOL=12 mA ROUT Output Resistance VCC=Min., IOL=12 mA VIH Input HIGH Voltage VIL Input LOW Voltage VH Hysteresis[7] All inputs 0.2 VIK Input Clamp Diode Voltage VCC=Min., IIN=­18 mA ­0.7 IIH Input HIGH Current IIH Input HIGH Current VCC=Max., VIN=VCC VCC=Max., VIN=2.7V IIL Input LOW Current VCC=Max., VIN=0.5V IOS Output Short Circuit Current[8] IOFF Power-Off Disable VCC=Max., VOUT=0.0V VCC=0V, VOUT=4.5V Max. Unit V 0.3 20 0.55 V 25 40 2.0 V 0.8 V V ­1.2 V 5 µA ±1 µA ±1 ­60 ­120 µA ­225 mA ±1 µA Notes: 2. H = HIGH Voltage Level. L = LOW Voltage Level. X = Don't Care. 3. The data output functions may be enabled or disabled by various signals at the G or DIR inputs. Data input functions are always enabled, i.e., data at the bus pins will be stored on every LOW-to-HIGH transition of the clock inputs. 4. Unless otherwise noted, these limits are over the operating free-air temperature range. 5. Unused inputs must always be connected to an appropriate logic voltage level, preferably either V CC or ground. 6. Typical values are at V CC=5.0V, TA=+25°C ambient. 7. This parameter is guaranteed but not tested. 8. Not more than one output should be shorted at a time. Duration of short should not exceed one second. The use of high-speed test apparatus and/or sample and hold techniques are preferable in order to minimize internal chip heating and more accurately reflect operational values. Otherwise prolonged shorting of a high output may raise the chip temperature well above normal and thereby cause invalid readings in other parametric tests. In any sequence of parameter tests, IOS tests should be performed last. 3 CY74FCT2646T CY74FCT2646T Capacitance[7] Parameter Typ.[6] Description Max. Unit CIN Input Capacitance 6 10 pF COUT Output Capacitance 8 12 pF Power Supply Characteristics Parameter Description Test Conditions Typ.[6] Max. Unit ICC Quiescent Power Supply Current VCC=Max., VIN0.2V, VINVCC­0.2V 0.1 0.2 mA ICC Quiescent Power Supply Current (TTL inputs HIGH) VCC=Max., VIN=3.4V,[9] f1=0, Outputs Open 0.5 2.0 mA ICCD Dynamic Power Supply Current[10] VCC=Max., One Input Toggling, 50% Duty Cycle, Outputs Open, G=DIR=GND, GAB=GBA=GND, VIN0.2V or VINVCC­0.2V 0.06 0.12 mA/ MHz IC Total Power Supply Current[11] VCC=Max., f0=10 MHz, 50% Duty Cycle, Outputs Open, One Bit Toggling at f1=5 MHz, G=DIR=GND, GAB=GBA=GND, VIN0.2V or VINVCC­0.2V 0.7 1.4 mA VCC=Max., f0=10 MHz, 50% Duty Cycle, Outputs Open, One Bit Toggling at f1=5 MHz, G=DIR=GND, GAB=GBA=GND, VIN=3.4V or VIN=GND 1.2 3.4 mA VCC=Max., f0=10 MHz, 50% Duty Cycle, Outputs Open, Eight Bits Toggling at f 1=5 MHz, G=DIR=GND, GAB=GBA=GND, VIN0.2V or VINVCC­0.2V 2.8 5.6[12] mA VCC=Max., f0=10 MHz, 50% Duty Cycle, Outputs Open, Eight Bits Toggling at f 1=5 MHz, G=DIR=GND, GAB=GBA=GND, VIN=3.4V or VIN=GND 5.1 14.6[12] mA Notes: 9. Per TTL driven input (VIN=3.4V); all other inputs at VCC or GND. 10. This parameter is not directly testable, but is derived for use in Total Power Supply calculations. 11. IC = IQUIESCENT + IINPUTS + IDYNAMIC IC = ICC+I CCDHNT+ICCD(f0/2 + f1N1) ICC = Quiescent Current with CMOS input levels ICC = Power Supply Current for a TTL HIGH input (VIN=3.4V) = Duty Cycle for TTL inputs HIGH DH NT = Number of TTL inputs at DH ICCD = Dynamic Current caused by an input transition pair (HLH or LHL) f0 = Clock frequency for registered devices, otherwise zero = Input signal frequency f1 N1 = Number of inputs changing at f1 All currents are in milliamps and all frequencies are in megahertz. 12. Values for these conditions are examples of the ICC formula. These limits are guaranteed but not tested. 4 CY74FCT2646T CY74FCT2646T Switching Characteristics Over the Operating Range[13] CY74FCT2646AT CY74FCT2646AT Parameter CY74FCT2646CT CY74FCT2646CT Min. Description Max. Min. Max. Unit Fig. No.[14] tPLH tPHL Propagation Delay Bus to Bus 1.5 6.3 1.5 5.4 ns 1, 3 tPZH tPZL Output Enable Time Enable to Bus and DIR to An or Bn 1.5 9.8 1.5 7.8 ns 1, 7, 8 tPHZ tPLZ Output Disable Time G to Bus and DIR to Bus 1.5 6.3 1.5 6.3 ns 1, 7, 8 tPLH tPHL Propagation Delay Clock to Bus 1.5 6.3 1.5 5.7 ns 1, 5 tPLH tPHL Propagation Delay SBA or SAB to A or B 1.5 7.7 1.5 6.2 ns 1, 5 tS Set-Up Time HIGH or LOW, Bus to Clock 2.0 2.0 ns 4 tH Hold Time HIGH or LOW, Bus to Clock 1.5 1.5 ns 4 tW Pulse Width,[7] HIGH or LOW 5.0 5.0 ns 5 Notes: 13. Minimum limits are guaranteed but not tested on Propagation Delays. 14. See "Parameter Measurement Information" in the General Information section. Ordering Information Speed (ns) Ordering Code Package Name Package Type Operating Range 5.4 CY74FCT2646CTQC CY74FCT2646CTQC Q13 24-Lead (150-Mil) QSOP Commercial 6.3 CY74FCT2646ATQC CY74FCT2646ATQC Q13 24-Lead (150-Mil) QSOP Commercial Document #: 38-00599 5 CY74FCT2646T CY74FCT2646T Package Diagrams 24-Lead Quarter Size Outline Q13 © Cypress Semiconductor Corporation, 1997. The information contained herein is subject to change without notice. Cypress Semiconductor Corporation assumes no responsibility for the use of any circuitry other than circuitry embodied in a Cypress Semiconductor product. Nor does it convey or imply any license under patent or other rights. Cypress Semiconductor does not authorize its products for use as critical components in life-support systems where a malfunction or failure may reasonably be expected to result in significant injury to the user. The inclusion of Cypress Semiconductor products in life-support systems application implies that the manufacturer assumes all risk of such use and in doing so indemnifies Cypress Semiconductor against all charges.