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CP-32-4 Datasheet

Part Manufacturer Description PDF Type
CP324 Central Semiconductor Chip Form: N-CHANNEL MOSFET Original
CP324MRS N/A Original

CP-32-4

Catalog Datasheet MFG & Type PDF Document Tags

2N7002

Abstract: CP324 PROCESS CP324 Small Signal MOSFET Transistor N- Channel Enhancement-Mode Transistor Chip PROCESS DETAILS Process EPITAXIAL PLANAR Die Size 21.65 x 21.65 MILS Die Thickness 9.0 MILS Gate Bonding Pad Area 5.5 x 5.5 MILS Source Bonding Pad Area 5.9 x 13.8 MILS Top Side Metalization Al - 30,000Å Back Side Metalization Au - 12,000Å GEOMETRY GROSS DIE PER , . c e n t r a l s e m i . c o m PROCESS CP324 Typical Electrical Characteristics R3 (22
-
Original
2N7002

20EB

Abstract: mm × 7 mm (CP-32-4) 1 2 Airflow Velocity (m/s) 0 1.0 2.0 JA1, 2 TBD TBD TBD JC1, 3 TBD , -Lead Lead Frame Chip Scale Packag] 5 mm ×5 mm Body, Very Thin Quad (CP-32-4) Dimensions shown in millimeters , Evaluation Board Evaluation Board Package Option CP-32-4 CP-32-4 CP-32-4 CP-32-4 CP-32-4 CP-32-4 CP-32-4 CP-32-4 Z = Pb-free part. The exposed paddle (Pin 0) is the only GND connection on the chip and
Analog Devices
Original
20EB 20MSPS 80MSPS AD9266 MO-220-VHHD-2 AD9266BCPZ-801 AD9266BCPZRL7

ny transistor mosfet

Abstract: Bonding PROCESS CP324 Small Signal MOSFET Transistor N - Channel Enhancement-Mode Transistor Chip Central TM Semiconductor Corp. PROCESS DETAILS Process EPITAXIAL PLANAR Die Size 21.65 x 21.65 MILS Die Thickness 9.0 MILS Gate Bonding Pad Area 5.5 x 5.5 MILS Source Bonding Pad Area 5.9 x 13.8 MILS Top Side Metalization Al - 30,000Å Back Side Metalization , 11788 USA Tel: (631) 435-1110 Fax: (631) 435-1824 www.centralsemi.com PROCESS CP324 Typical
Central Semiconductor
Original
ny transistor mosfet Bonding chip die transistor

CP324

Abstract: 2n7002 12 Central PROCESS TM Semiconductor Corp. CP324 Small Signal MOSFET Transistor N - Channel Enhancement-Mode Transistor Chip PROCESS DETAILS Process EPITAXIAL PLANAR Die Size 21.65 x 21.65 MILS Die Thickness 9.0 MILS Gate Bonding Pad Area 5.5 x 5.5 MILS Source Bonding Pad Area 5.9 x 13.8 MILS Top Side Metalization Al - 30,000Å Back Side Metalization , 11788 USA Tel: (631) 435-1110 Fax: (631) 435-1824 www.centralsemi.com PROCESS CP324 Typical
Central Semiconductor
Original
2n7002 12 2N7002 equivalent

CP592

Abstract: cmkt5088 KT2907A CM KT3904 CMKT3906 CMKT3946 CMKT5078 CMKT5087 CMKT5088 CMLD6263 CP324 CPD41 CP705 CP305 C PZ18 , CM PT6428 CP324 CPD 48 CP305 CP705 CP191/CP591 CP191 CP591 CP192 CP592 CP192/CP592 CP188/CP588 , CP324 CP191/CP591 CP191 CP591 CP192 CP592 CP192/CP592 CP Z18 CP Z18 CP Z19 C PZ19 CP108 CP191 CP591
-
OCR Scan
HD3595 KT2207 z2l4 cmhd3595 ut3906 PTA44 LT2222 BAS56 BCX51 BCX53 BCX54 BZX84C2V4 BZX84C6V2

32-Lead Lead Frame Chip Scale Package LFCSP_VQ

Abstract: jedec package MO-220 32-Lead Lead Frame Chip Scale Package [LFCSP_VQ] 5 x 5 mm Body, Very Thin Quad (CP-32-4) Dimensions shown in millimeters a 0.60 MAX 5.00 BSC SQ 0.60 MAX 25 24 PIN 1 INDICATOR TOP VIEW 0.50 BSC 4.75 BSC SQ 0.50 0.40 0.30 12° MAX 1.00 0.85 0.80 17 16 3.65 3.50 SQ 3.35 9 8 0.25 MIN 3.50 REF 0.80 MAX 0.65 TYP 0.30 0.23 0.18 PIN 1 INDICATOR 1 EXPOSED PAD (BOTTOM VIEW) 0.05 MAX 0.02 NOM SEATING PLANE 32 0.20 REF
-
Original
32-Lead Lead Frame Chip Scale Package LFCSP_VQ jedec package MO-220 32-lead LFCSP_VQ lead frame

CP588V

Abstract: CPD76 CP310 CP314 CP315 CP316 CP317 CP318 CP324 CP355 CP392 CP588 CP591 CP592 CP705 CP709 CP710 , CP316V CP317V CP318V CP324V CP355V CP392V CP588V CP591V CP592V CP705V CP709V CP710V CP716V
Central Semiconductor
Original
CPD48 CPD76 CPD80 CPD91 CPD92 CPD96 CP-392V CP792 CP188 CPD78 CPD83 CPD88
Abstract: . CP323 . CP324 -
OCR Scan
CP117 CP147 CP176 CP195 CP206 CP207

soundmax integrated digital audio

Abstract: d1729 Package [LFCSP_VQ] 5 mm × 5 mm Body, Very Thin Quad (CP-32-4) Dimensions shown in millimeters , 15 of 16 Package Option CP-32-4 CP-32-4 AD1983 NOTES ©2006 Analog Devices, Inc. All
Analog Devices
Original
soundmax integrated digital audio d1729 ga 15 engine diagram spdif jack pin out 24-BIT AD1983JCPZ1 AD1983JCPZ-REEL1 D05205-0-4/06
Abstract: mmhos PF pF PF ns ns V For Typical Electrical Characteristic Data for this Device Process CP324 -
OCR Scan
CMXDM7002A
Abstract: Electrical Characteristic Data for this device, please see Process CP324 on page 849. R1 (20-February 2003 -
OCR Scan
CMPDM7002A C702A
Abstract: Frame Chip Scale Package [LFCSP_VQ] 5 mm × 5 mm Body, Very Thin Quad (CP-32-4) Dimensions shown in , part. Rev. 0 | Page 15 of 16 Package Option CP-32-4 CP-32-4 AD1983 NOTES ©2006 Analog Analog Devices
Original

ad9649 evaluation

Abstract: 957D ns V For Typical Electrical Characteristic Data for this device, please see Process CP324 on page
Analog Devices
Original
ad9649 evaluation 957D smart antenna CSB350 AD9649-40EBZ AD9649 AD9649BCPZ-651 AD9649BCPZRL7-651 AD9649BCPZ-401 AD9649BCPZRL7-401 AD9649BCPZ-201

AD9629

Abstract: AD9629-65 Process CP324 on page 849. R3 (26-September 2002) 90 Central TM 2N7002 N-CHANNEL
Analog Devices
Original
AD9629 AD9629-65 ad9629bcpz-40 AD9609 MSPS/40 MSPS/65 MSPS/80 CDMA2000 AD9629BCPZ-80

S 170 MOSFET TRANSISTOR

Abstract: device, please see Process CP324 on page 849. R3 (19-December 2003) 274 Central Semiconductor
-
OCR Scan
S 170 MOSFET TRANSISTOR 250MA

702 TRANSISTOR sot-23

Abstract: 702 sot 23 for this Device Process CP324, Please See Page 801. R3 (26-September 2002) Central
-
OCR Scan
702 TRANSISTOR sot-23 702 sot 23 sot 23 transistor 70.2 MARKING CODE 702 702 mosfet Sot-23 MARKING 702

S 170 MOSFET TRANSISTOR

Abstract: TRANSISTOR MARKING CODE ss off VSD For Typical Electrical Characteristic Data for this Device Process CP324, Please See Page
-
OCR Scan
TRANSISTOR MARKING CODE ss sps transistor SPS MARKING CODE diode marking code ej S 170 TRANSISTOR CMLDM7002A CMLDM7002AJ

702 TRANSISTOR sot-23

Abstract: marking code 702 SOT23 Central PROCESS TM Semiconductor Corp. CP324 Small Signal MOSFET Transistor N - Channel Enhancement-Mode Transistor Chip PROCESS DETAILS Process EPITAXIAL PLANAR Die Size 21.65 x 21.65 MILS Die Thickness 9.0 MILS Gate Bonding Pad Area 5.5 x 5.5 MILS Source Bonding Pad Area 5.9 x 13.8 MILS Top Side Metalization Al - 30,000Å Back Side Metalization , 11788 USA Tel: (631) 435-1110 Fax: (631) 435-1824 www.centralsemi.com PROCESS CP324 Typical
-
OCR Scan
marking code 702 SOT23 sot-23 MARKING CODE 70.2 marking 702 sot23 marking code SS SOT23 MOSFET DRIVER code 702 marking code SS SOT23 transistor

S 170 MOSFET TRANSISTOR

Abstract: (CP-32-4) Dimensions shown in millimeters ORDERING GUIDE Model 1 AD8120ACPZ-R2 AD8120ACPZ-R7 , respective owners. D07839-0-5/12(A) Rev. A | Page 16 of 16 Package Option CP-32-4 CP-32-4 CP-32-4
-
OCR Scan

AD951x

Abstract: LIDAR adc Package [LFCSP_VQ] 5 mm × 5 mm Body, Very Thin Quad (CP-32-4) Dimensions shown in millimeters , 15 of 16 Package Option CP-32-4 CP-32-4 AD1983 NOTES ©2006 Analog Devices, Inc. All
Analog Devices
Original
AD951x LIDAR adc AD9609BCPZ-801 AD9609BCPZRL7-801 AD9609BCPZ-651 AD9609BCPZRL7-651 AD9609BCPZ-401 AD9609BCPZRL7-401
Abstract: mm Body, Very Thin Quad (CP-32-4) Dimensions shown in millimeters 5.00 BSC SQ 0.60 MAX 0.60 MAX , , Waffle Pack Evaluation Board Package Option CP-32-4 CP-32-4 Z = RoHS Compliant Part/Evaluation Analog Devices
Original
AD9609BCPZ-80 AD9609BCPZ-201 AD9609BCPZRL7-201 AD9609-80EBZ1 AD9609-65EBZ1 AD9609-40EBZ1
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